MBRB3030CT Preferred Device SWITCHMODE Power Rectifier These state−of−the−art devices use the Schottky Barrier principle with a proprietary barrier metal. Features • • • • • http://onsemi.com Guardring for Stress Protection Maximum Die Size 175°C Operating Junction Temperature Short Heat Sink Tab Manufactured − Not Sheared Pb−Free Packages are Available SCHOTTKY BARRIER RECTIFIER 30 AMPERES, 30 VOLTS Mechanical Characteristics: • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 1.7 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal 1 4 3 Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) 4 1 3 MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 30 V D2PAK CASE 418B STYLE 3 Average Rectified Forward Current (At Rated VR, TC = 134°C) Per Device Per Leg IF(AV) A MARKING DIAGRAM Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = +137°C) Per Leg IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) IFSM 200 A Peak Repetitive Reverse Surge Current (2.0 s, 1.0 kHz) IRRM 2.0 A Storage Temperature Range Tstg −55 to +175 °C Operating Junction Temperature (Note 1) TJ −55 to +175 °C dv/dt 10,000 V/s W 100 mJ Rating Voltage Rate of Change (Rated VR) Reverse Energy (Unclamped Inductive Surge) (Inductance = 3 mH, TC = 25°C) 30 15 30 A AY WW Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RJA. Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 6 1 B3030CTG AKA A Y WW B3030CT G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MBRB3030CT/D MBRB3030CT THERMAL CHARACTERISTICS (Per Leg) Characteristic Thermal Resistance, − Junction−to−Case − Junction−to−Ambient (Note 2) Symbol Value Unit RJC RJA 1.0 50 °C/W Symbol Value Unit 2. When mounted using minimum recommended pad size on FR−4 board. ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 3), Per Leg (IF = 15 Amps, TC = +25°C) (IF = 15 Amps, TC = +150°C) (IF = 30 Amps, TC = +25°C) (IF = 30 Amps, TC = +150°C) VF Maximum Instantaneous Reverse Current (Note 3), Per Leg (Rated dc Voltage, TC = +25°C) (Reverse Voltage = 10 V, TC = +150°C) (Rated dc Voltage, TC = +150°C) IR V 0.54 0.47 0.67 0.66 mA 0.6 46 145 3. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%. ORDERING INFORMATION Package Shipping† D2PAK 50 Units / Rail MBRB3030CTG D2PAK (Pb−Free) 50 Units / Rail MBRB3030CTT4 D2PAK 800 Units / Tape & Reel D2PAK (Pb−Free) 800 Units / Tape & Reel Device MBRB3030CT MBRB3030CTT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MBRB3030CT 100 ÎÎÎÎ 10 TJ = 150°C ÎÎ 25°C 1 ÎÎÎ ÎÎÎ 100°C 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 ÎÎ 25°C 1 ÎÎ ÎÎ 100°C 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VF, INSTANTANEOUS VOLTAGE (V) Figure 2. Typical Forward Voltage, Per Leg ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ 1.0 TJ = 150°C 0.01 100°C 0.001 10−4 10−5 5 10 15 20 25 TJ = 150°C 0.01 100°C 10−4 25°C 10−5 30 10−6 0 5 10 15 20 25 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Maximum Reverse Current, Per Leg Figure 4. Typical Reverse Current, Per Leg TJ = 25°C C, CAPACITANCE (pF) 5000 3000 MAXIMUM TYPICAL 1000 800 600 1 10 VR, REVERSE VOLTAGE (V) Figure 5. Capacitance http://onsemi.com 3 0.8 ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ 0.1 0.001 25°C 0 TJ = 150°C VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.1 10−6 ÎÎÎ 10 Figure 1. Maximum Forward Voltage, Per Leg 1.0 I R , REVERSE CURRENT (A) I F, INSTANTANEOUS FORWARD CURRENT (A) 100 I R , REVERSE CURRENT (A) I F, INSTANTANEOUS FORWARD CURRENT (A) ELECTRICAL CHARACTERISTICS 30 MBRB3030CT 30 I F(AV), AVERAGE FORWARD CURRENT (A) I F(AV), AVERAGE FORWARD CURRENT (A) TYPICAL CHARACTERISTICS RJC = 1°C/W DC 20 SQUARE WAVE IPK = 5.0 (CAPACITIVE IAV LOAD) π (RESISTIVE LOAD) 10 10 20 0 120 125 130 140 135 145 TC, CASE TEMPERATURE (°C) 150 RJA = 25°C/W 15 DC 20 0 155 PF(AV), AVERAGE FORWARD POWER DISSIPATION (W) π (RESISTIVE LOAD) SQUARE WAVE 6 IPK = 5.0 (CAPACITIVE IAV LOAD) 4 10 2 20 0 0 50 100 TA, AMBIENT TEMPERATURE (°C) 150 π (RESISTIVE LOAD) 15 TJ = 150°C IPK = 5.0 (CAPACITIVE IAV LOAD) DC 10 10 20 SQUARE WAVE 5 0 15 5 10 20 IF(AV), AVERAGE FORWARD CURRENT (A) 0 Figure 8. Current Derating, Free Air 25 Figure 9. Forward Power Dissipation 1.0 R(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED) I F(AV), AVERAGE FORWARD CURRENT (A) DC 150 50 100 TA, AMBIENT TEMPERATURE (°C) 0 Figure 7. Current Derating RJA = 50°C/W 8 IPK = 5.0 (CAPACITIVE IAV LOAD) 10 5 Figure 6. Current Derating, Infinite Heatsink 10 SQUARE WAVE 10 π (RESISTIVE LOAD) SINGLE PULSE 0.1 0.01 Ppk tp Ppk TIME DUTY CYCLE, D = tp/t1 PEAK POWER, Ppk, is peak of an equivalent square power pulse. t1 TJL = Ppk • RJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)] where TJL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t, for example, r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp. 0.1 1.0 10 t, TIME (ms) Figure 10. Thermal Response http://onsemi.com 4 100 1000 MBRB3030CT PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E V W −B− 4 DIM A B C D E F G H J K L M N P R S V A 1 2 S 3 −T− SEATING PLANE K W J G D H 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE M T B M N R M STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE P U L L L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 10.66 0.42 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MBRB3030CT SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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