ONSEMI MC100EPT21DR2

MC100EPT21
Differential LVPECL to
LVTTL Translator
The MC100EPT21 is a Differential LVPECL to LVTTL translator.
Because LVPECL (Positive ECL) levels are used only +3.3V and
ground are required. The small outline 8–lead SOIC package makes
the EPT21 ideal for applications which require the translation of a
clock or data signal.
The VBB output allows the EPT21 to also be used in a single–ended
input mode. In this mode the VBB output is tied to the D0 input for a
non–inverting buffer or the D0 input for an inverting buffer. If used,
the VBB pin should be bypassed to ground via a 0.01µF capacitator.
•
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•
•
•
•
•
•
•
•
•
•
•
•
1.4ns Typical Propagation Delay
275MHz Fmax (Clock bit stream, not pseudo–random)
Differential LVPECL inputs
Small Outline SOIC Package
24mA TTL outputs
Flow Through Pinouts
Internal Input Resistors: Pulldown on D, Pulldown and Pullup on D
Q Output will default LOW with inputs open or at GND
ESD Protection: >1500V HBM, >100V MM
VBB Output
New Differential Input Common Mode Range
Moisture Sensitivity Level 1, Indefinite Time Out of Drypack.
For Additional Information, See Application Note AND8003/D
Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
Transistor Count = 81 devices
NC 1
D
2
D
3
LVTTL
8
VCC
7
Q
6
NC
4
8
1
SO–8
D SUFFIX
CASE 751
MARKING DIAGRAM
8
A
L
Y
W
KPT21
ALYW
1
*For additional information, see Application Note
AND8002/D
PIN DESCRIPTION
FUNCTION
PIN
Q
LVTTL Output
D, D
Differential LVPECL Input Pair
VCC
VBB
Output Reference Voltage
GND
Ground
Positive Supply
Device
5
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
LVPECL
VBB
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GND
Package
Shipping
MC100EPT21D
SOIC
98 Units/Rail
MC100EPT21DR2
SOIC
2500 Tape & Reel
Figure 1. 8–Lead Pinout (Top View) and Logic Diagram
 Semiconductor Components Industries, LLC, 1999
September, 1999 – Rev. 1.0
1
Publication Order Number:
MC100EPT21/D
MC100EPT21
MAXIMUM RATINGS*
Value
Unit
VCC
Symbol
Power Supply (GND = 0V)
Parameter
0 to 3.8
VDC
VI
Input Voltage (GND = 0V, VI not more positive than VCC)
0 to 3.8
VDC
Iout
Output Current
50
100
mA
IBB
VBB Sink/Source Current{
± 0.5
mA
TA
Operating Temperature Range
–40 to +85
°C
Tstg
Storage Temperature
–65 to +150
°C
θJA
Thermal Resistance (Junction–to–Ambient)
190
130
°C/W
θJC
Thermal Resistance (Junction–to–Case)
41 to 44 ± 5%
°C/W
Tsol
Solder Temperature (<2 to 3 Seconds: 245°C desired)
265
°C
Continuous
Surge
Still Air
500lfpm
* Maximum Ratings are those values beyond which damage to the device may occur.
{ Use for inputs of same package only.
DC CHARACTERISTICS (VCC = 3.3V ± 0.3V; GND = 0V; TA = –40°C to 85°C)
Symbol
Characteristic
Min
Typ
Max
Unit
5.0
12
20
mA
8.0
18
26
mA
2420
mV
ICCH
Power Supply Current (Outputs set to HIGH)
ICCL
Power Supply Current (Outputs set to LOW)
VIH
Input HIGH Voltage (VCC = 3.3) (Note 1.)
2135
VIL
Input LOW Voltage (VCC = 3.3) (Note 1.)
1490
1825
mV
IIH
Input HIGH Current
150
µA
IIL
Input LOW Current
0.5
µA
D
D
VOH
Output HIGH Voltage (IOH = –3.0mA) (Note 2.)
VOL
Output LOW Voltage (IOL = 24mA) (Note 2.)
IOS
Output Short Circuit Current
–150
2.4
VIHCMR Input HIGH Voltage Common Mode Range (Note 3.)
V
0.5
V
–130
–80
mA
2.0
3.3
V
VBB
Output Voltage Reference
2.0
V
NOTE: 100EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.
1. All values vary 1:1 with VCC.
2. All loading with 500 ohms to GND, CL = 20pF.
3. VIHCMR min varies 1:1 with GND, max varies 1:1 with VCC.
AC CHARACTERISTICS (VCC = 3.3V ± 0.3V; GND = 0V)
–40°C
Symbol
25°C
Max
Min
Typ
275
350
1000
1000
1450
1400
85°C
Min
Typ
Maximum Toggle
Frequency (Note 4.)
275
350
tPLH,
tPHL
Propagation Delay to
Output Differential
1000
1000
1450
1400
tSK++
tSK– –
tSKPP
Output–to–Output Skew++
Output–to–Output Skew– –
Part–to–Part Skew (Note 5.)
60
25
500
60
25
500
60
25
500
ps
tJITTER
Cycle–to–Cycle Jitter
TBD
TBD
TBD
ps
VPP
Input Voltage Swing (Diff.)
fmax
Characteristic
Max
Min
Typ
275
350
1000
1000
1450
1400
Max
Unit
MHz
150
800
1800
1800
1200
150
800
tr
Output Rise/Fall Times
tf
(0.8V – 2.0V)
Q, Q
330
500
900
330
500
4. Fmax guaranteed for functionality only. VOL and VOH levels are guaranteed at DC only.
5. Skews are measured between outputs under identical transitions.
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1800
1800
1900
1900
1200
150
800
1200
900
330
500
900
ps
mV
ps
MC100EPT21
PACKAGE DIMENSIONS
SO–8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–06
ISSUE T
D
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
e
X 45 _
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
S
DIM
A
A1
B
C
D
E
e
H
h
L
q
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MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MC100EPT21
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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MC100EPT21/D