MM5Z2V4ST1 SERIES Zener Voltage Regulators 200 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. http://onsemi.com Specification Features • Standard Zener Breakdown Voltage Range −2.4 V to 18 V • Steady State Power Rating of 200 mW • Small Body Outline Dimensions: • • • • 1 Cathode 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ These are Pb−Free Devices 2 1 SOD−523 CASE 502 PLASTIC Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic MARKING DIAGRAM Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any 1 QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient Junction and Storage Temperature Range XX MG G 2 XX = Specific Device Code M Date Code* G = Pb−Free Package MAXIMUM RATINGS Rating 2 Anode (Note: Microdot may be in either location) Symbol Max Unit 200 1.5 mW mW/°C 635 °C/W PD RqJA *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Package Shipping † MM5ZxxxST1 SOD−523* 3000/Tape & Reel MM5ZxxxST1G SOD−523* 3000/Tape & Reel Device TJ, Tstg °C −65 to +150 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 Minimum Pad. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 6 1 Publication Order Number: MM5Z2V4ST1/D MM5Z2V4ST1 SERIES ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol I IF Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF QVZ Maximum Temperature Coefficient of VZ C Max. Capacitance @VR = 0 and f = 1 MHz VZ VR V IR VF IZT Figure 1. Zener Voltage Regulator ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ ZZT IZ = IZT @ 10% Mod W Max mA V Min Max C pF Max @ VR = 0 f = 1 MHz Max IR @ VR dVZ/dt (mV/k) @ IZT1 = 5 mA Min Max ZZK IZ = 1.0 mA W Max 5.0 2.43 2.63 1000 100 120 1.0 −3.5 0 450 T3 5.0 2.67 2.91 1000 100 100 1.0 −3.5 0 450 T5 5.0 3.32 3.53 1000 95 5.0 1.0 −3.5 0 450 MM5Z3V6ST1 T6 5.0 3.60 3.85 1000 90 5.0 1.0 −3.5 0 450 MM5Z3V9ST1 T7 5.0 3.89 4.16 1000 90 3.0 1.0 −3.5 −2.5 450 MM5Z4V3ST1 T8 5.0 4.17 4.43 1000 90 3.0 1.0 −3.5 0 450 MM5Z4V7ST1 T9 5.0 4.55 4.75 800 80 3.0 2.0 −3.5 0.2 260 MM5Z5V1ST1 TA 5.0 4.98 5.2 500 60 2.0 2.0 −2.7 1.2 225 MM5Z5V6ST1 TC 5.0 5.49 5.73 200 40 1.0 2.0 −2.0 2.5 200 MM5Z6V2ST1 TE 5.0 6.06 6.33 100 10 3.0 4.0 0.4 3.7 185 MM5Z6V8ST1 TF 5.0 6.65 6.93 160 15 2.0 4.0 1.2 4.5 155 MM5Z7V5ST1 TG 5.0 7.28 7.6 160 15 1.0 5.0 2.5 5.3 140 MM5Z8V2ST1 TH 5.0 8.02 8.36 160 15 0.7 5.0 3.2 6.2 135 MM5Z9V1ST1 TK 5.0 8.85 9.23 160 15 0.5 6.0 3.8 7.0 130 MM5Z12VST1 TN 5.0 11.74 12.24 80 25 0.1 8.0 6.0 10 130 MM5Z16VST1 TU 5.0 15.85 16.51 80 40 0.05 11.2 10.4 14 105 MM5Z18VST1 TW 5.0 17.56 18.35 80 45 0.05 12.6 12.4 16 100 Device* Device Marking Test Current Izt mA MM5Z2V4ST1 T2 MM5Z2V7ST1 MM5Z3V3ST1 *The “G’’ suffix indicates Pb−Free package available. http://onsemi.com 2 MM5Z2V4ST1 SERIES 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 2. Steady State Power Derating http://onsemi.com 3 150 MM5Z2V4ST1 SERIES PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE B −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A −Y− B 1 2 D 2 PL 0.08 (0.003) M DIM A B C D J K S T X Y MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 C −T− K J SEATING PLANE S SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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