MC74LCX158 Low−Voltage CMOS Quad 2−Input Multiplexer With 5 V−Tolerant Inputs (Inverting) The MC74LCX158 is a high performance, quad 2−input inverting multiplexer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX158 inputs to be safely driven from 5 V devices. Four bits of data from two sources can be selected using the Select and Enable inputs. The four outputs present the selected data in the inverted form. The MC74LCX158 can also be used as a function generator. Current drive capability is 24 mA at the outputs. http://onsemi.com MARKING DIAGRAMS 16 SOIC−16 D SUFFIX CASE 751B 16 1 LCX158 AWLYWW 1 16 Features • • • • • • • • • Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 A) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: Human Body Model >2000 V Machine Model >200 V Pb−Free Packages are Available* 16 1 TSSOP−16 DT SUFFIX CASE 948F LCX 158 ALYW 1 16 SOEIAJ−16 M SUFFIX CASE 966 16 74LCX158 ALYW 1 1 A L, WL Y W, WW = = = = Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 4 1 Publication Order Number: MC74LCX158/D MC74LCX158 VCC E A3 B3 Y3 A2 B2 Y2 16 15 14 13 12 11 10 9 1 2 A0 3 B0 4 5 8 A1 6 B1 7 Y0 Y1 GND S Figure 1. Pinout: 16−Lead Plastic Package (Top View) PIN NAMES TRUTH TABLE Pins Function An Source 0 Data Inputs Bn Source 1 Data Inputs E Enable Input S Select Input Yn Outputs Inputs Outputs Output Enable Select H X H L L A0−A3 L H B0−B3 Y0−Y3 X = Don’t Care A0−A3, B0−B3 = The levels of the respective Data−Word Inputs PIN DESCRIPTIONS INPUTS OUTPUTS A0−A3 (Pins 2, 5, 11, 14) Y0−Y3 (Pins 4, 7, 9, 12) Nibble A inputs. The data present on these pins is transferred to the outputs when the Select input is at a low level and the Output Enable input is at a low level. The data is presented to the outputs in inverted form for the LCX158. Data outputs. The selected input nibble is presented at these outputs when the Output Enable input is at a low level. The data present on these pins is in its inverted form for the LCX158. For the Output Enable input at a high level, the outputs are at a high level for the LCX158. B0−B3 (Pins 3, 6, 10, 13) Nibble B inputs. The data present on these pins is transferred to the outputs when the Select input is at a high level and the Output Enable input is at a low level. The data is presented to the outputs in inverted form for the LCX158. Select (Pin 1) Nibble select. This input determines the data word to be transferred to the outputs. A low level on this input selects the A inputs and a high level selects the B inputs. CONTROL INPUTS Enable (Pin 15) Output Enable input. A low level on this input allows the selected data to be presented at the outputs. A high level on this input sets all of the outputs to a high level for the LCX158. http://onsemi.com 2 MC74LCX158 A0 2 4 B0 A1 3 5 7 B1 Y0 6 Y1 Nibble Inputs A2 Data Outputs 11 9 B2 A3 10 14 12 B3 Y2 13 Y3 15 Enable Select 1 Figure 2. Expanded Logic Diagram ORDERING INFORMATION Package Shipping† MC74LCX158D SOIC−16 48 Units / Rail MC74LCX158DG SOIC−16 (Pb−Free) 48 Units / Rail MC74LCX158DR2 SOIC−16 2500 Tape & Reel MC74LCX158DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel Device MC74LCX158DT TSSOP−16* 96 Units / Rail MC74LCX158DTR2 TSSOP−16* 2500 Tape & Reel MC74LCX158M SOEIAJ−16 48 Units / Rail MC74LCX158MEL SOEIAJ−16 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 3 MC74LCX158 MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Typ Max Unit 2.0 1.5 2.3 to 3.3 3.6 3.6 V 0 5.5 V 0 VCC V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 mA IOL LOW Level Output Voltage VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 mA TA Operating Free−Air Temperature −40 +85 °C t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V (HIGH or LOW State) (3−State) http://onsemi.com 4 MC74LCX158 DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Characteristic Condition Min Max Unit VIH Minimum HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.0 V 3.0 V ≤ VCC ≤ 3.6 V VIL Maximum LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 2.7 V ≤ VCC ≤ 3.0 V 3.0 V ≤ VCC ≤ 3.6 V VOH Minimum HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 A VCC = 2.3 V; IOH = −8 mA VCC = 2.7 V; IOH = −12 mA VCC = 3.0 V; IOH = −18 mA VCC = 3.0 V; IOH = −24 mA VOL Maximum LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = 100 A VCC = 2.3 V; IOH = 8 mA VCC = 2.7 V; IOH = 12 mA VCC = 3.0 V; IOH = 16 mA VCC = 3.0 V; IOH = 24 mA 0.2 0.7 0.4 0.4 0.55 V II Input Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5.0 A ICC Quiescent Supply Current 2.3 V ≤ VCC ≤ 3.6 V; VI = VCC or GND 2.3 V ≤ VCC ≤ 3.6 V; 3.6 V ≤ VI ≤ 5.5 V 10 ±10 A ICC Increase in ICC per Input 2.3 V ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 A 1.7 2.0 2.0 V 0.7 0.8 0.8 V VCC − 0.2 1.7 2.2 2.4 2.2 V 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS Limits TA = −40°C to +85°C VCC = 3.0 V ± 3.6 V VCC = 2.7 V CL = 50 pF Symbol Parameter CL = 50 pF VCC = 2.3 V to 2.7 V CL = 30 pF Min Max Min Max Min Max Unit tPLH tPHL Propagation Delay A or B to Y 1.0 1.0 6.5 6.5 1.0 1.0 7.5 7.5 1.0 1.0 8.5 8.5 ns tPLH tPHL Propagation Delay S to Y 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 1.0 1.0 9.0 9.0 ns tPLH tPHL Propagation Delay Output Enable to Y 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 1.0 1.0 9.0 9.0 ns tOSHL tOSLH Output−to−Output Skew 1.0 1.0 ns DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC COUT Output Capacitance CPD Power Dissipation Capacitance http://onsemi.com 5 MC74LCX158 2.7 V 1.5 V 1.5 V A, B, S 0V tPHL tPLH VOH Yn 1.5 V 1.5 V VOL WAVEFORM 1 − INVERTING PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V E, S 1.5 V 1.5 V 0V tPHL tPLH VOH 1.5 V Yn 1.5 V VOL WAVEFORM 2 − INVERTING PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC PULSE GENERATOR DUT RT CL CL = 50 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit http://onsemi.com 6 RL MC74LCX158 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K DIM A B C D F G J K M P R F X 45 C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 S TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S K ÉÉ ÇÇ ÇÇ ÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74LCX158 PACKAGE DIMENSIONS SOEIAJ−16 M SUFFIX CASE 966−01 ISSUE O 16 LE 9 Q1 M E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.031 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 For additional information, please contact your local Sales Representative. MC74LCX158/D