MBRD320, MBRD330, MBRD340, MBRD350, MBRD360 MBRD320, MBRD340 and MBRD360 are Preferred Devices SWITCHMODE Power Rectifiers http://onsemi.com DPAK Surface Mount Package These state−of−the−art devices are designed for use as output rectifiers, free wheeling, protection and steering diodes in switching power supplies, inverters and other inductive switching circuits. Features • • • • SCHOTTKY BARRIER RECTIFIERS 3.0 AMPERES, 20 − 60 VOLTS 1 Extremely Fast Switching Extremely Low Forward Drop Platinum Barrier with Avalanche Guardrings Pb−Free Packages are Available 4 3 4 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • 1 2 3 DPAK CASE 369C Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes; 260°C Max. for 10 Seconds MARKING DIAGRAM YWW B 3x0G Y WW B3x0 x G = Year = Work Week = Device Code = 2, 3, 4, 5, or 6 = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2010 July, 2010 − Rev. 7 1 Publication Order Number: MBRD320/D MBRD320, MBRD330, MBRD340, MBRD350, MBRD360 MAXIMUM RATINGS Rating Symbol MBRD 320 330 340 350 360 20 30 40 50 60 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR Average Rectified Forward Current (TC = +125°C, Rated VR) IF(AV) 3 A Peak Repetitive Forward Current, TC = +125°C (Rated VR, Square Wave, 20 kHz) IFRM 6 A Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 75 A Peak Repetitive Reverse Surge Current (2 ms, 1 kHz) IRRM 1 A TJ −65 to +175 °C Tstg −65 to +175 °C dv/dt 10,000 V/ms Operating Junction Temperature Range (Note 1) Storage Temperature Range Voltage Rate of Change (Rated VR) V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Rating Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case RqJC 6 °C/W Maximum Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 80 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) iF = 3 Amps, TC = +25°C iF = 3 Amps, TC = +125°C iF = 6 Amps, TC = +25°C iF = 6 Amps, TC = +125°C VF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TC = +25°C) (Rated dc Voltage, TC = +125°C) iR V 0.6 0.45 0.7 0.625 mA 0.2 20 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. 2. Rating applies when surface mounted on the minimum pad size recommended. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. http://onsemi.com 2 MBRD320, MBRD330, MBRD340, MBRD350, MBRD360 ORDERING INFORMATION Package Shipping† DPAK 75 Units / Rail MBRD320G DPAK (Pb−Free) 75 Units / Rail MBRD320RL DPAK 1800 Tape & Reel DPAK (Pb−Free) 1800 Tape & Reel DPAK 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK 75 Units / Rail MBRD330G DPAK (Pb−Free) 75 Units / Rail MBRD330RL DPAK 1800 Tape & Reel DPAK (Pb−Free) 1800 Tape & Reel DPAK 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK 75 Units / Rail MBRD340G DPAK (Pb−Free) 75 Units / Rail MBRD340RL DPAK 1800 Tape & Reel DPAK (Pb−Free) 1800 Tape & Reel DPAK 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK 75 Units / Rail MBRD350G DPAK (Pb−Free) 75 Units / Rail MBRD350RL DPAK 1800 Tape & Reel DPAK (Pb−Free) 1800 Tape & Reel DPAK 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK 75 Units / Rail MBRD360G DPAK (Pb−Free) 75 Units / Rail MBRD360RL DPAK 1800 Tape & Reel DPAK (Pb−Free) 1800 Tape & Reel DPAK 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel Device MBRD320 MBRD320RLG MBRD320T4 MBRD320T4G MBRD330 MBRD330RLG MBRD330T4 MBRD330T4G MBRD340 MBRD340RLG MBRD340T4 MBRD340T4G MBRD350 MBRD350RLG MBRD350T4 MBRD350T4G MBRD360 MBRD360RLG MBRD360T4 MBRD360T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MBRD320, MBRD330, MBRD340, MBRD350, MBRD360 TYPICAL CHARACTERISTICS I R , REVERSE CURRENT (mA) 100 10 40 20 10 TJ = 150°C 125°C 4.0 2.0 1.0 100°C 75°C 0.4 0.2 0.1 0.04 0.02 0.01 0.004 0.002 0.001 25°C 0 TJ = 25°C 75°C 1.0 0.2 0.3 0.4 0.5 0.6 0.7 70 60 Figure 2. Typical Reverse Current 125°C 0.1 0.1 40 20 30 50 VR, REVERSE VOLTAGE (VOLTS) 10 *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficient below rated VR. 150°C PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 0.8 0.9 1.0 1.1 10 SINE WAVE 9.0 TJ = 150°C 8.0 5 7.0 10 6.0 5.0 dc IPK/IAV = 20 SQUARE WAVE 4.0 3.0 2.0 1.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 vF, INSTANTANEOUS VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 1. Typical Forward Voltage Figure 3. Average Power Dissipation http://onsemi.com 4 9.0 10 I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 8.0 RATED VOLTAGE APPLIED 7.0 RqJC = 6°C/W 6.0 TJ = 150°C SINE WAVE OR SQUARE WAVE 5.0 4.0 3.0 dc 2.0 1.0 0 80 90 100 110 120 130 140 150 160 4.0 RqJA = 80°C/W SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED TJ = 150°C 3.5 3.0 dc SQUARE WAVE OR SINE WAVE VR = 25 V 2.5 TJ = 125°C 2.0 1.5 TJ = 150°C 1.0 0.5 0 0 20 40 60 80 100 120 140 TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 4. Current Derating, Case Figure 5. Current Derating, Ambient 1K 700 500 C, CAPACITANCE (pF) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) MBRD320, MBRD330, MBRD340, MBRD350, MBRD360 300 200 TJ = 25°C 100 70 50 30 20 10 0 10 20 30 40 50 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Typical Capacitance http://onsemi.com 5 60 70 160 MBRD320, MBRD330, MBRD340, MBRD350, MBRD360 PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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