TCD1304DG TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) Preliminary TCD1304DG The TCD1304DG is a high sensitive and low dark current 3648 −elements linear image sensor. The sensor can be used for POS scanner. The device consist of sensitivity CCD chip. The TCD1304DG has electronic shutter function (ICG). Electronic shutter funtion can keep always output voltage constant that vary with intensity of lights. FEATURES Pixel Number : 3648 Pixel Size : 8µm×200µm Photo Sensing Region Weight: (3.5g (Typ.)) : High Sensitive & Low Dark Current pn Photodiode Internal Circuit : CCD Drive Circuit Power Supply : Only 3.0V Drive (MIN.) Function : Electronic Shutter Sample and Hold Circuit Package : 22 Pin CERDIP PACKAGE PIN CONNECTION MAXIMUM RATINGS (Note 1) CHARACTERISTIC SYMBOL RATING UNIT −0.3~7 V Master Clock Pulse Voltage VφM SH Pulse Voltage VSH ICG Pulse Voltage VICG Digital Power Supply VDD Analog Power Supply VAD Operating Temperature Topr −25~60 °C Storage Temperature Tstg −40~100 °C Note: All voltage are with respect to SS terminals. (Ground) 1 (TOP VIEW) 2004-01-06 TCD1304DG CIRCUIT DIAGRAM PIN NAMES φM Master Clock SH Shift Gate ICG Integration Clear Gate VAD Power (Analog) VDD Power (Digital) SS Ground NC Non Connection 2 2004-01-06 TCD1304DG OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25°C, Vφ = 4.0V (PULSE), f φ = 0.5MHz, tINT (INTEGRATION TIME) = 10ms, LOAD RESISTANCE = 100kΩ, VAD = VDD = 4.0V, LIGHT SOURCE = DAYLIGHT FLUORESCENT LAMP) CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT R 110 160 ― V / lx·s PRNU ― ― 10 % (Note 2) RI ― ― 3 % (Note 3) Saturation Output Voltage VSAT 450 600 ― mV VOD = 3.0V (Note 4) Dark Signal Voltage VMDK ― 2 5 mV (Note 5) Total Transfer Effeiciency TTE 92 95 ― % Dynamic Range DR ― 300 ― ― (Note 6) Saturation Exposure SE ― 0.004 ― lx·s (Note 7) DC Power Dissipation PD ― 25 75 mW DC Signal Output Voltage VOS 1.5 2.5 3.5 V Zo ― 0.5 1.0 kΩ VLAGICG ― ― 10 mV Sensitivity Photo Response Non Uniformity Register Imbalance Output Impedance Image Lag of Electronic Shutter NOTE (Note 8) Tint=100µs Note 2: Measured at 50% of SE (Typ.) Definition of PRNU: PRNU = ∆χ χ × 100(%) Where χ is average of total signal outputs and ∆χ is the maximum deviation from χ under uniform illumination. Note 3: Measured at 50% of SE (Typ.) RI is defined as follows: 3647 ∑ χn − χn + 1 RI = n=1 × 100(%) 3647·χ Where χ n and χ n+1 are signal outputs of each pixel. χ is average of total signal outputs. Note 4: VSAT is defined as minimum saturation output voltage of all effective pixels. Note 5: VMDK is defined as maximum dark signal voltage of all effective pixels. 3 2004-01-06 TCD1304DG Note 6: Definition of DR : DR = VSAT VMDK VMDK is proportional to tINT (Integration time). So the shorter tINT condition makes wider DR value. Note 7: Definition of SE : SE = VSAT (lx·s) R Note 8: DC signal output voltage is defined as follows: . 4 2004-01-06 TCD1304DG OPERATING CONDITION CHARACTERISTIC SYMBOL “H” Level Master Clock Pulse Voltage “L” Level “H” Level SH Pulse Voltage “L” Level “H” Level ICG Pulse Voltage “L” Level VφM VSH VICG MIN TYP. MAX 3.0 4.0 5.5 0 0 0.44 3.0 4.0 5.5 0 0 0.44 3.0 4.0 5.5 0 0 0.44 UNIT V V V Digital Power Supply VDD 3.0 4.0 5.5 V Analog Power Supply VAD 3.0 4.0 5.5 V SYMBOL MIN TYP. MAX UNIT fφM 0.8 2 4 MHz fDATA 0.2 0.5 1 MHz Master Clock Capacitance CφM ― 10 ― pF Shift Pulse Capacitance CSH ― 600 ― pF ICG Pulse Capacitance CICG ― 250 ― pF SYMBOL MIN TYP. MAX UNIT fφM 0.8 2 2.4 MHz fDATA 0.2 0.5 0.6 MHz Note: VAD = VDD MAX. Voltage of Pulse Voltage “H” Level = VDD MIN. Voltage of Pulse Voltage “H” Level = VDD−0.5V CLOCK CHARACTERISTICS (Ta = 25°C) (VAD = VDD≥4.0V) CHARACTERISTIC Master Clock Frequency Data Rate CLOCK CHARACTERISTICS (Ta = 25°C) (4.0V>VAD = VDD≥3.0V) CHARACTERISTIC Master Clock Frequency Data Rate 5 2004-01-06 TIMING CHART 6 TCD1304DG 2004-01-06 TCD1304DG−6 TIMING CHART (Use electric shutter function) 7 TCD1304DG 2004-01-06 TCD1304DG−7 TCD1304DG TIMING REQUIREMENTS CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT ICG Pulse DELAY t1 1000 5000 ― ns Pulse Timing of ICG and S H t2 100 500 1000 ns SH Pulse Width t3 1000 ― ― ns Pulse Timing of ICG and φ M t4 0 20 * ns *: Note: You keep φM “High” Level. If you use electronic shutter function. tINT (MIN.) = 10µs 8 2004-01-06 TCD1304DG USE ELECTRONIC SHUTTER Pulse Timing of SH and ICG • SH cycle = Tint tINT (MIN.) = 10µs You have always same SH pulse width (t3). 9 2004-01-06 TCD1304DG TYPICAL PERFOMANCE CURVES 10 2004-01-06 TCD1304DG TYPICAL PERFOMANCE CURVES 11 2004-01-06 TCD1304DG TYPICAL DRIVE CIRCUIT TCD1304D 12 2004-01-06 TCD1304DG CAUTION 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or within three seconds for lead temperatures of up to 350°C. 13 2004-01-06 TCD1304DG PACKAGE DIMENSIONS Unit : mm Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) Weight: (3.5g (Typ.)) 14 2004-01-06 TCD1304DG RESTRICTIONS ON PRODUCT USE 000707EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • The products described in this document are subject to the foreign exchange and foreign trade laws. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. 15 2004-01-06