Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2525DW GENERAL DESCRIPTION New generation, high-voltage, high-speed switching npn transistor with integrated damper diode in a plastic envelope intended for use in horizontal deflection circuits of large screen colour television receivers up to 32 kHz. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS VCESM Collector-emitter voltage peak value VBE = 0 VCEO Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Storage time IC ICM Ptot VCEsat ICsat ts PINNING - SOT429 PIN ICsat = 8.0 A; IB(end) = 1.1 A PIN CONFIGURATION MAX. UNIT - 1500 V - 800 V 8 3.0 12 30 125 5.0 4.0 A A W V A µs SYMBOL DESCRIPTION 1 base 2 collector 3 emitter tab Tmb ≤ 25 ˚C IC = 8.0 A; IB = 1.6 A TYP. collector c b Rbe 2 1 e 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature VBE = 0 V average over any 20 ms period Tmb ≤ 25 ˚C MIN. MAX. UNIT -65 - 1500 800 12 30 8 12 200 9 125 150 150 V V A A A A mA A W ˚C ˚C TYP. MAX. UNIT - 1.0 K/W 45 - K/W THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-mb Junction to mounting base - Rth j-a Junction to ambient in free air 1 Turn-off current. September 1997 1 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2525DW STATIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS 2 ICES ICES Collector cut-off current IEBO REB BVEBO VCEOsust Emitter cut-off current Base-emitter resistance Emitter-base breakdown voltage Collector emitter-sustaining voltage VCEsat VBEsat hFE hFE VF Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Diode forward voltage VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 ˚C VEB = 6.0 V; IC = 0 A VEB = 6.0 V IB = 600 mA IB = 0A;IC = 100mA; L= 25 mH IC = 8.0 A; IB = 1.6 A IC = 8.0 A; IB = 1.6 A IC = 1 A; VCE = 5 V IC = 8 A; VCE = 5 V IF = 8 A MIN. TYP. MAX. UNIT - - 1.0 2.0 mA mA 72 7.5 800 110 55 13.5 - 218 - mA Ω V V 5 11 7 1.6 5.0 1.1 9.5 2.0 V V V DYNAMIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT Cc Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz 145 - pF Switching times (32 kHz line deflection circuit) ICsat = 8.0 A; LC = 260 µH; Cfb = 13 nF; IB(end) = 1.1 A; LB = 2.5 µH; -VBB = 4 V; (-dIB/dt = 1.6 A/µs) 3.0 0.2 4.0 0.35 µs µs ts tf Turn-off storage time Turn-off fall time Vfr Anti-parallel diode forward recovery voltage Anti-parallel diode forward recovery time tfr TRANSISTOR IF = 8 A; dIF/dt = 50 A/µs 16 V VF = 5 V 410 ns ICsat ICsat 90 % IC DIODE t IC IBend IB 10 % tf t 10us t ts 13us IB IBend 32us t VCE - IBM t Fig.1. Switching times waveforms. Fig.2. Switching times definitions. 2 Measured with half sine-wave voltage (curve tracer). September 1997 2 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor I I F BU2525DW 1.2 F VBESAT / V BU2525A Tj = 25 C 1.1 Tj = 125 C 1 10% 0.9 time t fr V 0.8 IC/IB= 0.7 F 3 0.6 V 5V V fr 4 0.5 F 5 0.4 0.1 1 IC / A time Fig.3. Definition of anti-parallel diode Vfr and tfr 10 Fig.6. Typical base-emitter saturation voltage. VBEsat = f (IC); parameter IC/IB + 150 v nominal adjust for ICsat 1 VCESAT / V BU2525A IC/IB = 0.9 5 0.8 4 0.7 Lc 3 0.6 0.5 Tj = 25 C 0.4 D.U.T. Tj = 125 C 0.3 LB IBend Cfb 0.2 0.1 -VBB Rbe 0 0.1 10 1 100 IC / A Fig.4. Switching times test circuit hFE Fig.7. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB BU2525D 1.2 100 VBESAT / V BU2525A Tj = 25 C Tj = 25 C Tj = 125 C 5V Tj = 125 C 1.1 1 0.9 10 IC= 1V 0.8 8A 6A 5A 4A 0.7 1 0.1 0.6 1 10 0 100 IC / A Fig.5. Typical DC current gain. hFE = f (IC) parameter VCE September 1997 1 2 IB / A 3 4 Fig.8. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC 3 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor VCESAT / V 10 BU2525DW BU2525A Tj = 25 C 110 Tj = 125 C 100 90 Normalised Power Derating PD% 120 80 70 8A 60 50 1 6A 40 5A 30 IC = 4 A 20 10 0 0.1 0.1 1 IB / A 0 10 Eoff / uJ 40 60 80 100 Tmb / C 120 140 Fig.12. Normalised power dissipation. PD% = 100⋅PD/PD 25˚C = f (Tmb) Fig.9. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC 1000 20 BU2525A 10 Zth / (K/W) BU2525A IC = 8 A 1 0.5 7A 100 0.1 0.2 0.1 0.05 0.02 PD 0.01 D=0 0.001 1E-06 10 0.1 1 IB / A 10 Fig.10. Typical turn-off losses. Tj = 85˚C Eoff = f (IB); parameter IC; f = 32 kHz 12 11 10 9 8 7 6 5 4 3 2 1 0 ts, tf / us tp D= t T 1E-04 1E-02 t/s tp T 1E+00 Fig.13. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T BU2525A 32 kHz ts IC = 8A 7A 0.1 1 IB / A tf 10 Fig.11. Typical collector storage and fall time. ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C; f = 32 kHz September 1997 4 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor IC / A BU2525DW BU2525A 100 tp = = 0.01 ICM 40 us ICDC 10 100 us Ptot 1 1 ms 10 ms 0.1 DC 0.01 1 10 100 1000 VCE / V Fig.14. Forward bias safe operating area. Tmb = 25 ˚C ICDC & ICM = f(VCE); ICM single pulse; parameter tp; Second-breakdown limits independant of temperature. September 1997 5 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2525DW MECHANICAL DATA Dimensions in mm 5.3 max 16 max 1.8 Net Mass: 5 g 5.3 o 3.5 max 7.3 3.5 21 max 15.5 max seating plane 2.5 15.5 min 4.0 max 1 2 3 0.9 max 2.2 max 1.1 3.2 max 5.45 0.4 M 5.45 Fig.15. SOT429; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT429 envelope. 2. Epoxy meets UL94 V0 at 1/8". September 1997 6 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2525DW DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Rev 1.100