FAIRCHILD QRB1133

PHOTOTRANSISTOR
REFLECTIVE OBJECT SENSORS
QRB1133
QRB1134
PACKAGE DIMENSIONS
0.420 (10.67)
0.328 (8.33)
24.0 (609.60)
MIN #26 AWG
0.150 (3.81)
NOM
(A)
E
(K)
0.226 (5.74)
0.373 (9.47)
S
(E)
0.703 (17.86)
(C)
0.020 (0.51)
4X
0.150 (3.81)
MIN
0.300 (7.62)
0.603 (15.32)
FUNCTION
WIRE COLOR
(C) COLLECTOR
(E) EMITTER
(K) CATHODE
(A) ANODE
WHITE
BLUE
GREEN
ORANGE
0.210 (5.33)
REFLECTIVE
SURFACE
SCHEMATIC
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
A
K
C
E
DESCRIPTION
The QRB1133/1134 consists of an infrared emitting diode and an NPN silicon phototransistor mounted side by side on a converging optical axis in a black plastic housing. The phototransistor responds to radiation from the emitting diode only when a reflective
object passes within its field of view. The area of the optimum response approximates a circle .200” in diameter.
FEATURES
• Phototransistor output
• High Sensitivity
• Low cost plastic housing
• #26 AWG, 24 inch PVC wire termination
• Infrared transparent plastic covers for dust protection
 2001 Fairchild Semiconductor Corporation
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PHOTOTRANSISTOR
REFLECTIVE OBJECT SENSORS
QRB1133
ABSOLUTE MAXIMUM RATINGS
QRB1134
(TA = 25°C unless otherwise specified)
Parameter
Symbol
Rating
Operating Temperature
TOPR
-40 to +85
Units
°C
Storage Temperature
TSTG
-40 to +85
°C
(Iron)(2,3,4)
TSOL-I
240 for 5 sec
°C
Soldering Temperature (Flow)(2,3)
TSOL-F
260 for 10 sec
°C
Continuous Forward Current
IF
50
mA
Reverse Voltage
VR
5
V
Power Dissipation(1)
PD
100
mW
Collector-Emitter Voltage
VCEO
30
V
Emitter-Collector Voltage
Soldering Temperature
EMITTER
SENSOR
VECO
50
V
Collector Current
IC
20
mA
Power Dissipation(1)
PD
100
mW
NOTES
1. Derate power dissipation linearly 1.67 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16” (1.6mm) minimum from housing.
5. D is the distance from the assembly face to the reflective surface.
6. Measured using an Eastman Kodak neutral test card with 90% diffused reflecting surface.
7. Cross talk is the photo current measured with current to the input diode and no reflecting surface.
ELECTRICAL / OPTICAL CHARACTERISTICS
PARAMETER
(TA = 25°C)
TEST CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS
IF = 40 mA
VF
—
—
1.7
V
VR = 2.0 V
IR
—
—
100
µA
IF = 20 mA
!PE
—
940
—
nm
IC = 1 mA
BVCEO
30
—
—
V
IE = 0.1 mA
BVECO
5
—
—
V
VCE = 10 V, IF = 0 mA
ICEO
—
—
100
nA
0.20
—
—
0.60
—
EMITTER
Forward Voltage
Reverse Current
Peak Emission Wavelength
SENSOR
Collector-Emitter Breakdown Voltage
Emitter-Collector Breakdown Voltage
Collector-Emitter Dark Current
COUPLED
On-state Collector Current
QRB1133
IF = 40 mA, VCE = 5 V
IC(ON)
D = .150”(5,6)
QRB1134
mA
Collector-Emitter
IF = 20 mA, IC = 0.5 mA
VCE (SAT)
—
—
0.4
Rise Time
VCE = 5 V, RL = 100 "
tr
—
8
—
Fall Time
IC(ON) = 5 mA
tf
—
8
—
Cross Talk
IF = 40 mA, VCE = 5 V(7)
ICX
—
—
1.00
Saturation Voltage
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V
µs
µA
DS300351
PHOTOTRANSISTOR
REFLECTIVE OBJECT SENSORS
QRB1133
QRB1134
TYPICAL PERFORMANCE CURVES
Fig. 1 Forward Voltage
vs. Forward Current
Fig. 2 Normalized Collector Current
vs. Forward Current
1.60
VF - FORWARD VOLTAGE (V)
1.20
1.00
0.80
0.60
0.40
1.00
IC - COLLECTOR CURRENT (mA)
IC - COLLECTOR CURRENT (mA)
10.0
1.40
1.00
0.10
0.01
VCE = 5 V
D = .05"
0.1
1.0
10
100
0.0
IF - FORWARD CURRENT (mA)
10
20
30
40
NORMALIZED COLLECTOR CURRENT (mA)
VCE = 10 V
10
1.0
10-1
10-2
10-3
0
25
50
75
0.2
IF = 10 m,A
VCE = 5 V
50
-50
-25
0
25
50
75
TA - AMBIENT TEMPERATURE (˚C)
1.0
0.9
IF = 20 m,A
VCE = 5 V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
-25
0.4
Fig. 5 Normalized Collector Current
vs. Distance
102
50
0.6
IF - FORWARD CURRENT (mA)
Fig. 4 Normalized Collector Dark
Current vs. Temperature
101
0.8
0
.001
0.20
ICEO - COLLECTOR DARK CURRENT
Fig. 3 Normalized Collector Current
vs. Temperature
50
100
150
200
250
300
350
400
450
500
100
DISTANCE IN MILS
TA - AMBIENT TEMPERATURE (˚C)
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PHOTOTRANSISTOR
REFLECTIVE OBJECT SENSORS
QRB1133
QRB1134
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF
OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
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2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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