TMS37145 www.ti.com SCBS879 – MAY 2012 DIGITAL SIGNATURE TRANSPONDER WITH INTEGRATED DST80 AUTHENTICATION, EEPROM, AND LF IMMOBILIZER Check for Samples: TMS37145 FEATURES 1 • Low-Frequency (LF) Immobilizer Interface – 75-Byte EEPROM – 80-Bit DST80 Security Authentication Coprocessor – Integrated Batteryless Immobilizer Interface – Half Duplex (HDX) Immobilizer Communication Achieves up to 4-in (10-cm) Read Range – Special Selective Addressing Mode Allows Reliable Learn-In Sequence – 80-Bit Authentication Key Length – Up to 8-kbit/s Uplink Data Rate – 5-/3-Byte Challenge/Response Algorithm – Fast Authentication Within 42 ms – Fast Mutual Authentication Within 65 ms – 75-Byte EEPROM – 48-Byte Available EEPROM User Memory – 32-Bit Unique Serial Number – High EEPROM Security and Flexibility – Write-Only Authentication Keys – Pages Are Irreversibly Lockable and Protectable – Protected Pages Programmable Only Through Mutual Authentication – Each User Page is Lockable – Resonant Frequency: 134.2 kHz DESCRIPTION This new generation of security RFID transponder provides the highest level of security with its integrated 80-bit encryption algorithm. The 5-byte challenge and 3-byte response algorithm is backward compatible with existing TI products and provides, together with the burst length coding, short encryption telegram times. The DST80 offers 65 bytes of free programmable user data stored in nine pages, each of them lockable for programming. Each of the two 80-bit encryption keys with can be programmed with a single telegram. The DST80 comes in two versions, preprogrammed with either PWM or PPM communication formats, eliminating the need for the user to change this field. Ordering Information (1) TA -40°C to 85°C (1) (2) PACKAGE (2) Wedge COMMUNICATION FORMAT ORDERABLE PART NUMBER PWM TMS37145TEAIE PPM TMS37145TEAIEG For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. WEDGE PACKAGE 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TMS37145 SCBS879 – MAY 2012 www.ti.com Operating Characteristics Part Number TMS37145TEAIE, TMS37145TEAIEG Features Immobilizer plus microcontroller with integrated power management DST80 authentication logic 80-bit key length, 4-byte or 5-byte challenge, 3-byte signature DST80 encryption time Mutual authentication: 65 ms Fast authentication: 42 ms Transponder Transmission principle HDX (half duplex telegram protocol) Operating frequency 134.2 kHz Integrated resonant frequency trimming capability via LF or test interface Security Challenge/response, mutual authentication Downlink 100% AM, PPM bit coding with 2 kbit/s (typ) Uplink FSK modulation with 7.9 kbit/s (typ) Read time for an encryption PPM: 60 ms (typ) (including 20-ms charge time) Read time for mutual authentication PPM: 85 ms (typ) (including 20-ms charge time) Protocol transmission security 16-bit block check character Activation field strength 141.5 dBµA/m Minimum required operation Q-factor 30 EEPROM memory 75 bytes EEPROM endurance 200 000 (min) write-erase cycles (TA = 25°C) Key learn-in Special selective addressing to provide secure learn-in procedure Storage temperature -40°C to 100°C (175°C for 5 minutes) Operating temperature -40°C to 85°C Case material Plastic Protection class IP 68 EMC Programmed code is not affected by natural electromagnetic interference or X-rays Mechanical shock IEC 68-2-27, Test Ea; 200 g, half sine, 3 ms, 6 shocks per axis Vibration IEC 68-2-6, Test Fc; 10 to 500 Hz, 1.65 mm peak to peak, 10 g, 4 hours per axis Dimensions 12.0 mm ± 0.2 mm x 6.0 mm ± 0.2 mm x 3.0 mm ± 0.05 mm Weight 0.4 g Packaging Bulk (2000 units per box) 48-byte free available EEPROM user memory 32-bit unique serial number Two 80-bit security keys 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37145 TMS37145 www.ti.com SCBS879 – MAY 2012 MECHANICAL DATA Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37145 3 PACKAGE OPTION ADDENDUM www.ti.com 30-May-2012 PACKAGING INFORMATION Orderable Device TMS37145TEAIE Status (1) ACTIVE Package Type Package Drawing RFIDP TEA Pins 0 Package Qty Eco Plan (2) Pb-Free (RoHS) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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