ONSEMI PACVGA200

VGA Port Companion Circuit
PACVGA200
Features
•
•
•
•
•
•
•
•
•
Single chip solution for the VGA port interface
Includes ESD protection, level shifting, and RGB
termination
Seven channels of ESD protection for all VGA
port connector pins meeting IEC-61000-4-2
Level-4 ESD requirements (±8kV contact
discharge)
Very low loading capacitance from ESD
protection diodes on VIDEO lines, 4pF typical
75Ω termination resistors for VIDEO lines
(matched to 1% typ.)
TTL to CMOS level-translating buffers with power
down mode for HSYNC and VSYNC lines
Bi-directional level shifting N-channel FETs
provided for DDC_CLK & DDC_DATA channels
Compact 24-pin QSOP package
Lead-free version available
Applications
•
•
Notebook computers with VGA port
Desktop PCs with VGA port
Product Description
The PACVGA200 incorporates seven channels of
ESD protection for all signal lines commonly found in
a VGA port. ESD protection is implemented with
current steering diodes designed to safely handle the
high surge currents encountered with IEC-61000-4-2
Level-4 ESD Protection (±8kV contact discharge).
When a channel is subjected to an electrostatic
discharge, the ESD current pulse is diverted via the
protection diodes into either the positive supply rail or
ground where it may be safely dissipated. Separate
positive supply rails are provided for the VIDEO, DDC
and SYNC channels to facilitate interfacing with low
voltage Video Controller ICs and provide design
flexibility in multi-supply-voltage environments.
©2010 SCILLC. All rights reserved.
May 2010 Rev. 2
Two non-inverting drivers provide buffering for the
HSYNC and VSYNC signals from the Video
Controller IC (SYNC_IN1, SYNC_IN2). These buffers
accept TTL input levels and convert them to CMOS
output levels that swing between Ground and VCC4 .
These drivers have nominal 60 Ω output impedance
(RS) to match the characteristic impedance of the
HSYNC & VSYNC lines of the video cables typically
used in PC applications. Two N-channel FETs
provide the level shifting function required when the
DDC controller is operated at a lower supply voltage
than the monitor. Three 75 Ω termination resistors
suitable for terminating the video signals from the
video DAC are also provided. These resistors have
separate input pins to allow insertion of additional
EMI filtering, if required, between the termination
point and the ESD protection diodes. These resistors
are matched to better than 2% for excellent signal
level matching for the R/G/B signals.
When the PWR_UP input is driven LOW, the SYNC
inputs can be floated without causing the SYNC
buffers to draw any current from the VCC4 supply.
When the PWR_UP input is LOW, the SYNC outputs
are driven LOW.
An internal diode (D1 in schematic on previous page)
is also provided so that VCC3 can be derived from
VCC4, if desired, by connecting VCC3 to V_BIAS. In
applications where VCC4 may be powered down,
diode D1 blocks any DC current paths from the
DDC_OUT pins back to the powered down VCC4 rail
via the top ESD protection diodes.
The PACVGA200 device is housed in a 24-pin QSOP
package and is available with optional lead-free
finishing.
Publication Order Number:
PACVGA200/D
PACVGA200
Simplified Electrical Schematic
VCC 1
VCC 2
2
12
VIDEO_2
VIDEO_3
3
DDC_IN1
4
5
14
16
15
TERM_2
TERM_3
GNDA
23
SYNC_OUT1
SD1
RB
GNDD
GNDD
11
GNDD
6
PWR_UP
VCC 2
8
75
9
75
10
75
RC
VCC 3
GNDD
TERM_1
20
RS
1
19
SYNC_IN1
DDC_OUT1
GNDD
GNDD
VCC 4
D1
13
RC
GNDD
VIDEO_1
V_BIAS
VCC 3
DDC_IN2
GNDD
RC
GNDD
VCC 4
GNDD
1
17
18
SYNC_OUT2
DDC_OUT2
SYNC_IN2
21
24
GNDD
7
22
RS
GNDD
GNDD
GNDA
GNDD
To p View
V CC4
1
24
SD2
V CC1
2
23
SD1
VIDEO_1
3
22
SYNC_OUT2
VIDEO_2
4
21
SYNC_IN2
VIDEO_3
5
20
SYNC_OUT1
GNDD
6
19
SYNC_IN1
GNDA
7
18
DDC_OUT2
TERM_1
8
17
DDC_IN2
TERM_2
9
16
DDC_IN1
TERM_3
10
15
DDC_OUT1
PWR_UP
11
14
VCC 3
V CC2
12
13
V_BIAS
24-pin QSOP
Rev. 2 | Page 2 of 10 | www.onsemi.com
SD2
PACVGA200
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Pins
Package
Ordering Part Number1
Part Marking
24
QSOP-24
PACVGA200QR
PACVGA200QR
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
PIN DESCRIPTIONS
LEAD(s)
NAME
DESCRIPTION
1
VCC4
Positive voltage supply pin. This is an isolated VCC pin for the SYNC_1, SYNC_2, SD1
and SD2 circuits.
2
VCC1
Positive voltage supply pin. This is an isolated VCC pin for the VIDEO_1, VIDEO_2 and
VIDEO_3 ESD circuits.
3-5
VIDEO_1, VIDEO_2,
VIDEO_3
RGB Video Protection Channels. These pins tie to the RGB video lines (for example,
the Blue signal) between the VGA controller device and the video connector.
6
GNDD
Digital Ground reference supply pin.
7
GNDA
Ground reference supply pin for TERM_1, TERM_2 and TERM_3 pins.
8-10
TERM_1, TERM_2,
TERM_3
11
PWR_UP
12
VCC2
13
V_BIAS
14
VCC3
15
DDC_OUT1
DDC Signal Output 1. Connects to the connector side of one of the DDC signals (for
example, the bidirectional DDC_Data serial line).
16
DDC_IN1
DDC Signal Input 1. Connects to the VGA Controller side of one of the DDC signals
(for example, the bidirectional DDC_Data serial line).
17
DDC_IN2
DDC Signal Input 2. Connects to the VGA Controller side of one of the DDC signals
(for example, the bidirectional DDC_Clk).
RGB Video Termination Channels. These pins tie to the RGB video lines (for example,
the Blue signal) providing a 75Ω termination to GNDA for the given video channel.
Sync Signal Output 1. Ties to the video connector side of one of the sync lines (for
example the Horizontal Sync signal).
Positive voltage supply pin. This is an isolated VCC pin for the DDC_IN1 and DDC_IN2
input circuits. Defines the logic one level for the DDC_OUTn outputs.
Used to derive VCC3 from VCC4 input.
Positive voltage supply pin. This is an isolated VCC pin for the DDC_OUT1 and
DDC_OUT2 ESD protection circuits.
Rev. 2 | Page 3 of 10 | www.onsemi.com
PACVGA200
LEAD(s)
NAME
DESCRIPTION
18
DDC_OUT2
DDC Signal Output 2. Connects to the connector side of one of the DDC signals (for
example, the bidirectional DDC_Clk).
19
SYNC_IN1
Sync Signal Buffer Input 1. Connects to the VGA Controller side of one of the sync
lines (for example, the Horizontal Sync signal).
20
SYNC_OUT1
21
SYNC_IN2
22
SYNC_OUT2
Sync Signal Buffer Output 2. Connects to the video connector side of one of the sync
lines (for example the Vertical Sync signal).
23
SD1
Sync Signal Filter 1. Connects to the video connector side of one of the sync lines (for
example the Vertical Sync signal).
24
SD2
Sync Signal Filter 2. Connects to the video connector side of one of the sync lines (for
example the Horizontal Sync signal).
Sync Signal Buffer Output 1. Connects to the video connector side of one of the sync
lines (for example the Horizontal Sync signal).
Sync Signal Buffer Input 2. Connects to the VGA Controller side of one of the sync
lines (for example, the Vertical Sync signal).
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
[GND - 0.5] to +6.0
V
100
μA
-65 to +150
°C
(GND - 0.5) to (VCC1 + 0.5)
-6.0, +6.0
(GND - 0.5) to (VCC2 + 0.5)
(GND - 0.5) to (VCC3 + 0.5)
(GND - 0.5) to (VCC4 + 0.5)
V
V
V
V
V
1000
mW
PARAMETER
RATING
UNITS
Operating Temperature Range
0 to +70
°C
VCC1,VCC2,VCC3, and VCC4 Supply Voltage
Diode D1 Forward DC Current
Storage Temperature Range
DC Voltage at Inputs
VIDEO_1, VIDEO_2, VIDEO_3
TERM_1, TERM_2, TERM_3
DDC_IN1, DDC_IN2
DDC_OUT1, DDC_OUT2
SYNC_IN1, SYNC_IN2
Package Power Rating
STANDARD OPERATING CONDITIONS
Rev. 2 | Page 4 of 10 | www.onsemi.com
PACVGA200
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
ICC1
VCC1 Supply Current
ICC2,
ICC3
ICC4
MIN
TYP
MAX
UNITS
VCC1 = 5.0V, VIDEO inputs at VCC1 or GND
level
10
μA
VCC2 & VCC3 Supply
Current
VCC2 = VCC3 = 5.0V
10
μA
VCC4 Supply Current
VCC4 = 5.0V; SYNC inputs at GND or VCC4
level; PWR-UP pin at VCC4; SYNC outputs
unloaded
10
μA
VCC4 = 5.0V; SYNC inputs at 3.0V; PWR-UP
pin at VCC4; SYNC outputs unloaded
200
μA
VCC4 = 5.0V; PWR-UP input at GND; SYNC
outputs unloaded
VBIAS
RT
VBIAS Open Circuit Voltage
10
No external current drawn from VBIAS pin
Video Termination
Resistance
VCC4-0.8
71.25
RT Resistance Matching
VIH
Logic High Input Voltage
VCC4 = 5.0V; See Note 2
VIL
Logic Low Input Voltage
VCC4 = 5.0V; See Note 2
VOH
Logic High Output Voltage
IOH = -4mA, VCC4 = 5.0V; See Note 2
VOL
Logic Low Output Voltage
IOL = 4mA, VCC4 = 5.0V; See Note 2
ROH
Output Resistance
See Note 2
ROL
RB,RP
μA
V
75
78.75
Ω
1
2
%
2.0
V
0.8
V
4.5
4.8
V
0.18
0.32
V
50
125
Ω
45
80
Ω
Resistor Value
PWR_UP = VCC3 = 5.0V
0.5
1.0
2.0
MΩ
RC
VCC2 Pull-down Resistor
Value
VCC2 = 3.0V
0.5
1.5
3.0
MΩ
IN
Input Current
VIDEO inputs
HSYNC, VSYNC
inputs
VCC1= 5.0V; VIN = VCC1 or GND
VCC4 = 5.0V; VIN = VCC4 or GND
+1
+1
μA
μA
Off-state Leakage Current,
Level-shifting NFET
(VCC2 - VDDC_IN) < 0.4V; VDDC_OUT = VCC2
(VCC2 - VDDC_OUT) < 0.4V; VDDC_IN = VCC2
10
10
μA
μA
IOFF
Rev. 2 | Page 5 of 10 | www.onsemi.com
PACVGA200
SYMBOL
PARAMETER
CONDITIONS
VON
Voltage drop across level
shifting NFET when turned
ON
VCC2= 2.5V; VS = GND; IDS = 3mA
CIN
Input Capacitance
VIDEO_1,VIDEO_2 &
VIDEO_3 inputs
VCC1 = 5.0V; VIN = 2.5V; measured at 1MHz
VCC1 = 2.5V; VIN = 1.25V; measured at 1MHz
MIN
3.0
3.0
TYP
MAX
UNITS
0.15
V
4.0
4.5
5.0
5.6
pF
pF
tPLH
SYNC Drivers L => H
Propagation Delay
CL = 50pF; VCC=5.0V,Input tR and tF < 5ns
8.0
12.0
ns
tPHL
SYNC Drivers H => L
Propagation Delay
CL = 50pF; VCC=5.0V; Input tR and tF < 5ns
8.0
12.0
ns
tR, tF
SYNC Drivers Output Rise
& Fall Times
CL = 50pF; VCC=5.0V; Input tR and tF < 5ns
(measured 10% - 90%)
5.0
7.0
10.0
ns
VESD
ESD Withstand Voltage
VCC1 = VCC3 = VCC4 = 5V; Note 3
±8
kV
Note 1: All parameters specified over standard operating conditions unless otherwise noted.
Note 2: This parameter applies only to the HSYNC and VSYNC channels. HSYNC and VSYNC have 8mA drivers with RS added
in series to terminate transmission line.
Note 3: Per the IEC-61000-4-2 International ESD Standard, Level 4 contact discharge method. VCC1, VCC3 and VCC4 must be
bypassed to GND via a low impedance ground plane with a 0.2uF, low inductance, chip ceramic capacitor at each
supply pin. ESD pulse is applied between the applicable pins and GND. ESD pulse can be positive or negative with
respect to GND. Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_OUT1, SD1, SYNC_OUT2, SD2,
DDC_OUT1 and DDC_OUT2. All other pins are ESD protected to the industry standard 2kV per the Human Body Model
(MIL-STD-883, Method 3015).
Rev. 2 | Page 6 of 10 | www.onsemi.com
PACVGA200
Test Circuit Information
Average Current through VCC4 (ICC4)
The circuit in Figure 1 was used to characterize ICC4 current as SYNC_IN signal frequency varies. A square
wave signal was connected to the input of one of the SYNC buffers (i.e. pin 19 or pin 21). The frequency of this
signal was varied between 0 and 100 kHz. The risetime and falltime was kept constant at 10ns. Three different
values of C1 were used: 0pF, 50pF and 100pF. The results are plotted in Figure 2.
VCC 4
+5V
ICC 4
3.3V
SYNC_IN
SYNC_OUT
0V
C1
Figure 1. Sync Buffer ICC4 Test Circuit
Figure 2. ICC4 vs. SYNC_IN Frequency Performance Data
Rev. 2 | Page 7 of 10 | www.onsemi.com
PACVGA200
Application Information
Figure 3. Typical Connection Diagram
A resistor may be necessary between the VCC3 pin and ground if protection against a stream of ESD pulses is
required while the PACVGA200 is in the power-down state. The value of this resistor should be chosen such
that the extra charge deposited into the VCC3 bypass capacitor by each ESD pulse will be discharged before the
next ESD pulse occurs. The maximum ESD repetition rate specified by the IEC-61000-4-2 standard is one
pulse per second. When the PACVGA200 is in the power-up state, an internal discharge resistor is connected
to ground via an FET switch for this purpose.
For the same reason, VCC1 and VCC4 may also require bypass capacitor discharging resistors to ground if there
are no other components in the system to provide a discharge path to ground.
GNDA, the reference voltage for the 75Ω resistors is not connected internally to GNDD and should ideally be
connected to the ground of the video DAC IC.
Rev. 2 | Page 8 of 10 | www.onsemi.com
PACVGA200
Mechanical Details
QSOP Mechanical Specifications:
PACVGA200 devices are packaged in 24-pin QSOP packages. Dimensions are presented below.
For complete information on the QSOP-24 package, see the California Micro Devices QSOP Package
Information document.
PACKAGE DIMENSIONS
Package
QSOP (JEDEC name is SSOP)
Pins
24
Millimeters
Inches
Dimensions
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
B
0.20
0.30
0.008
0.012
C
0.18
0.25
0.007
0.010
D
8.56
8.73
0.337
0.344
E
3.81
3.98
0.150
0.157
e
0.64 BSC
0.025 BSC
H
5.79
6.19
0.228
0.244
L
0.40
1.27
0.016
0.050
# per tube
55 pcs*
# per tape
and reel
2500 pcs
Package Dimensions for QSOP-24
Controlling dimension: inches
* This is an approximate number which may vary.
Rev. 2 | Page 9 of 10 | www.onsemi.com
PACVGA200
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Rev. 2 | Page 10 of 10 | www.onsemi.com
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