QL2009 3.3V and 5.0V pASIC 2 FPGA Combining Speed, Density, Low Cost and Flexibility Rev. C pASIC 2 HIGHLIGHTS Ultimate Verilog/VHDL Silicon Solution -Abundant, high-speed interconnect eliminates manual routing -Flexible logic cell provides high efficiency and performance -Design tools produce fast, efficient Verilog/VHDL synthesis Speed, Density, Low Cost and Flexibility in One Device Advanced Logic Cell and I/O Capabilities -Complex functions (up to 16 inputs) in a single logic cell -High synthesis gate utilization from logic cell fragments -Full IEEE Standard JTAG boundary scan capability -Individually-controlled input/feedback registers and OEs on all I/O pins Other Important Family Features -3.3V and 5.0V operation with low standby power -I/O pin-compatibility between different devices in the same packages -PCI compliant (at 5.0V), full speed 33 MHz implementations -High design security provided by security fuses QL2009 Block Diagram 672 Logic Cells 3-35 3 pASIC 2 … 9,000 usable ASIC gates, 225 I/O pins -16-bit counter speeds exceeding 200 MHz -9,000 usable ASIC gates, 16,000 usable PLD gates, 225 I/Os -3-layer metal ViaLink process for small die sizes -100% routable and pin-out maintainable QL2009 PRODUCT SUMMARY The QL2009 is a 9,000 usable ASIC gate,16,000 usable PLD gate member of the pASIC 2 family of FPGAs. pASIC 2 FPGAs employ a unique combination of architecture, technology, and software tools to provide high speed, high usable density, low price, and flexibility in the same devices. The flexibility and speed make pASIC 2 devices an efficient and high performance silicon solution for designs described using HDLs such as Verilog and VHDL, as well as schematics. The QL2009 contains 672 logic cells. With 225 maximum I/Os, the QL2009 is available in 144-pin TQFP, 208-PQFP, and 256-pin PBGA packages. Software support for the complete pASIC families, including the QL2009, is available through three basic packages. The turnkey QuickWorks package provides the most complete FPGA software solution from design entry to logic synthesis (by Synplicity, Inc.), to place and route, to simulation. The QuickToolsTM and QuickChipTM packages provide a solution for designers who use Cadence, Mentor, Synopsys, Viewlogic, Veribest, or other third-party tools for design entry, synthesis, or simulation. FEATURES Total of 225 I/O Pins - 217 bidirectional input/output pins, PCI-compliant at 5.0V in -1/-2 speed grades - 4 high-drive input-only pins - 4 high-drive input/distributed network pins Four Low-Skew (less than 0.5ns) Distributed Networks - Two array networks available to logic cell flip-flop clock, set, and reset - each driven by an input-only pin - Two global clock/control networks available to F1 logic input, and logic cell flip-flop clock, set, reset; input and I/O register clock, reset, enable; and output enable controls - each driven by an input-only pin, or any input or I/O pin, or any logic cell output or I/O cell feedback High Performance - Input + logic cell + output delays under 6 ns - Datapath speeds exceeding 225 MHz - Counter speeds over 200 MHz 3-36 QL2009 PINOUT DIAGRAMS PIN # 109 PIN # 1 144-PIN TQFP 3 pASIC 2 pASIC QL2009-1PF144C PIN # 73 PIN # 37 208-PIN PQFP PIN # 157 PIN # 1 pASIC QL2009-1PQ208C PIN # 105 PIN # 53 3-37 QL2009 PQFP 208 and TQFP 144 Pinout Table 208 144 PQFP TQFP Function 208 144 PQFP TQFP Function 208 144 PQFP TQFP Function 208 144 PQFP TQFP Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 NC 1 2 3 NC 4 5 NC 6 7 NC NC 8 NC 9 NC 10 11 12 13 NC 14 15 16 17 18 19 20 21 22 23 NC 24 NC 25 NC 26 27 28 NC I/O I/O I/O I/O I/O I/O I/O I/O I/O VCC I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I ACLK / I VCC I GCLK / I VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 30 31 NC 32 NC 33 NC 34 35 36 37 38 39 NC 40 NC NC 41 42 43 NC 44 45 NC 46 47 48 NC 49 NC 50 51 52 NC 53 54 55 56 NC 57 GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TDI I/O I/O I/O I/O GND I/O VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O GND I/O I/O I/O I/O 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 60 61 NC 62 63 NC NC 64 NC 65 66 67 NC NC 68 69 NC 70 71 72 NC 73 NC 74 75 76 77 NC 78 79 80 NC 81 82 NC 83 NC 84 85 NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O VCC I/O I/O I/O I/O I/O TRSTB TMS I/O I/O I/O I/O I/O I/O I/O I/O I/O VCC I/O GND I/O I/O I/O I/O I/O I/O I/O I/O 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 87 88 89 90 91 92 93 94 95 NC 96 NC 97 98 NC 99 NC 100 NC 101 102 103 104 NC 105 106 NC 107 NC 108 109 110 111 NC 112 113 NC NC 114 115 GND I/O I ACLK / I VCC I GCLK / I VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCC I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O TCK STM I/O I/O I/O I/O GND I/O VCC I/O 41 42 NC 29 VCC I/O 83 84 58 59 VCC I/O 125 126 86 NC I/O I/O 167 168 116 NC I/O I/O 3-38 208 144 PQFP TQFP 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 117 118 119 120 NC NC 121 NC 122 123 124 NC 125 126 127 128 129 NC 130 131 132 NC 133 134 NC 135 136 NC 137 NC 138 139 NC 140 NC 141 142 NC 143 144 Function I/O I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O GND I/O I/O I/O I/O VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND I/O VCC I/O I/O I/O I/O I/O TDO I/O QL2009 PINOUT DIAGRAM 256-PIN PBGA 3 pASIC 2 pASIC QL2009-1PB256C TOP PIN A1 CORNER 19 17 15 13 11 9 7 5 3 1 A B C D E F G H J K L M N P R T U V W Y BOTTOM 3-39 QL2009 PBGA 256 Pinout Table 256 PBGA Function 256 PBGA Function 256 PBGA Function 256 PBGA Function 256 PBGA Function 256 PBGA Function A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 C1 VSS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TCK I/O TDO I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O STM I/O I/O I/O C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 E1 E2 E3 E4 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VSS I/O VCC I/O VSS I/O I/O VCC I/O VSS I/O VCC I/O VSS I/O I/O I/O I/O I/O I/O I/O E19 E20 F1 F2 F3 F4 F17 F18 F19 F20 G1 G2 G3 G4 G17 G18 G19 G20 H1 H2 H3 H4 H17 H18 H19 H20 J1 J2 J3 J4 J17 J18 J19 J20 K1 K2 K3 K4 K17 K18 K19 I/O I/O I/O I/O I/O VCC VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VSS VSS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GCLK / I I/O I/O I/O VCC I ACLK / I I L2 L3 L4 L17 L18 L19 L20 M1 M2 M3 M4 M17 M18 M19 M20 N1 N2 N3 N4 N17 N18 N19 N20 P1 P2 P3 P4 P17 P18 P19 P20 R1 R2 R3 R4 R17 R18 R19 R20 T1 T2 ACLK / I I GCLK / I VCC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VSS VSS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCC VCC I/O I/O I/O I/O I/O T17 T18 T19 T20 U1 U2 U3 U4 U5 U6 U7 U8 U9 U10 U11 U12 U13 U14 U15 U16 U17 U18 U19 U20 V1 V2 V3 V4 V5 V6 V7 V8 V9 V10 V11 V12 V13 V14 V15 V16 V17 I/O I/O I/O I/O I/O I/O I/O VSS I/O VCC I/O VSS I/O VCC I/O I/O VSS I/O VCC I/O VSS I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O V20 W1 W2 W3 W4 W5 W6 W7 W8 W9 W10 W11 W12 W13 W14 W15 W16 W17 W18 W19 W20 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 Y16 Y17 Y18 Y19 Y20 I/O I/O I/O TDI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TRSTB I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O C2 I/O E17 I/O K20 I/O T3 I/O V18 I/O C3 I/O E18 I/O L1 I T4 I/O V19 TMS 3-40 QL2009 PIN DESCRIPTIONS Function Test Data In for JTAG TRSTB Active low Reset for JTAG TMS Test Mode Select for JTAG TCK Test Clock for JTAG TDO Test data out for JTAG Description Hold HIGH during normal operation. Connect to VCC if not used for JTAG. Hold LOW during normal operation. Connect to ground if not used for JTAG. Hold HIGH during normal operation. Connect to VCC if not used for JTAG. Hold HIGH or LOW during normal operation. Connect to VCC or ground if not used for JTAG. Output that must be left unconnected if not used for JTAG. STM Special Test Mode Must be grounded during normal operation. I/ACLK Can be configured as either or both. I High-drive input and/or array network driver High-drive input and/or global network driver High-drive input Use for input signals with high fanout. I/O Input/Output pin Can be configured as an input and/or output. I/GCLK Can be configured as either or both. VCC Power supply pin Connect to 3.3V supply. GND Ground pin Connect to ground. ORDERING INFORMATION QL 2009 - 1 PQ208 C QuickLogic pASIC device Operating Range C = Commercial I = Industrial pASIC 2 device part number Package Code PF144 = 144-pin TQFP PQ208 = 208-pin PQFP PB256 = 256-pin PBGA Speed Grade X = quick 0 = fast 1 = faster 2 = fastest 3-41 3 pASIC 2 Pin TDI QL2009 ABSOLUTE MAXIMUM RATINGS Supply Voltage ……………….. -0.5 to 7.0V Input Voltage ……….… -0.5 to VCC +0.5V ESD Pad Protection ….…………… ±2000V DC Input Current ….……………… ±20 mA Latch-up Immunity ………………. ±200 mA Storage Temperature……..…….. -65°C to + 150°C Lead Temperature ………….………………. 300°C 5 Volt OPERATING RANGE Symbol VCC TA TC Parameter Supply Voltage Ambient Temperature Case Temperature -X Speed Grade Delay Factor -0 Speed Grade -1 Speed Grade -2 Speed Grade K Industrial Min Max 4.5 5.5 -40 85 Commercial Min Max 4.75 5.25 0 70 0.4 0.4 0.4 0.4 0.46 0.46 0.46 0.46 2.75 2.00 1.61 1.35 Unit V °C °C 2.55 1.85 1.50 1.25 DC CHARACTERISTICS over 5V operating range Symbol VIH VIL Parameter Input HIGH Voltage Input LOW Voltage VOH Output HIGH Voltage VOL Output LOW Voltage II IOZ CI IOS Input Leakage Current 3-State Output Leakage Current Input Capacitance [2] Output Short Circuit Current [3] ICC D.C. Supply Current [4] Conditions Min 2.0 Max 0.8 IOH = -4 mA IOH = -24 mA/-16 mA [1] IOH = -10 µA IOL = 24 mA/16 mA [1] IOL = 10 µA VI = VCC or GND VI = VCC or GND VO = GND VO = VCC VI, VIO = VCC or GND 3.7 2.4 VCC-0.1 -10 -10 -15 40 2 (typ) 0.45 0.1 10 10 10 -120 210 10 Unit V V V V V V V µA µA pF mA mA mA Notes: [1] [2] [3] [4] -24 mA IOH and 24 mA IOL apply only to -1/-2 commercial grade devices. These speed grades are also PCI-compliant. All other devices have -16 mA IOH and 16 mA IOL specifications. Capacitance is sample tested only. Only one output at a time. Duration should not exceed 30 seconds. For -0/-1/-2 commercial grade devices only. Maximum ICC is 20 mA for -X commercial grade devices and 15mA for all industrial grade devices. For AC conditions, contact QuickLogic customer engineering. 3-42 QL2009 3.3 Volt OPERATING RANGE Symbol VCC TA Parameter Supply Voltage Ambient Temperature -0 Speed Grade Delay Factor -1 Speed Grade -2 Speed Grade K Industrial Min Max 3.0 3.6 -40 85 0.56 2.74 0.56 2.21 0.56 1.85 Commercial Min Max 3.0 3.6 0 70 0.61 2.65 0.61 2.14 0.61 1.79 Unit V °C DC CHARACTERISTICS over 3.3V operating range Parameter Input HIGH Voltage Input LOW Voltage Output HIGH Voltage VOL Output LOW Voltage IIH II IOZ CI IOS Input High Current Sink (for tolerance to 5V devices) Input Leakage Current 3-State Output Leakage Current Input Capacitance [5] Output Short Circuit Current [6] ICC D.C. Supply Current [7] Conditions Min 2.0 Max 0.4 0.1 12 Unit V V V V V V mA 10 10 10 -70 130 3 µA µA pF mA mA mA 0.8 IOH = -2.4 mA IOH = -10 µA IOL = 4 mA IOL = 10 µA 5.5V > VI > VCC 2.4 VCC-0.1 VI = VCC or GND VI = VCC or GND -10 -10 VO = GND VO = VCC VI, VIO = VCC or GND -10 25 0.5 (typ) Notes: [5] [6] [7] Capacitance is sample tested only. Only one output at a time. Duration should not exceed 30 seconds. For commercial grade devices only. Maximum ICC is 5 mA for all industrial grade devices. For AC conditions, contact QuickLogic customer engineering. 3-43 pASIC 2 Symbol VIH VIL VOH 3 QL2009 AC CHARACTERISTICS at VCC = 5V, TA = 25°°C (K = 1.00) Propagation delays depend on routing, fanout, load capacitance, supply voltage, junction temperature, and process variation. The AC Characteristics are a design guide to provide initial timing estimates at nominal conditions. Worst case estimates are obtained when nominal propagation delays are multiplied by the appropriate Delay Factor, K, as specified in the Delay Factor table (Operating Range). The QuickChip/QuickTools/QuickWorks software incorporates data sheet AC Characteristics into the design database for precise path analysis or simulation results following place and route. Logic Cells Symbol tPD tSU tH tCLK tCWHI tCWLO tSET tRESET tSW tRW Propagation Delays (ns) Fanout [8] 2 3 4 1.7 2.0 2.3 1.8 1.8 1.8 0.0 0.0 0.0 1.1 1.4 1.7 2.0 2.0 2.0 2.0 2.0 2.0 1.7 2.0 2.3 1.5 1.8 2.1 1.9 1.9 1.9 1.8 1.8 1.8 Parameter Combinatorial Delay [9] Setup Time [9] Hold Time Clock to Q Delay Clock High Time Clock Low Time Set Delay Reset Delay Set Width Reset Width 1 1.4 1.8 0.0 0.8 2.0 2.0 1.4 1.2 1.9 1.8 8 3.5 1.8 0.0 2.9 2.0 2.0 3.5 3.3 1.9 1.8 Input-Only Cells Symbol tIN tINI tISU tIH tlCLK tlRST tlESU tlEH Parameter High Drive Input Delay High Drive Input, Inverting Delay Input Register Set-Up Time Input Register Hold Time Input Register Clock To Q Input Register Reset Delay Input Register clock Enable Set-Up Time Input Register Clock Enable Hold Time 1 2.5 2.6 4.8 0.0 0.9 0.8 4.1 0.0 Propagation Delays (ns) Fanout [8] 2 3 4 8 12 2.6 2.6 2.7 3.5 4.6 2.7 2.7 2.8 3.6 4.7 4.8 4.8 4.8 4.8 4.8 0.0 0.0 0.0 0.0 0.0 1.0 1.0 1.1 1.9 3.0 0.9 0.9 1.0 1.8 2.9 4.1 4.1 4.1 4.1 4.1 0.0 0.0 0.0 0.0 0.0 24 5.8 5.9 4.8 0.0 4.2 4.1 4.1 0.0 Notes: [8] [9] Stated timing for worst case Propagation Delay over process variation at VCC=5.0V and TA=25°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range. These limits are derived from a representative selection of the slowest paths through the pASIC 2 logic cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design. 3-44 QL2009 Clock Cells Symbol tACK tGCKP tGCKB Parameter 1 2.2 1.2 1.5 Array Clock Delay Global Clock Pin Delay Global Clock Buffer Delay Propagation Delays (ns) Loads per Half Column [10] 2 3 4 8 10 2.2 2.3 2.4 2.5 2.6 1.2 1.2 1.2 1.2 1.2 1.6 1.6 1.7 1.8 1.9 13 1.2 2.0 I/O Cells 3 Parameter tI/O tISU tIH tlOCLK tlORST tlESU tlEH Input Delay (bidirectional pad) Input Register Set-Up Time Input Register Hold Time Input Register Clock To Q Input Register Reset Delay Input Register clock Enable Set-Up Time Input Register Clock Enable Hold Time Symbol Parameter tOUTLH tOUTHL tPZH tPZL tPHZ tPLZ 1 1.8 4.8 0.0 0.8 0.7 4.1 0.0 30 2.6 2.8 2.1 2.6 2.9 3.3 Output Delay Low to High Output Delay High to Low Output Delay Tri-state to High Output Delay Tri-state to Low Output Delay High to Tri-State [11] Output Delay Low to Tri-State [11] Propagation Delays (ns) Fanout [8] 2 3 4 8 2.1 2.4 2.7 3.9 4.8 4.8 4.8 4.8 0.0 0.0 0.0 0.0 1.1 1.4 1.7 2.9 1.0 1.3 1.6 2.8 4.1 4.1 4.1 4.1 0.0 0.0 0.0 0.0 Propagation Delays (ns) Output Load Capacitance (pF) 50 75 100 3.0 3.6 4.1 3.3 3.9 4.5 2.6 3.1 3.7 3.3 4.1 4.9 10 4.6 4.8 0.0 3.6 3.5 4.1 0.0 150 5.2 5.7 4.8 6.5 Notes: [10] The array distributed networks consist of 48 half columns and the global distributed networks consist of 52 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to 10 loads per half column. The global clock has up to 13 loads per half column. [11] The following loads are used for tPXZ: tPHZ 1KΩ 5 pF 1KΩ tPLZ 5 pF 3-45 pASIC 2 Symbol QL2009 3-46