Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- GENERAL DESCRIPTION QUICK REFERENCE DATA N-channel enhancement mode field-effect power transistor in a plastic envelope featuring high avalanche energy capability, stable off-state characteristics, fast switching and high thermal cycling performance with low thermal resistance. Intended for use in Switched Mode Power Supplies (SMPS), motor control circuits and general purpose switching applications. SYMBOL ---------------VDS ID Ptot RDS(ON) PINNING - TO220AB PIN CONFIGURATION PIN DESCRIPTION 1 gate 2 drain 3 source tab PARAMETER MAX. UNIT ------------------------------------------------------- ----------- ----------Drain-source voltage 600 V Drain current (DC) 2.8 A Total power dissipation 83 W Drain-source on-state resistance 4.4 Ω SYMBOL d tab g drain s 1 23 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS ID Continuous drain current IDM PD ∆PD/∆Tmb VGS EAS Pulsed drain current Total dissipation Linear derating factor Gate-source voltage Single pulse avalanche energy Peak avalanche current Tmb = 25 ˚C; VGS = 10 V Tmb = 100 ˚C; VGS = 10 V Tmb = 25 ˚C Tmb = 25 ˚C Tmb > 25 ˚C IAS Tj, Tstg Operating junction and storage temperature range VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; VGS = 10 V VDD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; VGS = 10 V MIN. MAX. UNIT - 2.8 1.8 11 83 0.67 ± 30 84 A A A W W/K V mJ - 2.2 A - 55 150 ˚C THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Thermal resistance junction to mounting base Thermal resistance junction to ambient Rth j-a April 1997 CONDITIONS 1 MIN. TYP. MAX. UNIT - - 1.5 K/W - 60 - K/W Rev 1.001 Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- ELECTRICAL CHARACTERISTICS Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS VGS = 0 V; ID = 0.25 mA 600 - - V ∆V(BR)DSS / ∆Tj RDS(ON) VGS(TO) gfs IDSS Drain-source breakdown voltage Drain-source breakdown voltage temperature coefficient Drain-source on resistance Gate threshold voltage Forward transconductance Drain-source leakage current VDS = VGS; ID = 0.25 mA - 0.7 - V/K IGSS Gate-source leakage current 2.0 0.7 - 4.0 3.0 1.7 1 60 10 4.4 4.0 100 500 200 Ω V S µA µA nA Qg(tot) Qgs Qgd Total gate charge Gate-source charge Gate-drain (Miller) charge ID = 2 A; VDD = 360 V; VGS = 10 V - 25 2 12 30 3 15 nC nC nC td(on) tr td(off) tf Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time VDD = 300 V; ID = 2 A; RG = 18 Ω; RD = 150 Ω - 10 26 66 30 - ns ns ns ns Ld Internal drain inductance - 3.5 - nH Ld Internal drain inductance - 4.5 - nH Ls Internal source inductance Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad - 7.5 - nH Ciss Coss Crss Input capacitance Output capacitance Feedback capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 300 43 25 - pF pF pF MIN. TYP. MAX. UNIT VGS = 10 V; ID = 1.3 A VDS = VGS; ID = 0.25 mA VDS = 30 V; ID = 1.3 A VDS = 600 V; VGS = 0 V VDS = 480 V; VGS = 0 V; Tj = 125 ˚C VGS = ±30 V; VDS = 0 V SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS IS Tmb = 25˚C - - 2.8 A Tmb = 25˚C - - 11 A VSD Continuous source current (body diode) Pulsed source current (body diode) Diode forward voltage IS = 2.2 A; VGS = 0 V - - 1.2 V trr Qrr Reverse recovery time Reverse recovery charge IS = 2 A; VGS = 0 V; dI/dt = 100 A/µs - 500 3 - ns µC ISM April 1997 2 Rev 1.001 Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- Normalised Power Derating PD% 120 10 PHP2N60 Zth j-mb / (K/W) 110 100 90 D= 80 1 70 0.5 0.2 60 50 0.1 40 0.1 30 0.05 PD 0.02 20 10 tp 0 0 20 40 60 80 100 Tmb / C 120 140 1E-05 Fig.1. Normalised power dissipation. PD% = 100⋅PD/PD 25 ˚C = f(Tmb) ID% PHP6N60E 1E-03 t/s tp T t T 0.01 0 D= 1E-01 1E+01 Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T Normalised Current Derating 120 5 100 4 ID, Drain current (Amps) PHP2N60 Tj = 25 C 10 V 6V 80 5.5 V 3 5V 60 2 40 VGS = 4.5 V 1 20 0 0 0 50 Tmb / C 100 150 0 Fig.2. Normalised continuous drain current. ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V 100 10 15 20 25 VDS, Drain-Source voltage (Volts) 30 Fig.5. Typical output characteristics. ID = f(VDS); parameter VGS PHP2N60 ID, Drain current (Amps) 5 RDS(on), Drain-Source on resistance (Ohms) 10 VGS = 4.5 V Tj = 25 C PHP2N60 5V 5.5 V 8 ID S/ 10 )= 6V VD ON S( 6 10 V tp = 10 us RD 4 100 us 1 DC 1 ms 2 10 ms 100 ms 0.1 10 100 1000 VDS, Drain-source voltage (Volts) 0 10000 Fig.3. Safe operating area. Tmb = 25 ˚C ID & IDM = f(VDS); IDM single pulse; parameter tp April 1997 0 1 2 3 ID, Drain current (Amps) 4 5 Fig.6. Typical on-state resistance. RDS(ON) = f(ID); parameter VGS 3 Rev 1.001 Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- 5 VGS(TO) / V PHP2N60 ID, Drain current (Amps) VDS = 30 V Tj = 25 C max. 4 4 typ. 3 3 Tj = 150 C min. 2 2 1 1 0 0 0 2 4 6 VGS, Gate-Source voltage (Volts) 8 -60 10 gfs, Transconductance (S) VDS = 30 V -20 0 20 40 60 Tj / C 80 100 120 140 Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 0.25 mA; VDS = VGS Fig.7. Typical transfer characteristics. ID = f(VGS); parameter Tj 3 -40 PHP2N60 1E-01 2.5 SUB-THRESHOLD CONDUCTION ID / A 1E-02 2 2% 1E-03 typ 98 % 1.5 150 C Tj = 25 C 1E-04 1 1E-05 0.5 0 1E-06 0 1 2 3 ID, Drain current (A) 4 0 5 Fig.8. Typical transconductance. gfs = f(ID); parameter Tj 2 VGS / V 3 4 Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS Normalised RDS(ON) = f(Tj) a 1 1000 PHP2N60 Junction capacitances (pF) Ciss 2 100 Coss 1 10 0 -60 -40 -20 0 20 40 60 Tj / C 80 1 100 120 140 Fig.9. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 2 A; VGS = 10 V April 1997 Crss 1 10 100 VDS, Drain-Source voltage (Volts) 1000 Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz 4 Rev 1.001 Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- 15 PHP2N60 VGS, Gate-Source voltage (Volts) ID = 2.0 A Tj = 25 C 20 VGS = 0 V 240 V 120 V PHP2N60 IF, Source-Drain diode current (Amps) VDD = 360 V 15 10 10 Tj = 25 C 150 C 5 5 0 0 10 20 Qg, Gate charge (nC) 30 0 40 100 PHP2N60 Switching times (ns) 0.5 1 VSDS, Source-Drain voltage (Volts) 1.5 Fig.16. Source-Drain diode characteristic. IF = f(VSDS); parameter Tj Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG); parameter VDS 1000 0 120 VDD = 300 V VGS = 10 V RD = 150 Ohms ID = 2 A Tj = 25 C EAS, Normalised unclamped inductive energy (%) 110 100 90 80 td(off) 70 tf tr 60 50 10 40 td(on) 30 20 10 1 0 10 20 30 40 RG, Gate resistance (Ohms) 50 0 60 20 Fig.14. Typical switching times. td(on), tr, td(off), tf = f(RG) 1.15 40 60 80 100 Starting Tj ( C) 120 140 Fig.17. Normalised unclamped inductive energy. EAS% = f(Tj) Normalised Drain-source breakdown voltage V(BR)DSS @ Tj + V(BR)DSS @ 25 C 1.1 VDD L 1.05 VDS - VGS 1 -ID/100 0 0.95 0.9 0.85 -100 RGS -50 0 50 Tj, Junction temperature (C) 100 R 01 shunt 150 Fig.18. Unclamped inductive test circuit. EAS = 0.5 ⋅ LID2 ⋅ V(BR)DSS /(V(BR)DSS − VDD ) Fig.15. Normalised drain-source breakdown voltage. V(BR)DSS/V(BR)DSS 25 ˚C = f(Tj) April 1997 T.U.T. 5 Rev 1.001 Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.19. TO220AB; pin 2 connected to mounting base. Notes 1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for TO220 envelopes. 3. Epoxy meets UL94 V0 at 1/8". April 1997 6 Rev 1.001 Philips Semiconductors Product specification -------------------------------------------------------------------------------------------------------------PowerMOS transistor PHP2N60 ---------------------------------------------------------------------------------------------------------------------------------------------------------- DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1997 7 Rev 1.001