RB521S30T1 Schottky Barrier Diode These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. http://onsemi.com Features • • • • Extremely Fast Switching Speed Extremely Low Forward Voltage 0.5 V (max) @ IF = 200 mA Low Reverse Current Pb−Free Package is Available 30 V SCHOTTKY BARRIER DIODE 1 CATHODE MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 30 Vdc Forward Current DC IF 200 mA IFSM 1.0 A Peak Forward Surge Current (Note 1) 2 ANODE 2 1 ESD Rating: Class 1C per Human Body Model ESD Rating: Class C per Machine Model SOD−523 CASE 502 PLASTIC Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. 60 Hz for 1 cycle. MARKING DIAGRAM THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR−5 Board, (Note 2) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Symbol Max Unit PD 200 mW 1.57 mW/°C RqJA 635 °C/W TJ, Tstg −55 to +125 °C 2. FR−5 Minimum Pad. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Min Typ Max Unit Reverse Leakage (VR = 10 V) Characteristic IR − − 30.0 mA Forward Voltage (IF = 200 mA) VF − − 0.50 Vdc 1 5M M G G 2 5M = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Package Shipping † RB521S30T1 SOD−523 4 mm Pitch 3000/Tape & Reel RB521S30T1G SOD−523 (Pb−Free) 4 mm Pitch 3000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2005 September, 2005 − Rev. 5 1 Publication Order Number: RB521S30T1/D RB521S30T1 IF, FORWARD CURRENT (A) 1 10m TA = 125°C IR, REVERSE CURRENT (A) 100m TA = 75°C 10m 1m 100m TA = 25°C 10m 1m TA = 125°C 100m TA = 75°C 10m TA = 25°C 1m 100n TA = −25°C 10n TA = −25°C 1m 1n 0.1 0.2 0.3 0.4 0.5 0.6 0 5 VF, FORWARD VOLTAGE (V) 10 15 25 Figure 2. Reverse Characteristics 20 18 16 14 12 10 8 6 4 2 0 0 20 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Forward Characteristics CT, TOATAL CAPACITANCE (pF) 0 5 10 15 20 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Total Capacitance http://onsemi.com 2 25 30 30 RB521S30T1 PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE B −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A −Y− B 1 2 D 2 PL 0.08 (0.003) M DIM A B C D J K S T X Y MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM MAX 0.047 0.051 0.032 0.035 0.024 0.028 0.012 0.014 0.0055 0.0079 0.008 0.010 0.063 0.067 C −T− K J SEATING PLANE S SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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