PD - 96377 AUTOMOTIVE GRADE AUIRFZ24NS AUIRFZ24NL Features Advanced Planar Technology Low On-Resistance Dynamic dV/dT Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * l l l l l l l l l HEXFET® Power MOSFET D V(BR)DSS RDS(on) max. G 17A D D Description 0.07Ω ID S Specifically designed for Automotive applications, this Cellular design of HEXFET® Power MOSFETs utilizes the latest processing techniques to achieve low onresistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in Automotive and a wide variety of other applications. 55V G D S G D2Pak AUIRFZ24NS D S TO-262 AUIRFZ24NL G D S Gate Drain Source Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified. Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Max. Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds c c Units 17 12 68 3.8 45 0.3 ± 20 71 10 4.5 6.8 -55 to + 175 d c e A W W/°C V mJ A mJ V/ns °C 300 (1.6mm from case ) Thermal Resistance Parameter RθJC RθJA Junction-to-Case Junction-to-Ambient (PCB mounted, steady-state) g Typ. Max. Units ––– ––– 3.3 40 °C/W HEXFET® is a registered trademark of International Rectifier. *Qualification standards can be found at http://www.irf.com/ www.irf.com 1 06/22/11 AUIRFZ24NS/L Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter V(BR)DSS Drain-to-Source Breakdown Voltage ΔV(BR)DSS/ΔTJ Min. Typ. Max. Units 55 ––– ––– V Breakdown Voltage Temp. Coefficient ––– 0.052 ––– RDS(on) VGS(th) Static Drain-to-Source On-Resistance Gate Threshold Voltage ––– ––– 0.07 2.0 ––– gfs IDSS Forward Transconductance 4.5 ––– Drain-to-Source Leakage Current ––– ––– IGSS Conditions VGS = 0V, ID = 250μA V/°C Reference to 25°C, ID = 1mA VGS = 10V, ID = 10A f 4.0 Ω V VDS = VGS, ID = 250μA ––– S VDS = 25V, ID = 10A ––– 25 μA ––– 250 Gate-to-Source Forward Leakage ––– ––– 100 Gate-to-Source Reverse Leakage ––– ––– -100 VDS = 55V, VGS = 0V VDS = 44V, VGS = 0V, TJ = 150°C nA VGS = 20V VGS = -20V Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Qg Total Gate Charge ––– ––– 20 Qgs Gate-to-Source Charge ––– ––– 5.3 Qgd Gate-to-Drain ("Miller") Charge ––– ––– 7.6 VGS = 10V,See Fig 6 and 13 td(on) Turn-On Delay Time ––– 4.9 ––– VDD = 28V tr Rise Time ––– 34 ––– td(off) Turn-Off Delay Time ––– 19 ––– tf Fall Time ––– 27 ––– LS Internal Source Inductance Ciss ––– 7.5 ––– Input Capacitance ––– 370 ––– Coss Output Capacitance ––– 140 ––– Crss Reverse Transfer Capacitance ––– 65 ––– Min. Typ. Max. ID = 10A nC VDS = 44V f ID = 10A ns RG = 24Ω f RD = 2.6Ω, See Fig.10 Between lead, and center of die contact VGS = 0V pF VDS = 25V ƒ = 1.0MHz, See Fig.5 Diode Characteristics Parameter IS Continuous Source Current ISM (Body Diode) Pulsed Source Current Units ––– ––– 17 ––– 68 VSD (Body Diode) Diode Forward Voltage ––– ––– ––– 1.3 V trr Reverse Recovery Time ––– 56 83 ns Qrr Reverse Recovery Charge ––– 120 180 nC ton Forward Turn-On Time c Conditions MOSFET symbol A showing the integral reverse D G p-n junction diode. TJ = 25°C, IS = 10A, VGS = 0V TJ = 25°C, IF = 10A di/dt = 100A/μs f S f Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) Starting TJ = 25°C, L =1.0mH, RG = 25Ω, IAS = 10A. (See Figure 12) ISD ≤ 10A, di/dt ≤ 280A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C Pulse width ≤ 280µs; duty cycle ≤ 2%. When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. www.irf.com 2 AUIRFZ24NS/L Qualification Information† Automotive (per AEC-Q101) Qualification Level Moisture Sensitivity Level †† Comments: This part number(s) passed Automotive qualification. IR’s Industrial and Consumer qualification level is granted by extension of the higher Automotive level. 3L-D2 PAK MSL1 3L-TO-262 N/A ††† Machine Model Class M2(+/- 150V ) (per AEC-Q101-002) Human Body Model Class H1A(+/- 500V ) (per AEC-Q101-001) Charged Device Model Class C5(+/- 2000V ) (per AEC-Q101-005) ††† ESD ††† RoHS Compliant Yes † Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/ †† ††† Exceptions to AEC-Q101 requirements are noted in the qualification report. Highest passing voltage www.irf.com 3 AUIRFZ24NS/L 100 100 VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 10 4.5V 20μs PULSE WIDTH TTCJ = 25°C 1 0.1 1 10 10 4.5V 20μs PULSE WIDTH A 3.0 R DS(on) , Drain-to-Source On Resistance (Normalized) I D , Drain-to-Source Current (A) TJ = 25°C TJ = 175°C 10 V DS = 25V 20μs PULSE WIDTH 6 7 8 9 VGS , Gate-to-Source Voltage (V) Fig 3. Typical Transfer Characteristics www.irf.com 10 100 A Fig 2. Typical Output Characteristics 100 5 1 VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 1 175°C TTJC==175°C 1 0.1 100 VDS , Drain-to-Source Voltage (V) 4 VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V TOP I , Drain-to-Source Current (A) D I , Drain-to-Source Current (A) D TOP 10 I D = 17A 2.5 2.0 1.5 1.0 0.5 VGS = 10V 0.0 A -60 -40 -20 0 20 40 60 A 80 100 120 140 160 180 TJ , Junction Temperature (°C) Fig 4. Normalized On-Resistance Vs. Temperature 4 AUIRFZ24NS/L 700 500 Ciss 400 Coss V GS , Gate-to-Source Voltage (V) 600 C, Capacitance (pF) 20 V GS = 0V, f = 1MHz C iss = Cgs + C gd , Cds SHORTED C rss = C gd C oss = C ds + C gd V DS = 44V V DS = 28V 16 12 300 Crss 200 I D = 10A 100 0 1 10 100 A 8 4 FOR TEST CIRCUIT SEE FIGURE 13 0 0 VDS , Drain-to-Source Voltage (V) 8 12 16 A 20 Q G , Total Gate Charge (nC) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 1000 100 OPERATION IN THIS AREA LIMITED BY R DS(on) I D , Drain Current (A) ISD , Reverse Drain Current (A) 4 TJ = 175°C TJ = 25°C 10 VGS = 0V 1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VSD , Source-to-Drain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage www.irf.com A 2.0 100 10μs 10 100μs 1ms TC = 25°C TJ = 175°C Single Pulse 1 1 10ms 10 A 100 VDS , Drain-to-Source Voltage (V) Fig 8. Maximum Safe Operating Area 5 AUIRFZ24NS/L 20 RD V DS V GS ID , Drain Current (A) 16 D.U.T. RG 12 + -V DD 10V Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % 8 Fig 10a. Switching Time Test Circuit 4 0 VDS 25 50 75 100 125 150 90% 175 TC , Case Temperature ( °C) Fig 9. Maximum Drain Current Vs. Case Temperature 10% VGS td(on) tr t d(off) tf Fig 10b. Switching Time Waveforms Thermal Response (Z thJC ) 10 D = 0.50 1 0.20 0.10 0.05 0.1 0.01 0.00001 0.02 0.01 PDM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.0001 0.001 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com 6 L VDS D.U.T. RG + V - DD IAS 10 V tp 0.01Ω Fig 12a. Unclamped Inductive Test Circuit V(BR)DSS E AS , Single Pulse Avalanche Energy (mJ) AUIRFZ24NS/L 140 TOP 120 BOTTOM ID 4.2A 7.2A 10A 100 80 60 40 20 0 VDD = 25V 25 50 A 75 100 125 150 175 Starting TJ , Junction Temperature (°C) tp VDD Fig 12c. Maximum Avalanche Energy Vs. Drain Current VDS IAS Current Regulator Same Type as D.U.T. Fig 12b. Unclamped Inductive Waveforms 50KΩ 12V .2μF .3μF D.U.T. QG 10 V QGS QGD + V - DS VGS 3mA IG ID Current Sampling Resistors VG Fig 13b. Gate Charge Test Circuit Charge Fig 13a. Basic Gate Charge Waveform www.irf.com 7 AUIRFZ24NS/L Peak Diode Recovery dv/dt Test Circuit + D.U.T Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer + - - + RG • • • • Driver Gate Drive P.W. + dv/dt controlled by RG Driver same type as D.U.T. ISD controlled by Duty Factor "D" D.U.T. - Device Under Test Period D= - V DD P.W. Period VGS=10V * D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage Body Diode VDD Forward Drop Inductor Curent Ripple ≤ 5% ISD * VGS = 5V for Logic Level Devices Fig 14. For N-Channel HEXFETS www.irf.com 8 AUIRFZ24NS/L D2Pak Package Outline (Dimensions are shown in millimeters (inches)) D2Pak Part Marking Information Part Number AUFZ24NS YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ www.irf.com 9 AUIRFZ24NS/L TO-262 Package Outline ( Dimensions are shown in millimeters (inches)) TO-262 Part Marking Information Part Number AUFZ24NL YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ www.irf.com 10 AUIRFZ24NS/L D2Pak Tape & Reel Information Dimensions are shown in millimeters (inches) TRR 1.60 (.063) 1.50 (.059) 4.10 (.161) 3.90 (.153) FEED DIRECTION 1.85 (.073) 1.65 (.065) 1.60 (.063) 1.50 (.059) 11.60 (.457) 11.40 (.449) 0.368 (.0145) 0.342 (.0135) 15.42 (.609) 15.22 (.601) 24.30 (.957) 23.90 (.941) TRL 10.90 (.429) 10.70 (.421) 1.75 (.069) 1.25 (.049) 4.72 (.136) 4.52 (.178) 16.10 (.634) 15.90 (.626) FEED DIRECTION 13.50 (.532) 12.80 (.504) 27.40 (1.079) 23.90 (.941) 4 330.00 (14.173) MAX. NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ HUB. 4. INCLUDES FLANGE DISTORTION @ OUTER EDGE. www.irf.com 60.00 (2.362) MIN. 30.40 (1.197) MAX. 26.40 (1.039) 24.40 (.961) 3 4 11 AUIRFZ24NS/L Ordering Information Base part AUIRFZ24NL AUIRFZ24NS www.irf.com Package Type TO-262 D2Pak Standard Pack Form Tube Tube Tape and Reel Left Tape and Reel Right Complete Part Number Quantity 50 50 800 800 AUIRFZ24NL AUIRFZ24NS AUIRFZ24NSTRL AUIRFZ24NSTRR 12 AUIRFZ24NS/L IMPORTANT NOTICE Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. 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For technical support, please contact IR’s Technical Assistance Center http://www.irf.com/technical-info/ WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245 Tel: (310) 252-7105 www.irf.com 13