CMS16 TOSHIBA Schottky Barrier Diode CMS16 Switching Mode Power Supply Applications Portable Equipment Battery Applications DC-DC Converter Applications Symbol Repetitive peak reverse voltage VRRM Average forward current IF (AV) Nonrepetitive peak surge current Junction temperature Storage temperature range IFSM 0.65 ± 0.2 0.16 1.75 ± 0.1 Rating Unit 40 V 3.0 (Note 1) 30 (50 Hz) A A Tj −40 to 150 °C Tstg −40 to 150 °C + 0.2 2.4 − 0.1 0.98 ± 0.1 Characteristic ① 0.65 ± 0.2 Absolute Maximum Ratings (Ta = 25°C) 3.8 ± 0.1 Forward voltage: VFM = 0.55 V (max) (@IFM = 3.0 A) Average forward current: IF (AV) = 3.0 A Repetitive peak reverse voltage: VRRM = 40 V Suitable for compact assembly due to a small surface-mount package: “M−FLATTM” (Toshiba package name)” 4.7 ± 0.2 ② 0 ~ 0.1 • • • • Unit: mm ① ANODE ② CATHODE JEDEC ⎯ Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in JEITA ⎯ temperature, etc.) may cause this product to decrease in the TOSHIBA 3-4E1A reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the Weight: 0.023 g (typ.) absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Tℓ = 106°C Device mounted on a ceramic board Board size: 50 mm × 50 mm Soldering size: 2 mm × 2 mm Board thickness: 0.64 mm Rectangular waveform (α = 180°), VR = 20 V 1 2010-08-09 CMS16 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Peak forward voltage Peak repetitive reverse current Junction capacitance Typ. Max IFM = 1.0 A (pulse test) ⎯ 0.40 ⎯ VFM (2) IFM = 3.0 A (pulse test) ⎯ 0.50 0.55 IRRM (1) VRRM = 5 V (pulse test) ⎯ 2.0 ⎯ IRRM (2) VRRM = 40 V (pulse test) ⎯ 26 200 VR = 10 V, f = 1.0 MHz ⎯ 95 ⎯ Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 mm) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 mm) ⎯ ⎯ 135 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 mm) ⎯ ⎯ 210 ⎯ ⎯ ⎯ 16 Rth (j-a) Thermal resistance (junction to lead) Min VFM (1) Cj Thermal resistance (junction to ambient) Test Condition Rth (j-ℓ) Unit V μA pF °C/W °C/W Marking Abbreviation Code Part No. SF CMS16 Land pattern dimensions for reference only 2.1 Unit: mm 1.4 3.0 1.4 2 2010-08-09 CMS16 Handling Precaution 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. SBDs can cause thermal runaway when used under high temperature or high voltage conditions. Be sure to take forward and reverse loss into consideration during design. 2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV) and that Tj be below 120°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the nonrepetitive peak current. This is applied only for abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. 3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. 4) Refer to the Rectifiers databook for further information. 3 2010-08-09 CMS16 iF – vF PF (AV) – IF (AV) 100 2.6 2.4 Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) Pulse test 30 10 T = 150°C j 3 125°C 75°C 25°C 1 0.3 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 Instantaneous forward voltage 1.4 vF DC 2.2 2.0 180° 1.8 120° 1.6 α = 60° 1.4 1.2 Rectangular waveform 1.0 0.8 0.6 0.4 0° α 360° 0.2 Conduction angle α 0 0 1.6 0.4 (V) 0.8 1.2 Tℓ max – IF (AV) Maximum allowable lead temperature Ta max (°C) α = 60° 120° 180° DC 60 40 0° α 360° IF (AV) 20 Conduction angle α VR = 20 V 0 0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 Average forward current 3.2 2.8 3.2 3.6 IF (AV) Device mounted on a ceramic board: board size: 50 mm × 50 mm soldering land: 2 mm × 2 mm board thickness: 0.64 mm 140 120 100 80 4.0 4.4 (A) Rectangular waveform 0° α 360° IF (AV) Conduction angle α VR = 20 V 120° 60 α = 60° 180° DC 40 20 0 0 3.6 4.0 4.4 IF (AV) 0.4 (A) 0.8 1.2 1.6 2.0 2.4 2.8 Average forward current 3.2 IF (AV) 3.6 4.0 4.4 (A) rth (j-a) – t 1000 Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 2.1 mm × 1.4 mm board thickness: 1.6 mm 500 Transient thermal impedance rth (j-a) (°C/W) Maximum allowable temperature Tℓ max (°C) 120 Rectangular waveform 2.4 Ta max – IF (AV) 160 140 80 2.0 Average forward current 160 100 1.6 300 100 50 Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 mm 30 10 5 Device mounted on a ceramic board: board size: 50 mm × 50 mm Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 mm 3 1 0.001 0.003 0.01 0.03 0.1 0.3 1 3 10 30 100 300 1000 Time t (s) 4 2010-08-09 CMS16 C j – VR (typ.) Surge forward current (A) Ta = 25°C 500 IFSM f = 1 MHz 100 Peak surge forward current Junction capacitance Cj (pF) 1000 50 10 5 1 1 3 5 10 Reverse voltage 30 VR 50 100 50 Ta = 25°C f = 50 Hz 40 30 20 10 0 1 3 IR – Tj (typ.) Average reverse power dissipation PR (AV) (W) (mA) Reverse current IR 10 1 40 V 30 V 20 V 10 V VR = 5 V 20 40 60 80 100 Junction temperature Tj 120 50 100 140 1.4 1.2 1.0 0.8 (°C) VR DC α Conduction angle α Tj = 150°C 300° 240° 0.6 180° 120° 0.4 0.2 0.0 0 160 α = 60° 10 20 Reverse voltage 5 (typ.) Rectangular waveform 0° 360° Pulse test 0.001 0 30 PR (AV) – VR 1.6 0.01 10 Number of cycles (V) 100 0.1 5 30 VR 40 (V) 2010-08-09 CMS16 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2010-08-09