Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2508DW GENERAL DESCRIPTION Enhanced performance, new generation, high-voltage, high-speed switching npn transistor with an integrated damper diode in a plastic envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS VCESM VCEO IC ICM Ptot VCEsat ICsat VF tf Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Diode forward voltage Fall time VBE = 0 V PINNING - SOT429 PIN PIN CONFIGURATION MAX. UNIT 4.5 1.6 0.4 1500 700 8 15 125 1.0 2.0 0.6 V V A A W V A V µs SYMBOL DESCRIPTION 1 base 2 collector 3 emitter tab Tmb ≤ 25 ˚C IC = 4.5 A; IB = 1.12 A f=16kHz IF = 4.5 A ICsat = 4.5 A; f=16kHz TYP. collector c b Rbe 2 1 e 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature VBE = 0 V average over any 20 ms period Tmb ≤ 25 ˚C MIN. MAX. UNIT -65 - 1500 700 8 15 4 6 100 5 125 150 150 V V A A A A mA A W ˚C ˚C TYP. MAX. UNIT - 1.0 K/W 45 - K/W THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-mb Junction to mounting base - Rth j-a Junction to ambient in free air 1 Turn-off current. September 1997 1 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2508DW STATIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS 2 ICES ICES Collector cut-off current IEBO BVEBO Rbe VCEOsust Emitter cut-off current Emitter-base breakdown voltage Base-emitter resistance Collector-emitter sustaining voltage VCEsat VBEsat hFE hFE VF Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Diode forward voltage VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 ˚C VEB = 7.5 V; IC = 0 A IB = 600 mA VEB = 7.5 V IB = 0 A; IC = 100 mA; L = 25 mH IC = 4.5 A; IB = 1.12 A IC = 4.5 A; IB = 1.7 A IC = 1 A; VCE = 5 V IC = 4.5 A; VCE = 1 V IF = 4.5 A MIN. TYP. MAX. UNIT - - 1.0 2.0 mA mA 140 7.5 700 13.5 33 - 390 - mA V Ω V 4 - 13 5.5 1.6 1.0 1.1 7.0 2.0 V V TYP. MAX. UNIT 80 - pF 5.0 0.4 6.0 0.6 µs µs 4.7 0.25 5.7 0.35 µs µs V DYNAMIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Cc Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz ts tf Switching times (16 kHz line deflection circuit) Turn-off storage time Turn-off fall time ICsat = 4.5 A; IB(end) = 1.1 A; LB = 6 µH; -VBB = 4 V; (-dIB/dt = 0.6 A/µs) ts tf Switching times (38 kHz line deflection circuit) Turn-off storage time Turn-off fall time ICsat = 4.0 A; IB(end) = 0.9 A; LB = 6 µH; -VBB = 4 V; (-dIB/dt = 0.6 A/µs) TRANSISTOR IC ICsat ICsat 90 % DIODE t IC IBend IB 10 % tf t 20us t ts 26us IB IBend 64us t VCE - IBM t Fig.1. Switching times waveforms. Fig.2. Switching times definitions. 2 Measured with half sine-wave voltage (curve tracer). September 1997 2 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2508DW + 150 v nominal adjust for ICsat 1 VCESAT / V BU2508D IC/IB= 5 4 3 0.9 0.8 0.7 1mH 0.6 0.5 LB IBend Tj = 125 C 0.3 12nF 0.2 0.1 -VBB Rbe 0 Fig.3. Switching times test circuit. 100 Tj = 25 C 0.4 D.U.T. h FE 0.1 1 IC / A 10 Fig.6. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB BU2508D 1.2 VBESAT / V BU2508D Tj = 25 C 1.1 Tj = 25 C Tj = 125 C 5V Tj = 125 C 1 10 0.9 IC= 6A 4.5A 3A 2A 0.8 1V 0.7 1 0.01 0.1 0.6 10 1 0 1 2 IB / A IC / A Fig.4. Typical DC current gain. hFE = f (IC) parameter VCE 1.2 VBESAT / V 4 Fig.7. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC BU2508D 10 VCESAT / V BU2508D Tj = 25 C Tj = 25 C 1.1 3 Tj = 125 C Tj = 125 C 1 6A 0.9 4.5A 0.8 1 IC/IB= 3 0.7 3A 4 0.6 5 IC=2A 0.5 0.4 0.1 1 IC / A 0.1 10 Fig.5. Typical base-emitter saturation voltage. VBEsat = f (IC); parameter IC/IB September 1997 0.1 1 IB / A 10 Fig.8. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC 3 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor Eoff / uJ 1000 BU2508DW BU2508D Zth / (K/W) 10 IC = 4.5A 3.5A 1 0.5 100 0.2 0.1 0.05 0.02 D=0 0.1 PD tp D= t T 10 0.1 1 IB / A 0.01 1E-06 10 1E-02 1E+00 t/s Fig.11. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T Fig.9. Typical turn-off losses. Tj = 85˚C Eoff = f (IB); parameter IC; f = 16 kHz 12 11 10 9 8 7 6 5 4 3 2 1 0 1E-04 tp T ts, tf / us BU2508D 120 Normalised Power Derating PD% 110 ts 100 90 80 70 60 50 IC = 40 4.5A 30 3.5A 20 10 tf 0.1 1 IB / A 0 10 0 Fig.10. Typical collector storage and fall time. ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C; f = 16 kHz September 1997 20 40 60 80 100 Tmb / C 120 140 Fig.12. Normalised power dissipation. PD% = 100⋅PD/PD 25˚C = f (Tmb) 4 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor 100 BU2508DW IC / A = 0.01 ICM max tp = IC max 10 (1) II 5 us 10 20 I 50 1 100 200 500 (2) 0.1 1 ms 2 5 10 20 DC 0.01 1 10 1000 100 VCE / V Fig.13. Forward bias safe operating area. Tmb = 25˚C (1) Ptot max line. (2) Second-breakdown limits (independent of temperature). I Region of DC operation. II Extension for repetitive pulse operation. September 1997 5 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2508DW MECHANICAL DATA Dimensions in mm 5.3 max 16 max 1.8 Net Mass: 5 g 5.3 o 3.5 max 7.3 3.5 21 max 15.5 max seating plane 2.5 15.5 min 4.0 max 1 2 3 0.9 max 2.2 max 1.1 3.2 max 5.45 0.4 M 5.45 Fig.14. SOT429; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT429 envelope. 2. Epoxy meets UL94 V0 at 1/8". September 1997 6 Rev 1.100 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2508DW DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 7 Rev 1.100