PD- 96348 AUTOMOTIVE GRADE AUIRLR024N AUIRLU024N Features l l l l l l l l l l HEXFET® Power MOSFET Advanced Planar Technology Low On-Resistance Logic-Level Gate Drive Dynamic dV/dT Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * D V(BR)DSS 55V RDS(on) max. G 0.065Ω ID S 17A D D Description Specifically designed for Automotive applications, this Cellular design of HEXFET® Power MOSFETs utilizes the latest processing techniques to achieve low onresistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in Automotive and a wide variety of other applications. G D S G D S I-Pak AUIRLU024N D-Pak AUIRLR024N G D S Gate Drain Source Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified. Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Max. Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V c Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt c d c e Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Units 17 12 72 45 0.3 ± 16 68 11 4.5 5.0 A W W/°C V mJ A mJ V/ns -55 to + 175 °C 300 (1.6mm from case ) Thermal Resistance Parameter RθJC RθJA RθJA Junction-to-Case Junction-to-Ambient (PCB mount) ** Junction-to-Ambient Typ. Max. Units ––– ––– ––– 3.3 50 110 °C/W HEXFET® is a registered trademark of International Rectifier. *Qualification standards can be found at http://www.irf.com/ www.irf.com 1 01/18/11 AUIRLR/U024N Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Min. Typ. Max. Units V(BR)DSS Drain-to-Source Breakdown Voltage Parameter 55 ––– ––– V ∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.061 ––– ––– ––– 0.065 ––– ––– 0.080 ––– ––– 0.110 1.0 ––– 2.0 RDS(on) Static Drain-to-Source On-Resistance VGS(th) Gate Threshold Voltage gfs IDSS Forward Transconductance 8.3 ––– Drain-to-Source Leakage Current ––– ––– ––– ––– 250 Gate-to-Source Forward Leakage ––– ––– 100 Gate-to-Source Reverse Leakage ––– ––– -100 IGSS Conditions VGS = 0V, ID = 250µA V/°C Reference to 25°C, ID = 1mA f f = 9.0A f VGS = 10V, ID = 10A Ω VGS = 5.0V, ID = 10A VGS = 4.0V, ID V VDS = VGS, ID = 250µA ––– S VDS = 25V, ID = 11A 25 µA VDS = 55V, VGS = 0V nA VGS = 16V VDS = 44V, VGS = 0V, TJ = 150°C VGS = -16V Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Qg Total Gate Charge ––– ––– 15 Qgs Gate-to-Source Charge ––– ––– 3.7 Qgd Gate-to-Drain ("Miller") Charge ––– ––– 8.5 VGS = 5.0V,See Fig 6 and 13 td(on) Turn-On Delay Time ––– 7.1 ––– VDD = 28V tr Rise Time ––– 74 ––– td(off) Turn-Off Delay Time ––– 20 ––– tf Fall Time ––– 29 ––– LD Internal Drain Inductance LS Internal Source Inductance Ciss Input Capacitance Coss Crss ––– 4.5 ––– ––– 7.5 ––– ––– 480 ––– Output Capacitance ––– 130 ––– Reverse Transfer Capacitance ––– 61 ––– Min. Typ. Max. ID = 11A nC VDS = 44V fh ID = 11A ns RG = 12 Ω, VGS = 5.0V RD = 2.4Ω, See Fig.10 Between lead, nH fh D 6mm (0.25in.) from package G and center of die contact VGS = 0V pF VDS = 25V ƒ = 1.0MHz, See Fig.5 S h Diode Characteristics Parameter IS Continuous Source Current ISM (Body Diode) Pulsed Source Current Units ––– ––– 17 ––– 72 VSD (Body Diode) Diode Forward Voltage ––– ––– ––– 1.3 V trr Reverse Recovery Time ––– 60 90 ns Qrr Reverse Recovery Charge ––– 130 200 nC ton Forward Turn-On Time c Conditions MOSFET symbol A D showing the integral reverse G p-n junction diode. TJ = 25°C, IS = 11A, VGS = 0V TJ = 25°C, IF = 11A di/dt = 100A/µs f S f Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11) VDD = 25V, starting TJ = 25°C, L = 790µH, RG = 25Ω, IAS = 11A. (See Figure 12) ISD ≤ 11A, di/dt ≤ 290A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C Pulse width ≤ 300µs; duty cycle ≤ 2% This is applied for I-PAK, LS of D-PAK is measured between lead and center of die contact . Uses IRLZ24N data and test conditions. ** When mounted on 1" square PCB (FR-4 or G-10 Material ) . For recommended footprint and soldering techniques refer to application note #AN-994 2 www.irf.com AUIRLR/U024N Qualification Information† Automotive (per AEC-Q101) Qualification Level Moisture Sensitivity Level ESD RoHS Compliant †† Comments: This part number(s) passed Automotive qualification. IR’s Industrial and Consumer qualification level is granted by extension of the higher Automotive level. D PAK MSL1 I-PAK N/A Machine Model Class M2(+/-150V ) AEC-Q101-002 Human Body Model Class H1A(+/-500V ) AEC-Q101-001 Charged Device Model Class C5(+/-2000V ) AEC-Q101-005 ††† ††† ††† Yes Qualification standards can be found at International Rectifiers web site: http//www.irf.com/ Exceptions to AEC-Q101 requirements are noted in the qualification report. Highest passing voltage www.irf.com 3 AUIRLR/U024N 100 100 VGS 15V 12V 10V 8.0V 6.0V 4.0V 3.0V BOTTOM 2.5V 10 1 2.5V 20µs PULSE WIDTH T J = 25°C 0.1 0.1 1 10 A 10 2.5V 1 3.0 R DS(on) , Drain-to-Source On Resistance (Normalized) I D , Drain-to-Source Current (A) TJ = 25°C TJ = 175°C 10 1 V DS = 15V 20µs PULSE WIDTH 4 5 6 7 8 9 VGS , Gate-to-Source Voltage (V) Fig 3. Typical Transfer Characteristics 4 10 A 100 Fig 2. Typical Output Characteristics 100 3 1 VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 0.1 20µs PULSE WIDTH T J = 175°C 0.1 0.1 100 VDS , Drain-to-Source Voltage (V) 2 VGS 15V 12V 10V 8.0V 6.0V 4.0V 3.0V BOTTOM 2.5V TOP ID , Drain-to-Source Current (A) ID , Drain-to-Source Current (A) TOP 10 A I D = 17 18AA 2.5 2.0 1.5 1.0 0.5 VGS = 10V 0.0 -60 -40 -20 0 20 40 60 A 80 100 120 140 160 180 TJ , Junction Temperature (°C) Fig 4. Normalized On-Resistance Vs. Temperature www.irf.com AUIRLR/U024N Ciss 600 400 15 V GS = 0V, f = 1MHz C iss = Cgs + C gd , Cds SHORTED C rss = C gd C oss = C ds + C gd VGS , Gate-to-Source Voltage (V) C, Capacitance (pF) 800 Coss 200 Crss 0 1 10 100 A I D = 11A V DS = 44V V DS = 28V 12 9 6 3 FOR TEST CIRCUIT SEE FIGURE 13 0 0 4 VDS , Drain-to-Source Voltage (V) 12 16 20 A Q G , Total Gate Charge (nC) Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100 OPERATION IN THIS AREA LIMITED BY R DS(on) I D , Drain Current (A) ISD , Reverse Drain Current (A) 8 TJ = 175°C TJ = 25°C 10 VGS = 0V 1 0.4 0.8 1.2 1.6 VSD , Source-to-Drain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage www.irf.com A 2.0 100 10µs 100µs 10 TC = 25°C TJ = 175°C Single Pulse 1 1 1ms 10ms 10 A 100 VDS , Drain-to-Source Voltage (V) Fig 8. Maximum Safe Operating Area 5 AUIRLR/U024N 20 RD ID , Drain Current (A) V DS 15 VGS D.U.T. RG 10 + -VDD 5V Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % 5 Fig 10a. Switching Time Test Circuit 0 25 50 75 100 125 150 TC , Case Temperature ( °C) 175 VDS 90% Fig 9. Maximum Drain Current Vs. Case Temperature 10% VGS td(on) tr t d(off) tf Fig 10b. Switching Time Waveforms Thermal Response (Z thJC ) 10 D = 0.50 1 0.20 0.10 0.05 0.1 0.02 0.01 PDM t SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 0.01 0.00001 1 /t 1 t2 2 2. Peak TJ = PDM x Z thJC + T C 0.0001 0.001 0.01 0.1 A 1 t 1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case 6 www.irf.com 15V L VDS DRIVER D.U.T RG + V - DD IAS 20V 0.01Ω tp Fig 12a. Unclamped Inductive Test Circuit A E AS , Single Pulse Avalanche Energy (mJ) AUIRLR/U024N 140 TOP 120 BOTTOM ID 4.5A 7.8A 11A 100 80 60 40 20 0 VDD = 25V 25 50 A 75 100 125 150 175 Starting TJ , Junction Temperature (°C) V(BR)DSS tp Fig 12c. Maximum Avalanche Energy Vs. Drain Current I AS Current Regulator Same Type as D.U.T. Fig 12b. Unclamped Inductive Waveforms 50KΩ 12V .2µF .3µF QG 10 V D.U.T. QGS QGD VG + V - DS VGS 3mA IG Charge ID Current Sampling Resistors Fig 13b. Gate Charge Test Circuit Fig 13a. Basic Gate Charge Waveform www.irf.com 7 AUIRLR/U024N Peak Diode Recovery dv/dt Test Circuit D.U.T Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer + + - - • • • • RG + dv/dt controlled by RG Driver same type as D.U.T. ISD controlled by Duty Factor "D" D.U.T. - Device Under Test Driver Gate Drive P.W. Period D= + - VDD P.W. Period VGS=10V * D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage Body Diode VDD Forward Drop Inductor Curent Ripple ≤ 5% ISD * VGS = 5V for Logic Level Devices Fig 14. For N-Channel HEXFET® MOSFETs 8 www.irf.com AUIRLR/U024N D-Pak (TO-252AA) Package Outline Dimensions are shown in millimeters (inches) D-Pak (TO-252AA) Part Marking Information Part Number AURLR024N YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ www.irf.com 9 AUIRLR/U024N I-Pak (TO-251AA) Package Outline ( Dimensions are shown in millimeters (inches) I-Pak (TO-251AA) Part Marking Information Part Number AURLU024N YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10 www.irf.com AUIRLR/U024N D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches) TR TRR 16.3 ( .641 ) 15.7 ( .619 ) 12.1 ( .476 ) 11.9 ( .469 ) FEED DIRECTION TRL 16.3 ( .641 ) 15.7 ( .619 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 13 INCH 16 mm NOTES : 1. OUTLINE CONFORMS TO EIA-481. www.irf.com 11 AUIRLR/U024N Ordering Information Base part Package Type AUIRLR024N DPak AUIRLU024N IPak 12 Standard Pack Form Tube Tape and Reel Tape and Reel Left Tape and Reel Right Tube Complete Part Number Quantity 75 2000 3000 3000 75 AUIRLR024N AUIRLR024NTR AUIRLR024NTRL AUIRLR024NTRR AUIRLU024N www.irf.com AUIRLR/U024N IMPORTANT NOTICE Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. 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Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, IR will not be responsible for any failure to meet such requirements For technical support, please contact IR’s Technical Assistance Center http://www.irf.com/technical-info/ WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 www.irf.com 13