TB62801F TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic TB62801F Linear CCD Clock Driver TB62801F is a clock distribution driver for CCD linear image sensors. The IC can functionally drive the CCD input capacitance. It also supports inverted outputs, eliminating the need for crosspoint control. The IC contains a 1 to 4 clock distribution driver for the main clock and 4-bit buffers for control signals. Features • High drivability: Guaranteed driving 450 [pF] load capacitance @fclock = 20 [MHz] • Operating temperature range: Ta = −25°C to 60°C Weight: 0.5 g (typ.) Pin Connection (top view) 2B_ out 1 16 2B_out 2B_in 2 15 CP_out CP_in 3 14 φ VCC 4 13 φ GND GND VCC 5 12 φ CK_in 6 11 φ SH_in 7 10 SH_out RS_in 8 9 RS_out 1 2006-06-13 TB62801F Logic Diagram 2B_ out 2B_in 2B_out CP_in CP_out φ φ CK_in φ φ SH_in SH_out RS_in RS_out Pin Description Pin No. Pin Name 1 2B_ out 2 3 Functions Remarks Light-load drive output (inverted) Driver output for CCD last-stage clock 2B_in Light-load drive input Driver input for CCD last-stage clock CP_in Light-load drive input CCD clamp gate driver input VCC Power supply ― GND Ground ― 5 VCC Power supply ― 6 CK_in Heavy-load drive input Driver input for CCD transfer clock 7 SH_in Light-load drive input CCD shift gate driver input 8 RS_in Light-load drive input CCD reset gate driver input 4 9 RS_out Light-load drive output (not inverted) CCD reset gate driver output 10 SH_out Light-load drive output (not inverted) CCD shift gate driver output 11 φ Heavy-load drive output (not inverted) Driver output for CCD transfer clock Heavy-load drive output (inverted) Driver output for CCD transfer clock 12 φ GND Ground ― 13 φ Heavy-load drive output (inverted) Driver output for CCD transfer clock 14 φ Heavy-load drive output (not inverted) Driver output for CCD transfer clock 15 CP_out Light-load drive output (not inverted) CCD clamp gate driver output 16 2B_out Light-load drive output (not inverted) Driver output for CCD last-stage clock 2 2006-06-13 TB62801F Truth Table Input Output L H 2B_in L H L CP_in H L H CK_in L H L SH_in H L RS_in H H 2B_ out L L 2B_out H L CP_out H L φ H H φ L L SH_out H L RS_out H Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit VCC −0.5 to 7.0 V Input voltage VIN −1.2 to VCC+0.5 V Output voltage VO −0.5 to VCC V Input clamp diode current (Vi < 0) IIK −50 mA Power supply voltage Output clamp diode current (VO < 0) IOK −50 mA High level IOH (O/ O ) −16.0 mA excluding other Low level than φ, φ outputs IOL (O/ O ) 16.0 mA High level IOH (φ/ φ ) −100 mA Low level IOL (φ/ φ ) 150 mA Operating temperature Topr −25 to 60 ℃ Storage temperature Tstg −40 to 100 ℃ Junction temperature Tj 150 ℃ Power dissipation PD 1.5 W Output current φ output current Note: Output current is specified as follows: VOH = 4.0 V, VOL = 0.5 V. 3 2006-06-13 TB62801F Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Power supply voltage VCC 4.7 5.0 5.5 V Input voltage VIN 0 ⎯ VCC V VO 0 ⎯ VCC V High level IOH (O/ O ) ⎯ ⎯ −8.0 mA Low level IOL (O/ O ) ⎯ ⎯ 8.0 mA High level IOH (φ/ φ ) ⎯ ⎯ −20.0 mA (Note) Low level IOL (φ/ φ ) ⎯ ⎯ 20.0 mA Operating temperature Topr −25 25 60 °C Input rise/fall time tri/tfi ⎯ 2.5 5.0 ns Output voltage Output current excluding φ, φ outputs φ output current Note: Output current is specified as follows: VCC = 4.7 V, VOH = 4.5 V, VOL = 0.2 V. Input rise/fall time is specified as 10 % to 90 % of waveform amplitude. Electrical Characteristics DC Characteristics (unless otherwise specified, VCC = 4.7 to 5.5 V, Ta = −25 to 60°C) Characteristic Input voltage Symbol High VIH Low VIL Input clamp voltage Test Circuit 3 VOH (φ/ φ ) 4, 5 φ output voltage 6, 7 VOH (O/ O ) 4, 5 VOL (O/ O ) 6, 7 IIN 8 Output voltage excluding φ, φ outputs Input voltage VCC Min Typ. Max ⎯ 4.7 2.0 ⎯ VCC ⎯ 4.7 0 ⎯ 0.8 IIK = −30 mA 4.7 ⎯ ⎯ 1.0 IOH = −10 mA 4.7 4.5 ⎯ VCC IOH = −50 mA 4.7 4.0 ⎯ VCC IOH = −300 mA 4.7 2.5 ⎯ VCC IOL = 100 µA 4.7 0 ⎯ 0.2 1, 2 VIK VOL (φ/ φ ) Test Condition IOL = 50 mA 4.7 0 ⎯ 0.5 IOL = 300 mA 4.7 0 ⎯ 2.5 IOH (O / O ) = −4 mA 4.7 4.5 ⎯ VCC IOH (O / O ) = −16 mA 4.7 4.0 ⎯ VCC IOL (O / O ) = 4 mA 4.7 0 ⎯ 0.2 IOL (O / O ) = 16 mA 4.7 0 ⎯ 0.5 VIN = VCC or GND 5.5 ⎯ ⎯ 1.0 φ outputs: Low or High Other outputs are High 5.5 ⎯ ⎯ 15.0 Unit V V V V µA φ outputs: High or Low Static current consumption Total Each bit Output off mode supply voltage ICC 9 mA ∆ICC 10 One input: VIN = 0.5 V Other inputs: VCC or GND ⎯ ⎯ ⎯ 1.5 VPOR ⎯ See description on next page. ⎯ ⎯ 3.0 ⎯ 4 V 2006-06-13 TB62801F Output Low-Level Fixed Mode at Power On • To avoid malfunction at power on, this IC incorporates the following functions: All outputs are fixed to low level until VCC reaches more than 3 V. • When VCC reaches 3 V (typ.), the internal logic depends on input signals. • VCC must be more than 4.7 V for normal operation. Supply voltage Power Pulse generator VCC VCC 3V DUT Output signal waveform GND Additional circuit (P.O.R) test circuit Time Output signal waveform Low-level state AC Characteristics (input transition rise or fall time: tr/tf = 2.5 ns) Characteristic Symbol tpLH (φ/ φ ) tpHL (φ/ φ ) Typ. Max Min Max 7.0 10.0 14.0 7.0 16.0 CL = 350 pF 6.0 9.0 13.0 6.0 15.0 CL = 450 pF 7.0 10.0 14.0 7.0 16.0 Reference Measurement Diagram ns Measurement diagram 1 ns Measurement diagram 2 6.0 9.0 13.0 6.0 15.0 3.0 5.0 7.0 2.5 8.0 CL = 15 pF 2.0 4.0 6.0 1.5 7.0 CL = 30 pF 3.0 5.0 7.0 2.5 8.0 CL = 15 pF 2.0 4.0 6.0 1.5 7.0 to (skw) CL = 30 pF 0 ⎯ 2.0 ⎯ 2.0 ns Measurement diagram 3 VT (crs) CL = 300 to 450 pF ⎯ ⎯ ⎯ 1.5 ⎯ V Measurement diagram 4 tpHL (O/ O ) Output crosspoints (φ1/φ2) Min CL = 450 pF Unit CL = 30 pF tpLH (O/ O ) φ, φ outputs All Temperatures/ VCC = 4.7 to 5.5 V CL = 350 pF Propagation delay time Output skew excluding Test Condition Normal Temperature/ VCC = 5.0 V 5 2006-06-13 TB62801F Waveform Measuring Point Propagation Delay Time Setting Input signal • 2B_in • CK_in • SH_in • RS_in • CP_in tri tfi 90% 1.5 V 3.0 V 90% 1.5 V 10% 10% GND VCC − 0.5 V tpLH (O) Measurement Diagram 1 VCC tpHL (O) Output signal •φ GND + 0.5 V Output signal •φ tpHL ( O ) VCC − 0.5 V tpLH ( O ) VCC GND + 0.5 V Measurement Diagram 2 GND VCC − 0.5 V Output signal • 2B_out • CP_out • SH_out • RS_out tpLH (φ1) VCC tpHL (φ1) GND + 0.5 V tpHL (φ2) Output signal • 2B_out GND VCC − 0.5 V tpLH (φ2) GND VCC GND + 0.5 V GND Measurement Diagram 3 Output signal • 2B _ out • 2B_out • CP_out • SH_out • RS_out VCC GND to (skw) to (skw) Output Waveform Crosspoint/Level Setting Measurement Diagram 4 •φ VOH VT (CRS) VOL •φ 6 GND 2006-06-13 TB62801F Reference Data (typ. value) tpLH (φ), tpHL (φ) – CL (characteristics of 1-output, other outputs: no load) 120 Note: Propagation delay time is 11 specified in accordance with the attached sheet. 10 VCC = 5.0 V, Ta = 25°C, tri/tfi = 2.5 ns 100 Frequency (MHz) Propagation delay time (ns) 12 Load capacitance versus maximum operating frequency (all bits in operation) VCC = 5.0 V, Ta = 25°C, tri/tfi = 2.5 ns 9 8 7 6 5 4 50 150 250 350 Capacitance 450 550 650 80 60 40 Note: Maximum operating frequency: Under specified load conditions, the frequency when the pulse width of the output signal matches that of the input signal; or 20 the frequency at which the specified amplitude is obtained. Note that light-load bits are fixed to a capacitance of 30 pF. 0 50 100 150 200 250 300 350 400 (pF) Capacitance Frequency versus power dissipation, temperature (@all outputs: maximum load capacitance) 1.4 PD – Ta Mounted on test board 1.4 0.6 Note: CL (φ/ φ ) = 450 pF, CL = (O/ O ) = 30 pF Output amplitude = 4.5 V Supply voltage = 5.5 V Mounted on 50 mm × 50 mm glass-epoxy board 0.4 0.2 5.0E + 6 1.0E + 7 1.5E + 7 40 20 1.0 (W) 60 0.8 1.2 IC only 0.8 PD 1.0 (°C) Power dissipation (W) 80 Rise in temperature Rise in temperature 0.0 0.0E + 0 0.6 0.4 Note: Test board: 50 mm × 50 mm 0.2 glass-epoxyboard. 0.0 0 0 2.0E + 7 25 Frequency (Hz) 0.0 (A) VCC = 4.7 V IOH 0.8 High-level output current Low-level output current IOL (A) Ta = 25°C 0.6 0.4 0.2 2.0 3.0 Low-level output voltage 75 100 125 150 (°C) φ/ φ output IOH – VOH 1.0 1.0 50 Ta φ/ φ output IOL – VOL 0.0 0.0 (pF) 1.6 100 Power dissipation 1.2 450 4.0 VOL Ta = 25°C VCC = 4.7 V −0.2 (*) Subtract amplitude voltage with VCC as reference. −0.4 −0.6 −0.8 −1.0 −5.0 5.0 (V) −4.0 −3.0 −2.0 High-level output voltage 7 −1.0 VOH 0.0 (V) 2006-06-13 TB62801F Test Circuit DC Parameters Pins marked with an asterisk (*) are test pins. However, ground any input pins that are not being used as test pins so that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way. • VIH/VIL (1) Light-load drive bit 4.7 V 0 to VCC (2) 1 16 ♦ 2 15 ♦ 3 14 4 13 5 12 6 11 ♦ 7 10 ♦ 8 9 1 16 2 15 3 14 4 13 5 12 ♦ 6 11 7 10 8 9 E.g., oscilloscope 30 pF Heavy-load drive bit 4.7 V 0 to VCC 8 E.g., oscilloscope 450 pF 2006-06-13 TB62801F • VIK 4.7 V 1 16 ♦ 2 15 ♦ 3 14 4 13 5 12 ♦ 6 11 ♦ 7 10 ♦ 8 9 −30 mA V Note 1: When measuring input pins, connect the input pins that are not being measured to GND. • VOH (O/φ) 4.7 V 1 16 ♦ 2 15 ♦ 3 14 ♦ 4 13 5 12 6 11 ♦ 7 10 ♦ 8 9 ♦ V 9 O output: −4/−16 mA φ output: −10/−50/−300 mA 2006-06-13 TB62801F • VOH ( O / φ ) 4.7 V • ♦ 1 16 2 15 3 14 4 13 ♦ 5 12 ♦ 6 11 7 10 8 9 1 16 ♦ 2 15 ♦ 3 14 ♦ 4 13 V O output: −4/−16 mA φ output: −10/−50/−300 mA VOL (O/φ) 4.7 V 4.7 V 5 12 6 11 ♦ 7 10 ♦ 8 9 ♦ O output: 4/16 mA φ output: 100 µA/50/300 mA V 10 2006-06-13 TB62801F • VOL ( O / φ ) 4.7 V 4.7 V ♦ 1 16 2 15 3 14 4 13 ♦ O output: 4/16 mA φ output: 100 µA/50/300 mA V • 5 12 ♦ 6 11 7 10 8 9 1 16 ♦ 2 15 ♦ 3 14 4 13 5 12 ♦ 6 11 ♦ 7 10 ♦ 8 9 IIN 5.5 V 5.5 V A A Note: When measuring input pins, connect the input pins that are not being measured to GND. 11 2006-06-13 TB62801F • ICC 5.5 V A 3V 1 16 2 15 3 14 ♦ 4 13 ♦ 5 12 6 11 7 10 8 9 Note 1: The input logic of the heavy-load drive clock input pin (pin 6) is the same for High or Low. • ∆ICC VCC A 0.5 V 1 16 2 15 3 14 ♦ 4 13 ♦ 5 12 6 11 7 10 8 9 Note 2: When measuring input pins, connect the input pins that are not being measured to GND or power. 12 2006-06-13 TB62801F AC Parameters Pins marked with an asterisk (*) are test pins. Ground the input pins that are not being used as test pins so that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way. • Propagation Delay Time (1) Light-load drive bit VCC 0 to 3 V (2) ♦ 1 16 ♦ 2 15 ♦ 3 14 4 13 5 12 6 11 7 10 ♦ 8 9 ♦ 1 16 2 15 3 14 ♦ 4 13 ♦ 5 12 ♦ 6 11 ♦ 7 10 8 9 E.g., oscilloscope 15/30 pF Heavy-load drive bit VCC 0 to 3 V 13 E.g., oscilloscope 350/450 pF 2006-06-13 TB62801F • Light-Load Drive Output Skew 30 pF VCC 0 to 3 V ♦ 1 16 ♦ 2 15 ♦ 3 14 4 13 30 pF 30 pF E.g., oscilloscope 5 12 6 11 7 10 ♦ 8 9 ♦ 30 pF 30 pF • Heavy-Load Drive Output Crosspoints VCC 1 16 2 15 3 14 ♦ 4 13 ♦ CL CL E.g., oscilloscope 0 to 3 V 5 12 ♦ 6 11 ♦ 7 10 8 9 CL CL CL = 300 to 450 pF 14 2006-06-13 TB62801F Example of an Application Circuit (1) Connection to the TCD1503C Signal output 1 OS1 SS OD RS φ2B CP NC NC φ20 φ10 NC 2B_ out Last transfer clock signal input 2B_in Clamp gate signal input 5V CP_in VCC 1 1 22 2 21 3 20 4 19 5 18 6 7 TCD1503C 12 V Signal output 2 17 16 8 15 9 14 10 13 11 5000 12 1 16 2 15 3 14 4 13 GND VCC Transfer clock signal input Shift gate signal input Reset gate signal input Note: CK_in SH_in RS_in OS2 SS RS SH φ2B CP NC SS φ2E φ1E NC 2B_out CP_out φ φ GND 5 12 6 11 7 10 8 9 φ φ SH_out RS_out Driving the CCD requires a lot of power. Toshiba recommends the use of a bypass capacitor connected to the 5 V power supply to stabilize voltage. Precautions on Use This product does not include built-in protection circuits for excess current or overvoltage. If the IC is subjected to excess current or overvoltage, it may be destroyed. Therefore systems incorporating the IC should be designed with the utmost care. Particular care is necessary in the design of the output, VCC and GND lines since the IC may be destroyed by short circuits between outputs, air contamination faults, or faults due to improper grounding. 15 2006-06-13 TB62801F (2) Connection to the TCD1703C Signal output 1 OS1 OD CP RS φ2B φ102 3 20 4 19 5 18 6 17 φ1E2 14 13 φ1E2 12 SH 2B_in CP_in CK_in SH_in RS_in 2B_ out 2B_in CP_in VCC 11 7500 1 16 2 15 3 14 4 13 VCC CK_in SH_in RS_in φ2E2 SS φ2E1 2B_out CP_out φ φ GND 5 12 6 11 7 10 8 9 1 16 2 15 3 14 4 13 GND Note: φ2B 9 VCC 5V RS 10 16 GND Reset gate signal input CP 15 VCC Shift gate signal input SS 8 2B_ out Transfer clock signal input OS2 SS NC 5V 22 21 7 φ101 Clamp gate signal input 1 2 φ202 φ201 Last transfer clock signal input 1 TCD1703C 12 V Signal output 2 φ φ SH_out RS_out 2B_out CP_out φ φ GND 5 12 6 11 7 10 8 9 φ φ SH_out RS_out Driving the CCD requires a lot of power. Toshiba recommends the use of a bypass capacitor connected to the 5 V power supply to stabilize voltage. Two TB62801F devices are used in this application: one is used to drive all the control bits and the four transfer clock bits, the other to drive the remaining four transfer clock bits. 16 2006-06-13 TB62801F Package Dimensions HSOP16-P-300-1.00 Unit: mm Weight: 0.5 g (typ.) 17 2006-06-13 TB62801F Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 18 2006-06-13 TB62801F IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 19 2006-06-13 TB62801F RESTRICTIONS ON PRODUCT USE 060116EBA • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 20 2006-06-13