TCD2000P TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) TCD2000P The TCD2000P is a high sensitive and low dark current 480−elements color linear image sensor which includes CCD drive circuit, clamp circuit and sample & hold circuit. The CCD drive circuit consists of the pulse generator. therefore it is possible to easy drive by applying simple pulses. The sensor is designed for scanner. FEATURES l Number of Image Sensing Elements : 480 elements (160×3 color sequential) l Image Sensing Element Size : 11µm×33µm on 33µm centers l Photo Sensing Region : High sensitive pn photodiode Weight: 1.0g (Typ.) l Clock : 3 Input pulses 5V l Internal Circuit : Sample & Hold circuit, Clamp circuit l Package : 20 pin l Color Filter : Red, Green, Blue PIN CONNECTION MAXIMUM RATINGS CHARACTERISTIC SYMBOL Master Clock Voltage VφM Clock Pulse Voltage Vφ Shift Pulse Voltage VSH Reference Voltage VREF Power Supply Voltage (Analog) VAD Power Supply Voltage (Digital) VDD1 RATING UNIT −0.3~8 V −0.3~15 V VDD2 Sample & Hold Switch Voltage VSP −0.3~15 V Operating Temperature Topr 0~60 °C Storage Temperature Tstg −25~85 °C (TOP VIEW) Note 1: All voltage are with respect to SS terminals (Ground). 1 2002-03-08 TCD2000P CIRCUIT DIAGRAM PIN NAMES φM Master Clock VAD Power (Analog) φ1 Clock (Phase 1) VDD1 Power (Digital, 12V) φ2 Clock (Phase 2) VDD2 Power (Digital, 12V) SH Shift Gate SS Ground (Analog) OS Signal Output SS1 Ground (Digital, 12V) DOS Compensation Output SS2 Ground (Digital, 12V) VREF Reference Voltage Input VSP Sample and Hold Switch NC Non Connection 2 2002-03-08 TCD2000P OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25°C VREF = VAD = VDD1 = VDD2 = 12V, VφM = Vφ = VSH = 5V (PULSE), fφ = 1.0MHz, tINT (INTEGRATION TIME) = 10ms, LIGHT SOURCE = A LIGHT SOURCE+CM500S FILTER, LOAD RESISTANCE = 100Ω) CHARACTERISTIC SYMBOL MIN TYP. MAX RB 3.7 5.3 6.9 RG 8.4 12.0 15.6 RR 4.6 6.6 8.7 PRNU (1) ― 10 20 % (Note 2) PRNU (3) ― 3 12 mV (Note 3) VSAT 1.2 2.0 ― V (Note 4) Saturation Exposure SE ― 0.17 ― lx·s (Note 5) Dark Signal Voltage VDRK ― 12 25 mV (Note 6) Dark Signal Non Uniformity DSNU ― 5 10 mV (Note 6) Analog Current Dissipation IAD ― 12 18 mA IDD1 ― ― 1 mA IDD2 ― 13.5 20 mA Input Current of VREF IREF ― ― 1 mA Total Transfer Efficiency TTE 92 ― ― % ZO ― 0.5 1.0 kΩ VOS 4.5 6.0 7.5 V (Note 7) VDOS 4.5 6.0 7.5 V (Note 7) |VOS−VDOS| 0 ― 100 mV Sensitivity Photo Response Non Uniformity Saturation Output Voltage Digital Current Dissipation Output Impedance DC Signal Output Voltage DC Compensation Output Voltage DC Differential Error Voltage UNIT NOTE V / lx·s Note 2: PRNU (1) is measured at 50% of SE (Typ.) Definition of PRNU : PRNU = ,? ? 100 (%) Where ? is average of total signal outputs and ,? is the maximum deviation from ? under uniform illumination. Note 3: PRNU (3) is defined as maximum voltage with next pixel where measured 5% of SE (Typ.) Note 4: VSAT is defined as minimum Saturation Output Voltage of all effective pixels. Note 5: Definition of SE : SE = V SAT R (lx·s) Note 6: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. 3 2002-03-08 TCD2000P Note 7: DC signal output voltage and DC compensation output voltage are defined as follows:. OPERATING CONDITION CHARACTERISTIC SYMBOL “H” Level Master Clock Pulse Voltage “L” Level Clock Pulse Voltage MAX 4.5 5.0 5.5 0 ― 0.5 UNIT V Vφ1 4.5 5.0 5.5 “L” Level Vφ2 0 ― 0.5 Vφ−0.5 Vφ Vφ 0 ― 0.5 4.5 5.0 13.0 0 ― 0.5 VREF 11.4 12.0 13.0 V V “L” Level Sample and Hold Switch Voltage* TYP. “H” Level “H” Level Shift Pulse Voltage VφM MIN “H” Level “L” Level Reference Voltage Power Supply Voltage (Analog) Power Supply Voltage (Digital) VSH VSP VAD 11.4 12.0 13.0 VDD1 11.4 12.0 13.0 VDD2 11.4 12.0 13.0 V V V V (*) Supply “H” Level to VSP terminal when sample−and−hold circuit is used, when sample−and−hold circuit is not used supply “L” Level to VSP terminal. CLOCK CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Master Clock Pulse Frequency Clock Pulse Frequency Master Clock Pulse Capacitance Clock Capacitance Shift Gate Capacitance 4 SYMBOL MIN TYP. MAX UNIT fφM ― 2.0 6.0 MHz fφ ― 1.0 3.0 MHz CφM ― 10 20 pF Cφ ― 100 200 pF CSH ― 50 100 pF 2002-03-08 TIMING CHART TCD2000P 5 2002-03-08 TCD2000P TIMING REQUIREMENTS 6 2002-03-08 TCD2000P SYMBOL MIN TYP. (Note 2) MAX UNIT t1 60 300 ― ns t5 0 300 ― ns t2, t4 0 50 ― ns SH Pulse Width t3 300 1000 ― ns Pulse Timing of SH and φM t6 20 50 ― ns t9, t10 0 20 ― ns t11, t13 20 100 ― ns t8, t12, t14 40 100 ― ns t7, t15, t16 0 20 ― ns t17, t18 80 250 ― ns t19 ― 45 ― ns t20, t21 ― 70 ― ns CHARACTERISTIC Pulse Timing of SH and φ1, φ2 SH Pulse Rise Time, Fall Time φ1, φ2 Pulse Rise Time, Fall Time Pulse Timing of φ1, φ2 and φM φM Pulse Rise Time, Fall Time φM Pulse Width Video Data Delay Time (Note 3) S / H Video Data Delay Time Note 2: TYP. is the case of fφ=1MHz. Note 3: Load Resistance is 100kΩ. ELEMENT SHAPE Unit: mm 7 2002-03-08 TCD2000P TYPICAL DRIVE CIRCUIT 8 2002-03-08 TCD2000P CAUTION 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or within three seconds for lead temperatures of up to 350°C. 9 2002-03-08 TCD2000P PACKAGE DIMENSIONS Note1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note3: TOP OF CHIP TO OF PACKAGE. Note4: GLASS THICKNESS (n=1.5) Note5: No. 1 SENSOR ELEMENT (S1) TO CENTER OF No. 1 PIN. Weight: 1.0g (Typ.) 10 2002-03-08 TCD2000P RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 11 2002-03-08