DIODES DMP2004VK

DMP2004VK
DUAL P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
Mechanical Data
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•
•
•
•
•
•
•
•
•
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Dual P-Channel MOSFET
Low On-Resistance
Very Low Gate Threshold Voltage VGS(TH) <1V
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 2)
ESD Protected Gate
"Green" Device (Note 3)
Case: SOT-563
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
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SOT-563
ESD protected
Maximum Ratings
TOP VIEW
BOTTOM VIEW
G1
S1
S2
G2
D1
TOP VIEW
Internal Schematic
@TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 1) VGS = -4.5V
Pulsed Drain Current
Thermal Characteristics
Electrical Characteristics
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 4)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Symbol
VDSS
VGSS
ID
IDM
Value
-20
±8
-530
-1.8
Units
V
V
mA
A
Symbol
PD
RθJA
TJ, TSTG
Value
400
312.5
-65 to +150
Units
mW
°C/W
°C
@TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient, Note 1
Operating and Storage Temperature Range
Notes:
D2
@TA = 25°C unless otherwise specified
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
IDSS
IGSS
-20
⎯
⎯
⎯
⎯
⎯
⎯
-1.0
±1.0
V
μA
μA
VGS = 0V, ID = -250mA
VDS = -20V, VGS = 0V
VGS = ±4.5V, VDS = 0V
VGS(th)
-0.5
⎯
-1.0
V
RDS (ON)
⎯
0.7
1.1
1.7
0.9
1.4
2.0
Ω
|Yfs|
VSD
200
-0.5
⎯
⎯
⎯
-1.2
mS
V
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -430mA
VGS = -2.5V, ID = -300mA
VGS = -1.8V, ID = -150mA
VDS = -10V, ID = -0.2A
VGS = 0V, IS = 115mA
Ciss
Coss
Crss
⎯
⎯
⎯
⎯
⎯
⎯
175
30
20
pF
pF
pF
VDS = -16V, VGS = 0V
f = 1.0MHz
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
DMP2004VK
Document number: DS30916 Rev. 4 - 2
1 of 5
www.diodes.com
June 2010
© Diodes Incorporated
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
DMP2004VK
0
0
-VDS, DRAIN SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
-VGS(th), GATE THRESHOLD VOLTAGE (V)
-VGS, GATE SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 4 Static Drain-Source On-Resistance vs. Drain Current
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
TA, AMBIENT TEMPERATURE (°C)
Fig. 3 Gate Threshold Voltage vs. Ambient Temperature
10
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 5 Static Drain-Source On-Resistance
vs. Drain Current
DMP2004VK
Document number: DS30916 Rev. 4 - 2
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 6 Static Drain-Source On-Resistance vs.
Drain-Source Current
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DMP2004VK
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Static Drain-Source On-State Resistance
vs. Ambient Temperature
-VDS, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Reverse Drain Current vs. Source-Drain Voltage
-ID, DRAIN-CURRENT (A)
Fig. 9 Forward Transfer Admittance vs. Drain-Current
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Capacitance
Ordering Information (Note 5)
Part Number
DMP2004VK-7
Notes:
Case
SOT-563
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
PAB
Date Code Key
Year
Code
Month
Code
2007
U
Jan
1
PAB = Marking Code
YM = Date Code Marking
Y = Year (ex: U = 2007)
M = Month (ex: 9 = September)
YM
2008
V
Feb
2
DMP2004VK
Document number: DS30916 Rev. 4 - 2
Mar
3
2009
W
Apr
4
May
5
2010
X
Jun
6
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Jul
7
2011
Y
Aug
8
Sep
9
2012
Z
Oct
O
Nov
N
Dec
D
June 2010
© Diodes Incorporated
DMP2004VK
Package Outline Dimensions
A
B
SOT-563
Dim Min
Max
Typ
A
0.15 0.30 0.20
B
1.10 1.25 1.20
C
1.55 1.70 1.60
D
0.50
G
0.90 1.10 1.00
H
1.50 1.70 1.60
K
0.55 0.60 0.60
L
0.10 0.30 0.20
M
0.10 0.18 0.11
All Dimensions in mm
C
D
G
M
K
H
L
Suggested Pad Layout
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
2.2
G
1.2
X
0.375
Y
0.5
C1
1.7
C2
0.5
X
DMP2004VK
Document number: DS30916 Rev. 4 - 2
4 of 5
www.diodes.com
June 2010
© Diodes Incorporated
DMP2004VK
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
DMP2004VK
Document number: DS30916 Rev. 4 - 2
5 of 5
www.diodes.com
June 2010
© Diodes Incorporated