STTH1L06 Turbo 2 ultrafast high voltage rectifier Features ■ Ultrafast switching ■ Low reverse recovery current ■ Reduces switching and conduction losses ■ Low thermal resistance The STTH1L06/U/A, which is using ST Turbo 2 600 V technology, is specially suited as boost diode in discontinuous or critical mode power factor corrections. The device is also intended for use as a free wheeling diode in power supplies and other power switching applications. SMA STTH1L06A Table 1. October 2009 SMB STTH1L06U DO-41 STTH1L06 Description Doc ID 8321 Rev 4 Device summary Symbol Value IF(AV) 1A VRRM 600 V IR (max) 75 µA Tj (max) 175 °C VF (max) 1.05 V trr (max) 80 ns 1/9 www.st.com 9 Characteristics STTH1L06 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms voltage IF(AV) 7 A Average forward current δ = 0.5 DO-41 Tc = 120 °C SMA Tc = 135 °C SMB Tc = 145 °C Storage temperature range 1 A 30 20 A -65 to + 175 °C 175 °C Value (max) Unit Maximum operating junction temperature Thermal parameters Symbol Parameter L = 10 mm Rth(j-a) V SMA / SMB Tstg Rth(j-l) 600 10 t = 10 ms sinusoidal DO-41 Surge non repetitive forward current p tp = 10 ms sinusoidal SMA / SMB Table 3. Unit DO-41 IFSM Tj Value Junction to lead DO-41 45 SMA 30 SMB 25 DO-41 70 °C/W Junction to ambient (1) L = 10 mm 2 1. Rth(j-a) is measured with a copper area S = 5 cm (see Figure 14.) Table 4. Symbol Static electrical characteristics Parameter IR Reverse leakage current VF Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Min. Max. Unit 1 VR = 600 V µA 10 75 1.3 IF = 1 A To evaluate the conduction losses use the following equation: P = 0.89 x IF(AV) + 0.165 IF2(RMS) 2/9 Typ. Doc ID 8321 Rev 4 V 0.85 1.05 STTH1L06 Characteristics Table 5. Dynamic characteristics Symbol Parameter trr Reverse recovery time Tj = 25 °C IF = 1 A, dIF/dt = -50, A/µs, VR = 30 V tfr Forward recovery time Tj = 25 °C Forward recovery voltage Tj = 25 °C VFP Figure 1. Test conditions Typ. Max. Unit 55 80 ns IF = 1 A, dIF/dt = 100 A/µs VFR = 3.5 V 50 ns IF = 1 A, dIF/dt = 100 A/µs 10 V Conduction losses versus average current Min. Figure 2. Forward voltage drop versus forward current IFM(A) P(W) 1.50 δ = 0.05 δ = 0.1 100.0 δ = 0.2 δ = 0.5 1.25 Tj=150°C (Maximum values) δ=1 1.00 10.0 Tj=150°C (Typical values) 0.75 Tj=25°C (Maximum values) 0.50 1.0 T 0.25 IF(av)(A) δ=tp/T 0.00 0.0 0.1 0.2 Figure 3. 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VFM(V) tp 0.1 1.2 1.3 0.0 Relative variation of thermal Figure 4. impedance junction ambient versus pulse duration Zth(j-a)/Rth(j-a) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Relative variation of thermal impedance junction ambient versus pulse duration Zth(j-a)/Rth(j-a) epoxy FR4, Lead = 10 mm DO-41 Lleads = 10mm SMB 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 1.0 1.0 1.0 0.9 0.5 0.3 δ = 0.2 T 0.2 0.2 epoxy FR4, S = 1 cm² δ = 0.5 δ = 0.2 δ = 0.1 T δ = 0.1 0.1 tp(s) Single pulse 0.0 1.E-01 1.E+00 1.E+01 δ=tp/T 1.E+02 0.1 tp 1.E+03 tp(s) Single pulse 0.0 1.E-01 Doc ID 8321 Rev 4 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 3/9 Characteristics Figure 5. STTH1L06 Relative variation of thermal Figure 6. impedance junction ambient versus pulse duration (epoxy FR4) Peak reverse recovery current versus dIF/dt (90% confidence) IRM(A) Zth(j-a)/Rth(j-a) 1.0 2.5 SMA 0.9 VR=400V Tj=125°C 2.3 0.8 2.0 0.7 1.8 IF=2 x IF(av) IF=IF(av) IF=0.5 x IF(av) 0.6 1.5 δ = 0.5 0.5 1.3 0.4 1.0 δ = 0.2 0.3 0.8 T δ = 0.1 0.2 IF=0.25 x IF(av) 0.1 tp(s) Single pulse 1.E+00 Figure 7. 0.3 δ=tp/T 0.0 1.E-01 0.5 1.E+01 dIF/dt(A/µs) tp 0.0 1.E+02 1.E+03 0 5 Reverse recovery time versus dIF/dt Figure 8. (90% confidence) 10 15 20 25 30 35 40 45 50 Reverse recovery charges versus dIF/dt (90% confidence) Qrr(nC) trr(ns) 800 220 VR=400V Tj=125°C 700 VR=400V Tj=125°C 200 IF=2 x IF(av) 180 600 IF=IF(av) 160 500 140 IF=2 x IF(av) IF=0.5 x IF(av) 120 IF=IF(av) 400 IF=0.5 x IF(av) 100 300 80 60 200 40 100 20 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 5 Figure 9. 10 15 20 25 30 35 40 45 50 Softness factor versus dIF/dt (typical values) 0 5 10 15 20 25 30 35 40 45 50 Figure 10. Relative variations of dynamic parameters versus junction temperature S factor 1.25 2.0 S factor 1.8 1.00 1.6 1.4 IRM 0.75 1.2 QRR 1.0 0.50 0.8 0.6 0.25 0.4 0.2 Tj(°C) IF=IF(av) VR=400V Tj=125°C dIF/dt(A/µs) 0.00 0.0 0 4/9 5 10 15 20 25 30 35 40 45 IF=IF(av) VR=400V Reference: Tj=125°C 50 25 Doc ID 8321 Rev 4 50 75 100 125 STTH1L06 Characteristics Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) VFP(V) tfr(ns) 200 25 IF=IF(av) Tj=125°C IF=IF(av) VFR=1.1 x VF max. Tj=125°C 180 160 20 140 120 15 100 80 10 60 40 5 20 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 0 200 Figure 13. Junction capacitance versus reverse voltage applied (typical values) 20 40 60 80 100 120 140 160 180 200 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(°C/W) C(pF) 100 110 Epoxy printed circuit board FR4, copper thickness: 35 µm F=1MHz Vosc=30mV Tj=25°C 100 90 DO-41 Lleads=10mm 80 70 60 10 SMB 50 40 30 20 VR(V) 10 1 S(cm²) 0 1 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 140 130 SMA 120 110 100 90 80 70 60 50 40 30 20 S(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Doc ID 8321 Rev 4 3.5 4.0 4.5 5.0 5/9 Package information 2 STTH1L06 Package information ● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Figure 16. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 6/9 Doc ID 8321 Rev 4 STTH1L06 Package information Table 7. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 17. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Table 8. DO-41 (plastic) dimensions Dimensions Ref. A C Doc ID 8321 Rev 4 Inches Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C 25.4 D 0.71 ØD ØB C Millimeters 1 0.86 0.028 0.034 7/9 Ordering information 3 Ordering information Table 9. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH1L06 STTH1L06 DO-41 0.34 g 2000 Ammopack STTH1L06RL STTH1L06 DO-41 0.34 g 5000 Tape and reel STTH1L06U BL6 SMB 0.11 g 2500 Tape and reel STTH1L06A HL6 SMA 0.068 g 5000 Tape and reel Revision history Table 10. 8/9 STTH1L06 Document revision history Date Revision Jul-2002 3C 30-Sep-2009 4 Changes Last issue. Updated table 8 package dimensions. Doc ID 8321 Rev 4 STTH1L06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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