TLRA270 TOSHIBA LED Lamp GaAℓAs Red−light Emitter TLRA270 Auxiliary Light Source For Auto−focus Camera Unit: mm · Resin molding with accurate luminous position · LED in DH structure yielding high radiant flux · Harmonious wavelength of visual sensitivity and detective device · Pulse drive rating and characteristic expression optimized for use in cameras Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Forward current IF (Note 1) 25 mA Pulse forward current IFp (Note 2) 165 mA Reverse voltage VR 3 V TOSHIBA Operating temperature Topr −20~50 °C Weight: 0.16 g (typ.) Storage temperature Tstg −30~100 °C (Note 1): This rating is the parmissible value for acceptance inspection or characteristic test and is not guaranteed for actual use. (Note 2): ● Rated pulse current values corresponding to temperature changes are as shown in the following table: Temperature ● Pin Connection IFP -20°C 165 mA + 15% 25°C 165 mA 45°C 165 mA -10% 1 2 1. 2. Cathode Anode The rated period is 3000 cycles of the waveform shown in the following diagram : 200ms 150ms On Off IFP 10 Pulses 3.5s 1 cycle 1 5s 2002-09-25 TLRA270 Optical And Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Forward voltage VF IF = 20 mA ¾ 1.8 ¾ V Pulse forward voltage VFP IFP = 150 mA, t = 10 ms ¾ 2.7 3.2 V VR = 3 V ¾ ¾ 100 µA Reverse current IR Lens diameter ¾ Resin lense diameter ¾ 2 ¾ mm Radiant flux fe IF = 150 mA, t = 10ms (Note) 12 18 ¾ mW Directional half value angle θ IF = 70 mA ¾ 30 ¾ ° Peak emission wave length λP IF = 70 mA, about 3 s 680 695 710 nm Spectral line half width ∆λ IF = 70 mA, about 3 s ¾ 28 35 nm (Note): Radiant flux fe depends on position of TLRA270 relative to light-receiving surface. φ20mm 23.5mm TLRA270 Detector Precautions Please be careful of the followings. 1. Soldering temperature : 260°C max Soldering time : 5 s max (soldering portion of lead: at above 1.5 mm from the body of the device) 2. When forming the leads, bend each lead under the 2mm from the body of the device. Soldering shall be performed after lead forming. 3. Do not apply stress to the leads for at least 30 s after soldering them. 4. The TLRA270 for a camera AF use only. Please do not use this device except for a camera. 2 2002-09-25 TLRA270 IFP – VFP IFP – Ta 200 80 40 0 -40 -20 0 20 40 50 Ta = 50°C 30 25 0 10 5 0.8 80 60 DUTY= 1/2 f = 3Hz (mA) 120 1.2 1.6 2.0 2.4 Pulse forward voltage VFP Ambient temperature Ta (°C) Wavelength Characteriistic (typ.) 100 IFP 160 Pulse forward current (pulse waveform is at the maximum rating) Allowable pulse forward current IFP (mA) 200 2.8 3.2 (V) Directional Sensitivity Characteristics (typ.) (typ.) IF = 70mA 1.0 Ta = 25°C (Ta = 25°C) Relative intensity 0.8 20° 10° 0° 10° 20° 30° 0.6 30° 40° 40° 50° 50° 0.4 60° 60° 70° 70° 0.2 80° 80° 0 620 640 660 700 680 Wave length λ φe – Ta 740 720 90° 760 0 0.2 0.4 0.6 0.8 90° 1.0 Relative intensity (nm) (typ.) 5 φe = 1 at Ta = 25°C Relative radiant flux φe 3 1 0.5 0.3 -40 -20 0 20 40 60 Ambient temperature Ta (°C) 3 2002-09-25 TLRA270 RESTRICTIONS ON PRODUCT USE 000707EAC · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 4 2002-09-25