STMICROELECTRONICS STTH102-Y

STTH102-Y
Automotive high efficiency ultrafast diode
Features
■
Very low conduction losses
■
Negligible switching losses
■
Low forward and reverse recovery times
■
High junction temperature
■
ECOPACK®2 compliant component
■
AEC-Q101 qualified
A
K
SMA
(JEDEC DO-214AC)
STTH102AY
Description
The STTH102-Y, which is using ST’s new 200 V
planar technology, is specially suited for switching
mode base drive and transistor circuits. The
device is also intended for use as a free wheeling
diode in power supplies and other power
switching applications for automotive.
November 2011
Table 1.
Doc ID 17982 Rev 1
Device summary
Symbol
Value
IF(AV)
1A
VRRM
200 V
Tj (max)
175 °C
VF(max)
0.78 V
trr (max)
20 ns
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7
Characteristics
STTH102-Y
1
Characteristics
Table 2.
Absolute rating (limiting values)
Symbol
Parameter
Value
Unit
200
V
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward current
TL = 148 °C δ = 0.5
1
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
40
A
Tstg
Storage temperature range
-65 to + 175
°C
Tj
Operating junction temperature range
-40 to +175
°C
dV/dt
Critical rate of rise of reverse voltage
10000
V/µs
Value
Unit
30
°C/W
Table 3.
Thermal resistance
Symbol
Rth(j-l)
Table 4.
Symbol
IR (1)
VF(2)
Parameter
Junction to lead
Static Electrical Characteristics
Parameter
Tests conditions
Tj = 25 °C
Reverse leakage current
Tj = 125 °C
Tj = 25 °C
Forward voltage drop
Tj = 125 °C
Min.
Typ.
Max.
Unit
1
VR = VRRM
µA
1
25
IF = 700 mA
0.90
IF = 1 A
0.97
IF = 1 A
0.68
V
0.78
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.130 IF2(RMS)
Table 5.
Dynamic electrical characteristics
Symbol
Parameter
trr
Reverse recovery time
Tj = 25 °C
tfr
Forward recovery time
Forward recovery
voltage
VFP
2/7
Tests conditions
Typ.
Max.
Unit
IF = 0.5 A Irr = 0.25 A
IR = 1 A
12
20
ns
Tj = 25 °C
IF = 1 A dIF/dt = 50 A/ms
VFR = 1.1 x VFmax
50
ns
Tj = 25 °C
IF = 1 A dIF/dt = 50 A/ms
1.8
V
Doc ID 17982 Rev 1
Min.
STTH102-Y
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
1.0
δ = 0.05
0.9
δ = 0.1
δ = 0.2
1.2
δ = 0.5
Rth(j-a)=Rth(j-I)
1.0
0.8
δ=1
0.7
0.8
0.6
0.5
Rth(j-a)=120°C/W
0.6
0.4
0.4
0.3
T
T
0.2
0.2
0.1
IF(AV)(A)
δ=tp/T
0.0
0.0
0.2
Figure 3.
1.0
0.4
0.6
0.8
tp
1.0
δ=tp/T
0.0
0
1.2
Relative variation of thermal
impedance junction to ambient
versus pulse duration
25
Figure 4.
Zth(j-a)/Rth(j-a)
Tamb(°C)
tp
50
75
100
125
150
175
Forward voltage drop versus
forward current
IFM(A)
100.0
0.9
Tj=125°C
(maximum values)
0.8
0.7
10.0
0.6 δ = 0.5
Tj=125°C
(typical values)
T
0.5
Tj=25°C
(maximum values)
0.4
δ=tp/T
0.3 δ = 0.2
δ = 0.1
0.2
0.1
Figure 5.
1.0
epoxy printed circuit board,
e(Cu) = 35 µm, recommended pad layout
VFM(V)
tp(s)
Single pulse
0.0
1.E-01
tp
0.1
1.E+00
1.E+01
1.E+02
1.E+03
Junction capacitance versus
reverse voltage applied
(typical values)
0.0
0.2
Figure 6.
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Reverse recovery time versus dIF/dt
(90% confidence)
trr(ns)
C(pF)
70
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
IF=1A
VR=100V
Tj=125°C
60
50
40
Tj=125°C
10
30
Tj=25°C
20
10
VR(V)
dIF/dt(A/µs)
1
0
1
10
100
1000
1
Doc ID 17982 Rev 1
10
100
1000
3/7
Characteristics
Figure 7.
STTH102-Y
Peak recovery current versus dIF/dt Figure 8.
(90% confidence)
IRM(A)
Reverse recovery charges versus
dIF/dt (90% confidence)
Qrr(nC)
3.5
35.0
IF=1A
VR=100V
Tj=125°C
3.0
32.5
IF=1A
VR=100V
30.0
27.5
2.5
25.0
22.5
2.0
20.0
Tj=125°C
Tj=125°C
17.5
1.5
15.0
12.5
1.0
10.0
Tj=25°C
Tj=25°C
7.5
5.0
0.5
2.5
dIF/dt(A/µs)
0.0
1
10
Figure 9.
dIF/dt(A/µs)
0.0
100
1
1000
Relative variations of dynamic
parameters versus junction
temperature
10
100
1000
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
IRM; trr; Qrr [Tj] / IRM; trr; Qrr [Tj =25°C]
120
3.5
Rth(j-a)(°C/W)
Epoxy printed circuit board FR4, copper thickness: 35 µm
110
IF=IF(AV)
dIF/dt=200A/µs
VR=100V
100
3.0
90
80
QRR
70
2.5
60
50
2.0
40
trr
30
1.5
20
IRM
10
Tj(°C)
25
4/7
50
75
100
S(cm²)
0
1.0
125
150
175
0.0
Doc ID 17982 Rev 1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STTH102-Y
2
Package information
Package information
●
Epoxy meets UL94 V0
●
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6.
SMA dimensions
Dimensions
Ref.
E1
D
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.094
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
A1
A2
L
b
Inches
Min.
E
C
Millimeters
Figure 11. Footprint (dimensions in mm)
1.4
2.63
1.4
1.64
5.43
Doc ID 17982 Rev 1
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Ordering information
3
Ordering information
Table 7.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STTH102AY
U12Y
SMA
0.068 g
5000
Tape and reel
Revision history
Table 8.
6/7
STTH102-Y
Revision history
Date
Revision
07-Nov-2011
1
Changes
Initial release.
Doc ID 17982 Rev 1
STTH102-Y
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