DIODES DXT751-13

DXT751
LOW VCE(SAT) PNP SURFACE MOUNT TRANSISTOR
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NEW PRODUCT
Features
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Epitaxial Planar Die Construction
Complementary NPN Type Available (DXT651)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
SOT89-3L
Mechanical Data
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Case: SOT89-3L
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.072 grams (approximate)
Maximum Ratings
COLLECTOR
2,4
3 E
C 4
2 C
1
BASE
1 B
3
EMITTER
TOP VIEW
Schematic and Pin Configuration
@TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Collector Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
Value
-80
-60
-5
-3
-6
Unit
V
V
V
A
A
Value
1
125
Unit
W
°C/W
-55 to +150
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 3) @ TA = 25°C
Thermal Resistance, Junction to Ambient Air (Note 3) @TA = 25°C
Operating and Storage Temperature Range
Notes:
Symbol
PD
RθJA
TJ, TSTG
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
DS31185 Rev. 3 - 2
1 of 4
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DXT751
© Diodes Incorporated
Electrical Characteristics
Symbol
Min
Typ
Max
Unit
V(BR)CBO
V(BR)CEO
V(BR)EBO
-80
-60
-5
⎯
⎯
⎯
⎯
⎯
⎯
V
V
V
IC = -100μA, IE = 0
IC = -10mA, IB = 0
IE = -100μA, IC = 0
Collector Cutoff Current
ICBO
⎯
⎯
-0.1
-10
μA
μA
Emitter Cutoff Current
ON CHARACTERISTICS (Note 4)
IEBO
⎯
⎯
-0.1
μA
VCB = -60V, IE = 0
VCB = -60V, IE = 0, TA = 100°C
VEB = -4V, IC = 0
⎯
⎯
⎯
⎯
-0.08
-0.2
-0.9
-0.8
-0.3
-0.6
-1.25
-1
hFE
70
100
80
40
200
180
160
140
⎯
300
⎯
⎯
⎯
fT
Cobo
ton
toff
100
⎯
⎯
⎯
145
⎯
45
200
⎯
30
⎯
⎯
MHz
pF
ns
ns
Collector-Emitter Saturation Voltage
VCE(SAT)
Base-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
VBE(SAT)
VBE(ON)
DC Current Gain
AC CHARACTERISTICS
Transition Frequency
Output Capacitance
Switching Times
Notes:
V
V
V
Test Conditions
IC = -1A, IB = -100mA
IC = -3A, IB = -300mA
IC = -1A, IB = -100mA
VCE = -2V, IC = -1A
VCE = -2V, IC = -50mA
VCE = -2V, IC = -500mA
VCE = -2V, IC = -1A
VCE = -2V, IC = -2A
VCE = -10V, IC = -50mA, f = 100MHz
VCB = -10V, f = 1MHz
IC = -500mA, VCC = -10V
IB1 = IB2 = -50mA
Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%.
4.
1.0
PD, POWER DISSIPATION (W)
NEW PRODUCT
Characteristic
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
@TA = 25°C unless otherwise specified
0.8
0.6
0.4
0.2
0
0
DS31185 Rev. 3 - 2
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Dissipation
vs. Ambient Temperature (Note 3)
150
2 of 4
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0
1
2
3
4
5
-VCE, COLLECTOR-EMITTER VOLTAGE (V)
Fig. 2 Typical Collector Current
vs. Collector-Emitter Voltage
DXT751
© Diodes Incorporated
0.3
400
350
0.25
300
0.2
200
0.15
150
0.1
100
0.05
50
0
0
-IC, COLLECTOR CURRENT (A)
Fig. 4 Typical Collector-Emitter Saturation
Voltage vs. Collector Current
-IC, COLLECTOR CURRENT (A)
Fig. 3 Typical DC Current Gain
vs. Collector Current
1
-IC, COLLECTOR CURRENT (A)
Fig. 5 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
400
350
300
250
200
150
100
50
0
VR , REVERSE VOLTAGE (V)
Fig. 7 Typical Capacitance Characteristics
DS31185 Rev. 3 - 2
-IC, COLLECTOR CURRENT (A)
Fig. 6 Typical Base-Emitter Saturation
Voltage vs. Collector Current
fT, CURRENT GAIN-BANDWIDTH PRODUCT (MHz)
NEW PRODUCT
250
200
150
100
VCE = -10V
f = 100MHz
50
0
0
10
20 30 40 50 60 70 80 90 100
-IC, COLLECTOR CURRENT (mA)
Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current
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DXT751
© Diodes Incorporated
Ordering Information (Note 5)
Device
DXT751-13
Notes:
5.
Packaging
SOT89-3L
Shipping
2500/Tape & Reel
For packaging details, go to our website at http://www.diodes.com/ap02007.pdf.
NEW PRODUCT
Marking Information
(Top View)
KP2 = Product Type Marking Code
YWW = Date Code Marking
Y = Last digit of year ex: 7 = 2007
WW = Week code 01 - 52
YWW
KP2
Package Outline Dimensions
0
20
0.
R
D1
C
SOT89-3L
E
H
L
B
B1
8°
e
(4X
)
A
Dim
Min
Max
Typ
A
1.40
1.60
1.50
B
0.45
0.55
0.50
B1
0.37
0.47
0.42
C
0.35
0.43
0.38
D
4.40
4.60
4.50
D1
1.50
1.70
1.60
E
2.40
2.60
2.50
e
—
—
1.50
H
3.95
4.25
4.10
L
0.90
1.20
1.05
All Dimensions in mm
D
Suggested Pad Layout
1.7
2.7
0.4
1.9
1.3
0.9
3.0
Unit: mm
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
DS31185 Rev. 3 - 2
4 of 4
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DXT751
© Diodes Incorporated