MC100EL90 −3.3V / −5VTriple ECL Input to PECL Output Translator Description The MC100EL90 is a triple ECL to PECL translator. The device receives either −3.3 V or −5 V differential ECL signals, determined by the VEE supply level, and translates them to standard +5 V differential PECL output signals. To accomplish the level translation, the EL90 requires three power rails. The VCC supply should be connected to the positive supply, and the VEE pin should be connected to the negative power supply. The GND pins, as expected, are connected to the system ground plane. Both VEE and VCC should be bypassed to ground via 0.01 mF capacitors. Under open input conditions, the D input will be biased at VEE/2 and the D input will be pulled to VEE. This condition will force the Q output to a LOW, ensuring stability. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. The 100 Series Contains Temperature Compensation http://onsemi.com SO−20 WB SUFFIX CASE 751D MARKING DIAGRAM* 20 100EL90 AWLYYWWG Features • 500 ps Propagation Delays • Operating Range: VCC= 4.75 V to 5.25 V; • • • • • • • • 1 VEE= −3.0 V to −5.5 V; GND= 0 V Q Output will Default LOW with Inputs Open or at VEE Internal Input Pulldown Resistors ESD Protection: Human Body Model; > 2 kV, Machine Model; > 200 V Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level: Pb = 1 Pb−Free = 3 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 1.125 in, Oxygen Index: 28 to 34 Transistor Count = 261 devices Pb−Free Packages are Available* A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 3 1 Publication Order Number: MC100EL90/D MC100EL90 VCC Q0 Q0 GND Q1 Q1 20 19 18 17 16 15 GND Q2 14 13 PECL ECL ECL ECL 1 2 3 VCC D0 D0 4 5 6 D1 D1 VCC 12 11 7 8 9 10 ECL VBB PECL ECL VBB PECL Q2 D2 D2 VEE Table 1. PIN DESCRIPTION PIN FUNCTION Dn, Dn Qn, Qn ECL VBB VCC VEE GND ECL Inputs PECL Outputs ECL Reference Voltage Output Positive Supply Negative Supply Ground * All VCC pins are tied together on the die. Warning: All VCC, VEE, and GND pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. 20−Lead Pinout and Logic Diagram (Top View) Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 to 0 V VEE NECL Mode Power Supply VCC = 0 V −8 to 0 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 to 0 −6 to 0 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−20 SOIC−20 90 60 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−20 30 to 35 °C/W Tsol Wave Solder 265 265 °C VI VCC VI VEE Pb Pb−Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = −5 V; GND = 0 V (Note 1) −40°C Symbol Characteristic Min Typ 25°C Max Min 24 85°C Typ Max 20 24 Min Typ Max Unit 26 mA ICC VCC Power Supply Current VOH Output HIGH Voltage (Note 2) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 2) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Output parameters vary 1:1 with VCC. VCC can vary ± 0.5 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0V. http://onsemi.com 2 MC100EL90 Table 4. NECL DC CHARACTERISTICS VCC = 5.0 V; VEE = −5 V; GND = 0 V (Note 3) −40°C Symbol Min Characteristic Typ 25°C Max Min 8.0 85°C Typ Max 6.0 8.0 Min Typ Max Unit 8.0 mA IEE VEE Power Supply Current VIH Input HIGH Voltage (Single−Ended) −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage (Single−Ended) −1810 −1475 −1810 −1475 −1810 −1475 mV ECL VBB Output Voltage Reference −1.38 −1.26 −1.38 −1.26 −1.38 −1.26 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) Vpp < 500 mV VEE + 1.3 VEE + 1.5 −0.4 −0.4 VEE + 1.2 VEE + 1.4 −0.4 −0.4 VEE + 1.2 VEE + 1.4 −0.4 −0.4 V V 150 mA Vpp y 500 mV IIH Input HIGH Current IIL Input LOW Current 150 150 0.5 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input parameters vary 1:1 with GND. VEE can vary −3.0 V / −5.5 V. 4. VIHCMR min varies 1:1 with VEE. VIHCMR max varies 1:1 with GND. Table 5. AC CHARACTERISTICS VCC = 4.5 to 5.5 V; VEE = −3.0 to −5.5 V; GND = 0 V −40°C Symbol Min Characteristic fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay D to Q tSKEW Skew Typ 25°C Max Min 560 Differential S.E. 390 340 Output−to−Output (Note 5) Part−to−Part (Differential Configuration) (Note 5) Duty Cycle (Differential Configuration) (Note 6) 85°C Max Min 650 590 640 20 Typ 420 370 100 200 Max 700 620 670 20 Typ 460 410 100 20 200 Unit MHz 660 710 ps 100 ps 200 25 25 25 TBD TBD TBD tJITTER Cycle−to−Cycle Jitter ps VPP Input Swing (Note 7) 150 1000 150 1000 150 1000 tr tf Output Rise/Fall Times Q (20% − 80%) 230 500 230 500 230 500 mV ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Skews are valid across specified voltage range, part−to−part skew is for a given temperature. 6. Duty cycle skew is the difference between a TPLH and TPHL propagation delay through a device. 7. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈40. http://onsemi.com 3 MC100EL90 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping † MC100EL90DW SOIC−20 38 Units / Rail MC100EL90DWG SOIC−20 (Pb−Free) 38 Units / Rail MC100EL90DWR2 SOIC−20 1000 / Tape & Reel MC100EL90DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 4 MC100EL90 PACKAGE DIMENSIONS SO−20 WB CASE 751D−05 ISSUE G A 20 q X 45 _ E h H M 10X 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B B 0.25 M T A S B S L A 18X e A1 SEATING PLANE C T DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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