STMICROELECTRONICS STTH112A

STTH112
High voltage ultrafast rectifier
Main product characteristics
IF(AV)
1A
VRRM
1200 V
Tj (max)
175° C
VF (max)
1.65 V
Features and benefits
DO-41
STTH112
■
Low forwarded voltage drop
■
High reliability
■
High surge current capability
■
Soft switching for reduced EMI disturbances
■
Planar technology
Description
SMA
STTH112A
The STTH112, which is using ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering,
demagnetization in power supplies and other
power switching applications
Table 1.
SMB
STTH112U
Absolute ratings (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
1200
V
V(RMS)
RMS voltage
850
V
1
A
Tl = 85° C
IF(AV)
Average forward current
δ = 0.5
DO-41
Tl = 115° C
δ = 0.5 SMA
Tl = 125° C
δ =0 .5 SMB
DO-41
IFSM
Forward surge current
t = 8.3 ms
20
SMA
A
18
SMB
Tstg
Tj
March 2007
Storage temperature range
Maximum operating junction temperature
Rev 4
- 50 + 175
°C
+ 175
°C
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Electrical characteristics
STTH112
1
Electrical characteristics
Table 2.
Thermal parameters
Symbol
Parameter
Value
L = 10 mm
Rth (j-l)
Junction to lead
45
SMA
30
SMB
25
DO-41
110
°C/W
Junction to ambient
Rth (j-a)
Table 3.
DO-41
Unit
L = 10 mm
Static electrical characteristics
Symbol
Parameter
IR
Tests conditions
Reverse leakage current
VF
VR = 1200V
Forward voltage drop
Table 4.
IF = 1 A
Min.
Typ.
Max.
Tj = 25° C
5
Tj = 125° C
50
Tj = 25° C
1.9
Unit
µA
Tj = 125° C
1.17
1.65
Tj = 150° C
1.10
1.55
Typ.
Max.
Unit
75
ns
500
ns
30
V
V
Dynamic electrical characteristics
Symbol
Parameter
Tests conditions
trr
Reverse recovery time
tfr
Forward recovery time
Forward recovery voltage
VFP
Figure 1.
Min.
IF = 0.5 A
Irr = 0.25 A IR = 1A
Tj = 25° C
IF = 1 A
dIF/dt = 50 A/µs
VFR = 1.1 x VFmax
Tj = 25° C
Conduction losses versus average Figure 2.
current
Forward voltage drop versus
forward current.
IFM(A)
P(W)
2.2
2.0
δ = 0.05
δ = 0.1
100.0
δ = 0.2
δ = 0.5
Tj=125°C
(maximum values)
1.8
1.6
δ=1
1.4
Tj=125°C
(typical values)
10.0
1.2
Tj=25°C
(maximum values)
1.0
0.8
1.0
0.6
T
0.4
IF(AV)(A)
0.2
δ=tp/T
0.0
0.0
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0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VFM(V)
tp
0.1
1.1
1.2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STTH112
Figure 3.
Electrical characteristics
Figure 4.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4,
Lleads = 10mm) (DO-41).
Zth(j-c)/Rth(j-c)
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA).
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
δ = 0.5
0.5
0.5
0.4
0.4
0.3
0.3
δ = 0.2
0.2
T
Single pulse
tp(s)
δ=tp/T
0.0
δ = 0.1
0.1
tp
T
δ = 0.2
0.2
δ = 0.1
0.1
δ = 0.5
tp(s)
Single pulse
δ=tp/T
0.0
1.E-01
1.E+00
Figure 5.
1.E+01
1.E+02
1.E+03
1.E-01
1.E+00
Relative variation of thermal
Figure 6.
impedance junction ambient versus
pulse duration (epoxy FR4)(SMB).
Zth(j-c)/Rth(j-c)
1.E+01
tp
1.E+02
1.E+03
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35 µm) (DO-41, SMB).
Rth(j-a)(°C/W)
1.0
110
0.9
100
0.8
90
0.7
80
0.6
70
δ = 0.5
DO-41
Lleads=10mm
SMB
60
0.5
50
0.4
40
0.3
δ = 0.2
30
T
0.2
20
δ = 0.1
0.1
tp(s)
Single pulse
δ=tp/T
0.0
10
tp
S(cm²)
0
1.E-01
1.E+00
Figure 7.
1.E+01
1.E+02
1.E+03
0
1
2
3
4
5
6
7
8
9
10
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA).
Rth(j-a)(°C/W)
140
130
120
110
100
90
80
SMA
70
60
50
40
30
20
S(cm²)
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
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Package mechanical data
2
STTH112
Package mechanical data
●
Epoxy meets UL 94, V0
Table 5.
SMA dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
E
A1
A2
C
L
Figure 8.
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.094
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
b
Footprint (dimensions in mm)
1.4
2.63
1.4
1.64
5.43
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STTH112
Package mechanical data
Table 6.
SMB dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
E
A1
A2
C
L
Figure 9.
b
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
Footprint (dimensions in mm)
1.62
2.60
1.62
2.18
5.84
Table 7.
DO-41 dimensions
DIMENSIONS
REF.
C
Inches
Min.
Max.
Min.
Max.
A
4.07
5.20
0.160
0.205
B
2.04
2.71
0.080
0.107
C
28
D
0.712
ØB
ØD
Millimeters
ØD
A
C
1.102
0.863
0.028
0.034
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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Ordering information
3
4
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STTH112
Ordering information
Ordering code
Marking
Package
Weight
Base qty
Delivery Mode
STTH112
STTH112
DO-41
0.34 g
2000
Ammopack
STTH112A
H12
SMA
0.068 g
5000
Tape and reel
STTH112U
U12
SMB
0.11 g
2500
Tape and reel
STTH112RL
STTH112
DO-41
0.34 g
5000
Tape and reel
Revision history
Date
Revision
Changes
Jan-2003
2
Initial release.
22-Jun-2005
3
New value of Tj = 150°C added to table 2.
Dimensions A1 E and D updated in Table 4.
Data sheet reformatted.
No other technical changes
20-Mar-2007
4
Reformatted to current standards. Updated dimensions and footprints
for SMA and SMB packages.
STTH112
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