STTH102 High efficiency ultrafast diode Main product characteristics IF(AV) 1A VRRM 200 V Tj (max) 175° C VF(max) 0.78 V trr (max) 20 ns A A K K Features and benefits SMA (JEDEC DO-214AC) STTH102A ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature Description Marking STTH102A U12 STTH102 STTH102 STTH102RL STTH102 Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current Tstg Storage temperature range dV/dt Part Number Absolute ratings (limiting values) Symbol Tj STTH102 Order codes The STTH102, which is using ST’s new 200 V planar technology, is specially suited for switching mode base drive and transistor circuits. The device is also intended for use as a free wheeling diode in power supplies and other power switching applications. Table 1. DO-41 SMA TL = 148° C δ = 0.5 DO-41 TL = 130° C δ = 0.5 SMA Unit 200 V 1 A 40 tp = 10 ms Sinusoidal DO-41 A 50 Maximum operating junction temperature Critical rate of rise of reverse voltage November 2006 Value Rev 5 -65 to + 175 °C 175 °C 10000 V/µs 1/7 www.st.com 7 Characteristics STTH102 1 Characteristics Table 2. Thermal resistance Symbol Rth(j-l) Parameter 30 DO-41 50 °C/W Lead length = 10 mm Static Electrical Characteristics Symbol VF(2) SMA Unit Junction to lead Table 3. IR (1) Value Parameter Tests conditions Tj = 25° C Reverse leakage current Typ Max. Unit 1 Tj = 125° C Tj = 25° C Forward voltage drop Min. Tj = 125° C VR = VRRM µA 1 25 IF = 700 mA (SMA) 0.90 IF = 1 A 0.97 IF = 1 A 0.68 V 0.78 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.130 IF2(RMS) Table 4. Dynamic electrical characteristics Symbol Parameter Tests conditions Typ Max Unit 20 ns trr Reverse recovery time Tj = 25° C IF = 0.5 A Irr = 0.25 A IR = 1 A 12 tfr Forward recovery time Tj = 25° C IF = 1 A dIF/dt = 50 A/ms VFR = 1.1 x VFmax 50 ns Forward recovery voltage Tj = 25° C IF = 1 A dIF/dt = 50 A/ms 1.8 V VFP Figure 1. Average forward power dissipation Figure 2. versus average forward current (SMA) PF(AV)(W) Average forward power dissipation versus average forward current (DO-41) PF(AV)(W) 1.0 1.0 δ = 0.05 0.9 δ = 0.1 δ = 0.2 δ = 0.5 δ = 0.05 0.9 δ = 0.1 δ = 0.2 δ = 0.5 0.8 0.8 δ=1 0.7 δ=1 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T T 0.2 0.1 IF(AV)(A) δ=tp/T 0.0 0.0 2/7 Min 0.2 0.4 0.6 0.8 1.0 0.2 0.1 IF(AV)(A) tp 0.0 1.2 0.00 0.25 0.50 0.75 δ=tp/T 1.00 tp 1.25 STTH102 Characteristics Figure 3. Average forward current versus Figure 4. ambient temperature (δ = 0.5) (SMA) IF(AV)(A) Average forward current versus ambient temperature (δ = 0.5) (DO-41) IF(AV)(A) 1.2 1.2 Rth(j-a)=Rth(j-I) Rth(j-a)=Rth(j-I) 1.0 1.0 0.8 0.8 Rth(j-a)=120°C/W 0.6 Rth(j-a)=110°C/W 0.6 0.4 0.4 T T 0.2 0.2 δ=tp/T 0.0 0 50 75 100 125 150 0 175 1.0 0.9 0.9 0.8 0.8 75 100 125 150 175 Relative variation of thermal impedance junction to ambient versus pulse duration (DO-41) 0.7 0.7 0.6 δ = 0.5 0.5 δ = 0.5 0.5 0.4 0.2 50 Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 0.3 Tamb(°C) tp 25 Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(Cu) = 35 µm, recommended pad layout) (SMA) 1.0 0.6 δ=tp/T 0.0 25 Figure 5. Tamb(°C) tp 0.4 δ = 0.2 0.3 T δ = 0.1 0.2 0.1 δ=tp/T tp(s) Single pulse 0.1 tp 0.0 T δ = 0.2 δ = 0.1 δ=tp/T tp(s) Single pulse tp 0.0 1.E-01 1.E+00 Figure 7. 1.E+01 1.E+02 1.E+03 Forward voltage drop versus forward current 1.E-01 Figure 8. IFM(A) 1.E+00 1.E+01 1.E+02 1.E+03 Junction capacitance versus reverse voltage applied (typical values) C(pF) 100.0 100 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (maximum values) 10.0 Tj=125°C (typical values) 10 Tj=25°C (maximum values) 1.0 VR(V) VFM(V) 1 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 1 10 100 1000 3/7 Characteristics Figure 9. STTH102 Reverse recovery time versus dIF/dt Figure 10. Peak recovery current versus dIF/dt (90% confidence) (90% confidence) trr(ns) IRM(A) 3.5 70 IF=1A VR=100V Tj=125°C 60 IF=1A VR=100V Tj=125°C 3.0 2.5 50 2.0 40 Tj=125°C Tj=125°C 1.5 30 Tj=25°C 1.0 20 Tj=25°C 0.5 10 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0.0 1 10 100 1000 Figure 11. Reverse recovery charges versus dIF/dt (90% confidence) 1 10 100 1000 Figure 12. Relative variations of dynamic parameters versus junction temperature Qrr(nC) IRM; trr; Qrr [Tj] / IRM; trr; Qrr [Tj =25°C] 35.0 3.5 32.5 IF=IF(AV) dIF/dt=200A/µs VR=100V IF=1A VR=100V 30.0 3.0 27.5 25.0 QRR 22.5 20.0 2.5 Tj=125°C 17.5 15.0 2.0 12.5 trr 10.0 Tj=25°C 7.5 1.5 IRM 5.0 2.5 Tj(°C) dIF/dt(A/µs) 0.0 1 10 1.0 100 1000 25 50 75 100 125 150 175 Figure 14. Thermal resistance versus lead length (DO-41) Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMA) Rth(°C/W) Rth(j-a)(°C/W) 120 120 110 110 100 100 90 90 80 80 70 70 60 60 50 50 40 40 30 30 Rth(j-a) 20 20 10 10 S(cm²) 0 Lleads(mm) 0 0.0 4/7 Rth(j-I) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 STTH102 2 Package information Package information ● Epoxy meets UL94 V0 Table 5. SMA Dimensions Dimensions Ref. E1 D E A1 A2 C L b Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 Figure 15. Footprint (dimensions in mm) 2.63 1.4 1.4 1.64 5.43 Table 6. DO-41 (Plastic) Package dimensions Dimensions Ref. ØD ØB A C A C Millimeters Inches Min. Max. Min. Max. 4.1 5.20 0.160 0.205 2.71 0.080 0.107 B 2 C 25.4 D 0.712 1 0.863 0.028 0.034 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 3 4 6/7 STTH102 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STTH102A U12 SMA 0.068 g 5000 Tape and reel STTH102 STTH102 DO-41 0.34 g 2000 Ammopack STTH102RL STTH102 DO-41 0.34 g 5000 Tape and reel Revision history Date Revision Description of Changes Jul-2003 2A Aug-2004 3 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). SMA and DO-41 datasheets merged 27-Jun-2005 4 Corrected error in title. 21-Nov-2006 5 Reformatted to current standards. Added Table 4. Dynamic electrical characteristics. Updated dimensions table for DO-41 Plastic package. Added cathode bands to package illustrations. Last update. STTH102 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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