CRG09 TOSHIBA Rectifier Silicon Diffused Type CRG09 General Purpose Rectifier Applications Unit: mm • Repetitive peak reverse voltage: VRRM = 400 V • Average forward current: IF (AV) = 1.0 A • Forward voltage: VFM = 1.1 V (max) (@IFM = 0.7 A) • High ESD Capability • Suitable for high-density board assembly due to the use of a small surface-mount package, S−FLATTM Repetitive peak reverse voltage VRRM 400 V Average forward current IF(AV) 1.0 (Note 1) A Non-repetitive peak surge current IFSM 15 (50 Hz) A Junction temperature Tj −40 to 150 °C Storage temperature Tstg −40 to 150 °C Note: Using continuously under heavy loads (e.g. the application of high the significant change in temperature, etc.) may cause this product to decrease in the 0.65 ± 0.2 0.98 ± 0.1 Unit ① 0 ~ 0.1 Rating and 0.16 + 0.2 1.6 − 0.1 Symbol temperature/current/voltage 2.6 ± 0.1 3.5 ± 0.2 0.9 ± 0.1 Absolute Maximum Ratings (Ta = 25°C) Characteristics 0.65 ± 0.2 ② ① ANODE ② CATHODE JEDEC ― JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Ta = 66°C Device mounted on a ceramic board Board size: 50 mm × 50 mm Soldering size: 2 mm × 2 mm Board thickness: 0.64 mm 1 2010-08-05 CRG09 Electrical Characteristics (Ta = 25°C) Characteristics Symbol Peak forward voltage Repetitive peak reverse current Electrostatic Discharge Capability Thermal resistance (junction to ambient) Min Typ. Max VFM (1) IFM = 0.1 A (pulse test) ⎯ 0.83 ⎯ VFM (2) IFM = 0.7 A (pulse test) ⎯ 0.95 1.1 VFM (3) IFM = 1.0 A (pulse test) ⎯ 1.00 ⎯ Unit V VRRM = 400 V (pulse test) ⎯ ⎯ 10 μA ESD(1) C = 150 pF , R = 2 kΩ, A contact electric discharge ⎯ 25 ⎯ kV ESD(2) C = 330 pF , R = 2 kΩ, A contact electric discharge ⎯ 25 ⎯ kV Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 mm) ⎯ ⎯ 65 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 mm) ⎯ ⎯ 130 ⎯ ⎯ 20 IRRM Rth (j-a) Thermal resistance (junction to lead) Test Condition ⎯ Rth (j-ℓ) °C/W °C/W Marking Part No.(or abbreviation code) Abbreviation Code Part No. G9 CRG09 Anode Cathode G9 Cathode mark and Lot code Land pattern dimensions for reference only Unit: mm 1.2 1.2 2.8 2 2010-08-05 CRG09 Handling Precaution 1) The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit incorporating this device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an allowable Ta max-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that a device be used at a Tj of below 120°C. 2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information. 3 2010-08-05 CRG09 iF – vF PF (AV) – IF (AV) 10 1.6 Average forward power dissipation PF (AV) (W) iF (A) Instantaneous forward current Half Sine Waveform Pulse test 75°C 1 -40°C 150°C 0.1 Tj = 25°C 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Instantaneous forward voltage VF 2.0 1.4 0° 1.2 1.0 0.8 0.6 0.4 0.2 0 0 2.2 0.2 0.6 0.8 1.0 IF (AV) (A) 1.2 Ta max – IF (AV) Ta max – IF (AV) Device mounted on a glass-epoxy board （board size:50mm x 50mm, Soldering land:6mm x 6mm） （board size:50mm x 50mm, Soldering land:2mm x 2mm） 160 Half Sine Waveform 140 0° 120 Maximum allowable temperature Ta max (°C) 140 Maximum allowable temperature Ta max (°C) 0.4 Average forward current (V) Device mounted on a ceramic board 160 180° Conduction angle 180° 180° Conduction angle 180° 100 80 60 40 20 120 100 80 60 Half Sine Waveform 40 20 0° 180° Conduction angle 180° 0 0 0.2 0.4 0.6 Average forward current 0.8 1.0 IF (AV) (A) 0 0 1.2 0.8 1.0 IF (AV) (A) IFSM (A) 140 120 100 80 60 Half Sine Waveform 40 0° 180° Conduction angle 180° 0.2 0.4 0.6 Average forward current 1.2 (non-repetitive) 30 Peak surge forward current Maximum allowable lead temperature Tℓ max (°C) 0.6 Surge forward current 160 0 0 0.4 Average forward current Tℓ max – IF (AV) 20 0.2 0.8 1.0 IF (AV) (A) 25 20 15 10 5 0 1 1.2 Ta = 25°C f = 50 Hz 10 100 Number of cycles 4 2010-08-05 CRG09 rth (j-a) – t Transient thermal impedance rth (j-a) (°C/W) 10000 1000 (1) Device mounted on a ceramic board: board size: 50 mm × 50 mm Soldering land: 2 mm × 2 mm Board thickness: 0.64 mm (2) Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 6 mm × 6 mm Board thickness: 1.6 mm 100 (2) (1) 10 1 0.001 0.01 0.1 1 10 100 Time t (s) 5 2010-08-05 CRG09 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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