mESD3.3ST5G SERIES Product Preview ESD Protection Diodes In Ultra Small SOD−723 Package The mESD Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium. http://onsemi.com 1 PIN 1. CATHODE 2. ANODE Specification Features: • Small Body Outline Dimensions: • • • • • • • • 2 0.055″ x 0.024″ (1.40 mm x 0.60 mm) Low Body Height: 0.020″ (0.5 mm) Stand−off Voltage: 3.3 V − 12 V Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection IEC61000−4−4 Level 4 EFT Protection These are Pb−Free Devices MARKING DIAGRAM L0 M SOD−723 CASE 509AA L0 M Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic = Specific Device Code = Date Code ORDERING INFORMATION Device Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any mESDxxST5G Package Shipping† SOD−723 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating IEC 61000−4−2 (ESD) Symbol Air Contact Value Unit ±30 ±30 kV IEC 61000−4−4 (EFT) 40 A ESD Voltage 16 400 kV V 150 mW TJ, Tstg −55 to +150 °C TL 260 °C Per Human Body Model Per Machine Model Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) ⎪ PD DEVICE MARKING INFORMATION See specific marking information in the device marking column of the table on page 2 of this data sheet. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2005 September, 2005 − Rev. P1 1 Publication Order Number: mESD3.3ST5G/D mESD3.3ST5G SERIES ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR Working Peak Reverse Voltage VC VBR VRWM Maximum Reverse Leakage Current @ VRWM Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation V IR VF IT Breakdown Voltage @ IT IT C IF Parameter IPP Max. Capacitance @VR = 0 and f = 1 MHz Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Device* Device Marking VRWM (V) IR (mA) @ VRWM VBR (V) @ IT (Note 2) IT C (pF) Max Max Min mA Typ mESD3.3ST5G TBD 3.3 2.5 5.0 1.0 90 mESD5.0ST5G TBD 5.0 1.0 6.2 1.0 65 mESD12ST5G TBD 12 1.0 13.5 1.0 55 *Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C. http://onsemi.com 2 mESD3.3ST5G SERIES 7.4 20 7.3 18 7.2 16 7.1 7.0 14 mESDxxST5G IR (nA) BREAKDOWN VOLTAGE (VOLTS) (VZ @ IZ) TYPICAL CHARACTERISTICS 6.9 6.8 12 10 8 6.7 6.6 6 6.5 4 6.4 2 6.3 −55 0 −55 + 150 + 25 TEMPERATURE (°C) Figure 1. Typical Breakdown Voltage versus Temperature mESDxxST5G + 25 TEMPERATURE (°C) Figure 2. Typical Leakage Current versus Temperature http://onsemi.com 3 + 150 mESD3.3ST5G SERIES PACKAGE DIMENSIONS SOD−723 CASE 509AA−01 ISSUE O −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. −Y− E b 2X 0.08 (0.0032) X Y DIM A b c D E HE L A c L MILLIMETERS INCHES MIN NOM MAX MIN NOM MAX 0.49 0.52 0.55 0.019 0.020 0.022 0.25 0.28 0.32 0.0098 0.011 0.013 0.08 0.12 0.15 0.0032 0.0047 0.0059 0.95 1.00 1.05 0.037 0.039 0.041 0.55 0.60 0.65 0.022 0.024 0.026 1.35 1.40 1.45 0.053 0.055 0.057 0.15 0.20 0.25 0.006 0.0079 0.010 HE SOLDERING FOOTPRINT* 1.1 0.043 0.45 0.0177 0.50 0.0197 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. mESD3.3ST5G/D