TOSHIBA GT50J328

GT50J328
TOSHIBA Insulated Gate Bipolar Transistor
Silicon N Channel IGBT
GT50J328
Current Resonance Inverter Switching Application
Fourth Generation IGBT
•
•
•
Unit: mm
Enhancement mode type
High speed
: tf = 0.1 μs (Typ.)
Low saturation voltage : VCE (sat) = 2.0 V (Typ.)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Collector-emitter voltage
VCES
600
V
Gate-emitter voltage
VGES
±25
V
Continuous collector current
Diode forward current
DC
IC
50
1ms
ICP
120
DC
IF
30
1ms
IFP
120
PC
140
W
Tj
150
°C
Tstg
−55 to 150
°C
Collector power dissipation
(Tc = 25°C)
Junction temperature
Storage temperature range
Note:
A
A
JEDEC
―
JEITA
―
Using continuously under heavy loads (e.g. the application of
TOSHIBA
2-16C1C
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
Weight: 4.6 g (typ.)
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the
appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and
estimated failure rate, etc).
Equivalent Circuit
Marking
Collector
TOSHIBA
50J328
Gate
Part No. (or abbreviation code)
Lot No.
Emitter
Note 1
Note 1: A line under a Lot No. identifies the indication of product Labels.
[[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of
Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of
the use of certain hazardous substances in electrical and electronic equipment.
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GT50J328
Electrical Characteristics (Ta=25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGES
VGE = ±25 V, VCE = 0
―
―
± 100
nA
Collector cut-off current
ICES
VCE = 600 V, VGE = 0
―
―
1.0
mA
VGE (OFF)
IC = 50 mA, VCE = 5 V
3.0
―
6.0
V
VCE (sat)
IC = 50 A, VGE = 15 V
―
2.0
2.8
V
VCE = 10 V, VGE = 0, f = 1 MHz
―
4800
―
pF
―
0.2
―
―
0.3
―
―
0.1
0.17
―
0.4
―
Gate-emitter cut-off voltage
Collector-emitter saturation voltage
Input capacitance
Cies
tr
Rise time
Switching time
Turn-on time
ton
Fall time
30Ω
15V
0
6Ω
-15V
tf
μs
toff
Note 2
Diode forward voltage
VF
IF = 30 A, VGE = 0
―
⎯
2.0
V
Reverse recovery time
trr
IF = 30A, VGE = 0, di/dt = − 100 A/μs
⎯
⎯
0.2
µs
Turn-off time
300V
Thermal Resistance
(IGBT)
Rth (j-c)
⎯
⎯
⎯
0.89
°C/W
Thermal Resistance
(Diode)
Rth (j-c)
⎯
⎯
⎯
2.0
°C/W
Note 2: Switching time measurement circuit and input/output waveforms
VGE
90%
10%
0
RG
RL
IC
0
90%
VCC
0
90%
10%
VCE
10%
td (off)
2
tf
tr
toff
ton
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GT50J328
IC – VCE
120
Common
emitter
エ
ミッタ接地
Tc=-40℃
TC = −40°C
10
100
(A)
80
Collector current IC
Collector current IC
エミッタ接地
Common
emitter
TC = 25°C
Tc=25℃
20
15 10
9
(A)
100
IC – VCE
120
20 15
9
60
8.5
40
8
20
80
8.5
60
8
40
20
VG E=7V
VGE=7 V
0
0
0
1
2
3
Collector-emitter voltage
4
5
0
VCE (V)
1
2
IC – VCE
120
10
120
9
100
80
(A)
8.5
Collector current IC
20
(A)
Collector current IC
5
Common emitter
エミッタ接地
VCE = 5 V
VC E=5V
Tc=125℃
TC = 125°C
100
4
VCE (V)
IC – VGE
15
エミッ
タ接 地
Common
emitter
3
Collector-emitter voltage
8
60
V GE=7V
40
20
80
60
25
40
Tc=125℃
-40
20
0
0
0
1
2
3
Collector-emitter voltage
4
5
0
2
4
6
Gate-emitter voltage
VCE (V)
8
10
12
VGE (V)
VCE (sat) – Tc
Collector-emitter saturation voltage
VCE (sat) (V)
3 .5
3
エミ ッ タ接 地
Common emitter
VG E= 1 5 V
VGE = 15 V
12 0
2 .5
80
50
2
30
1 .5
IC =1 0 A
1
0 .5
0
-50
0
50
1 00
150
Case temperature Tc (°C)
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GT50J328
VCE, VGE – QG
C – VCE
20
200
10
VCE = 300 V
100
5
100
0
0
200
80
160
1000
Coes
100
Common emitter
VGE = 0
f = 1MHz
TC = 25°C
10
0
320
240
Cies
(pF)
15
Capacitance C
300
10000
VGE (V)
エミッタ接地
Common
emitter
RLR=L 6= Ω
6Ω
= 25°C
TcTC
= 25°C
Gate-emitter voltage
Collector-emitter voltage
VCE (V)
400
0.1
Gate charge QG (nC)
1
Common emitter
VCC = 300 V
IC = 50 A
VGG = ± 15 V
TC = 25°C
VCE (V)
toff
toff
Switching time (μs)
Switching time (μs)
1000
Switching Time – IC
ton
tr
tf
0.1
tr
ton
tf
0.1
Common emitter
VCC = 300 V
RG = 30 Ω
VGG = ± 15 V
TC = 25°C
0.01
0.01
1
10
100
Gate resistance
RG
0
1000
(Ω)
10
20
IC max
(continuous)
(A)
1000
1ms*
100μs*
10μs*
10
DC
operation
1
50
60
(A)
Reverse bias SOA
Collector current IC
(A)
100
10ms*
40
3000
*: Single non-repetitive
pulse Tc = 25°C
Curves must be derated linearly with
increases in temperature.
IC max (pulsed) *
30
Collector current IC
Safe Operating Area
1000
Collector current IC
100
1
1
1
10
Collector-emitter voltage
Switching Time – RG
10
Cres
10
100
Collector-emitter voltage VCE (V)
500
300
Tj ≤ 125°C
VGG = 20 V
RG = 10 Ω
100
50
30
10
5
3
1
1
1000
10
100
Collector-emitter voltage
4
1000
10000
VCE (V)
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GT50J328
(°C/W)
VGE = 15V
50
40
30
20
10
100
125
150
IGBT部
IGBT
−1
10
−2
Curves should be applied in
Tc=25℃(無限大放熱板使用)
thermal limited area.
Single non-repetitive pulse
本データは、熱抵抗制限領域にのみ適
TC = 25°C (infinite heat sink)
用されます。(単発パルス測定)
10
−3
10
−5
10
−4
10
−3
10
Case temperature Tc (°C)
−2
10
Pulse width
IF - V F
Irr (A)
Common collector
VGE = 0
40
30
20
25
Tc = 125℃
10
-40
0
0.4
0.8
1.2
Diode forward voltage VF
1.6
2.0
500
30
300
trr
10
100
5
50
3
30
Irr
0
(V)
Common collector
di/dt = -100 A/µs
VGE = 0
Tc = 25°C
5
10
Peak reverse recovery current
100
50
30
10
5
5
10
30
Reverse voltage
25
10
30
(A)
50
VR
100
200
8
6
trr
100
4
2
0
0
300 500
コレクタ接地
Common
collector
IF =IF30
AA
= 30
= 25°C
Tc T
=c25°C
10
trr
Irr (A)
Tc = 25°C
3
20
Irr, trr – di/dt
f = 1 MHz
300
3
1
15
Diode forward current IF
Cj
(pF)
500
2
10
50
Cj – VR
1000
1
10
tw (s)
1
0
Junction capacitance
0
10
Irr, trr – IF
Peak reverse recovery current
Diode forward current
IF (A)
50
−1
10
(ns)
75
0
10
trr
50
ダイオード部
Diode
Reverse recovery time
25
1
10
(ns)
0
10
Irr
40
80
120
160
Reverse recovery time
60
rth(j-c) - tw
2
Common emitter
Transient thermal impedance rth(j-c)
Maximum DC collector current IC max
(A)
IC max – Tc
70
0
200
di/dt (A/µs)
(V)
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GT50J328
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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