Am79M576A Metering Subscriber Line Interface Circuit DISTINCTIVE CHARACTERISTICS ■ Programmable constant-resistance feed ■ On-chip switching regulator for low-power dissipation ■ Programmable loop-detect threshold ■ Two-wire impedance set by single external impedance ■ Ground-key detect ■ Performs polarity reversal ■ Tip Open state for ground-start lines ■ Ring relay driver ■ Supports 2.2 Vrms metering (12 and 16 kHz) ■ On-hook transmission ■ Line feed characteristics independent of battery variations BLOCK DIAGRAM A(TIP) Ring Relay Driver RINGOUT/DGND C1 Ground-Key Detector HPA VCCRING C2 Input Decoder and Control C3 E0 E1 HPB B(RING) Two-Wire Interface DET VTX Signal Transmission RSN Off-Hook Detector RD Power-Feed Controller DA DB VREG RDC Ring-Trip Detector L VBAT Switching Regulator BGND CHS QBAT CHCLK VCC VEE AGND/DGND Publication# 18412 Rev: D Amendment: /0 Issue Date: October 1999 ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below. Am79M576A J C TEMPERATURE RANGE C = Commercial (0°C to 70°C)* PACKAGE TYPE J = 32-pin Plastic Leaded Chip Carrier (PL 032) PERFORMANCE GRADE Blank = Standard Specification –1 = Performance Grading –2 = Performance Grading DEVICE NUMBER/DESCRIPTION Am79M576A Metering Subscriber Line Interface Circuit Valid Combinations Am79M576A –1 –2 JC Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations, to check on newly released combinations, and to obtain additional data on AMD’s standard military grade products. Note: * Functionality of the device from 0°C to +70°C is guaranteed by production testing. Performance from –40°C to +85°C is guaranteed by characterization and periodic sampling of production units. 2 Am79M576A Data Sheet CONNECTION DIAGRAM Top View RINGOUT/DGND VCC VREG BGND B(RING) A(TIP) DB 32-Pin PLCC 4 3 2 1 32 31 30 VCCRING 6 28 DA L 7 27 RD VBAT 8 26 HPB QBAT 9 25 HPA CHS 10 24 VTX CHCLK 11 23 VEE RSVD 12 22 RSN E1 13 21 AGND 17 18 19 20 DGND 16 RDC 15 C1 14 C3 TP C2 29 DET 5 E0 TP Notes: 1. Pin 1 is marked for orientation. 2. TP is a thermal conduction pin tied to substrate. 3. RSVD = Reserved. Do not connect to this pin. SLIC Products 3 PIN DESCRIPTIONS Pin Names Type Description AGND Gnd Analog (quiet) ground A(TIP) Output Output of A(TIP) power amplifier BGND Gnd Battery (power) ground B(RING) Output Output of B(RING) power amplifier C3–C1 Input Decoder. TTL compatible. C3 is MSB and C1 is LSB. CHCLK Input Chopper clock. Input to switching regulator (TTL compatible). Freq = 256 kHz (Nominal). CHS Input Chopper Stabilization. Connection for external stabilization components. DA Input Ring-trip negative. Negative input to ring-trip comparator. DB Input Ring-trip positive. Positive input to ring-trip comparator. DET Output Detector. When enabled, a logic Low indicates that the selected detector is tripped. Logic inputs C3–C1, E1, and E0 select the detector. Open-collector with a built-in 15 kΩ pull-up resistor. DGND Gnd Digital ground E0 Input A logic High enables DET. A logic Low disables DET. E1 Input Ground-key enable. E1 = High connects the ground-key detector to DET, and E1 = Low connects the off-hook or ring-trip detector to DET. HPA Capacitor High-pass filter capacitor. A(TIP) side of high-pass filter capacitor. HPB Capacitor High-pass filter capacitor. B(RING) side of high-pass filter capacitor. L Output Switching Regulator Power Transistor. Connection point for filter inductor and anode of catch diode. Has up to 60 V of pulse waveform and must be isolated from sensitive circuits. Keep the diode connections short because of the high currents and high di/dt. QBAT Battery Quiet Battery. Filtered battery supply for the signal processing circuits. RD Resistor Detector resistor. Threshold modification and filter point for the off-hook detector. RDC Resistor DC feed resistor. Connection point for the DC feed current programming network, which also connects to the Receiver Summing Node (RSN). VRDC is negative for normal polarity and positive for reverse polarity. RINGOUT/ DGND Output Relay ground for 5 V relays—externally connected to DGND. RSN Input The metallic current (AC and DC) between A(TIP) and B(RING) is equal to 1000 x the current into this pin. The networks that program receive gain, two-wire impedance, and feed current all connect to this node. TP Thermal Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation. VBAT Battery Battery supply VCC Power +5 V power supply VCCRING Input Ring relay driver (sinks current to RINGOUT). VEE Power –5 V power supply VREG Input Regulated Voltage. Provides negative power supply for power amplifiers, connection point for inductor, filter capacitor, and chopper stabilization. VTX Output Transmit Audio. This output is 0.510 times the A(TIP) and B(RING) metallic voltage.The other end of the two-wire input impedance programming network connects here. 4 Am79M576A Data Sheet ABSOLUTE MAXIMUM RATINGS OPERATING RANGES Storage temperature ......................... –55°C to +150°C Commercial (C) Devices Ambient temperature, operating ........... –0°C to +70°C Ambient temperature ............................. 0°C to +70°C* VCC with respect to AGND ................. –0.4 V to +7.0 V VCC ..................................................... 4.75 V to 5.25 V VEE with respect to AGND ................. +0.4 V to –7.0 V VEE ................................................. –4.75 V to –5.25 V VBAT with respect to AGND ................ +0.4 V to –70 V VBAT .................................................. –46.4 V to –54 V Note: Rise time of VBAT (dv/dt) must be limited to 27 V/µs or less when QBAT bypass is 0.33 µF. VCCRING ................................................. 0 V to 5.25 V BGND with respect to AGND/DGND.. +1.0 V to –3.0 V BGND with respect to AGND.................... –2 V to +2 V A(TIP) or B(RING) to BGND: Load resistance on VTX to ground .............. 10 kΩ min Continuous ......................................... –70 V to +2 V 10 ms (f = 0.1 Hz) ............................... –70 V to +5 V 1 µs (f = 0.1 Hz) ................................ –90 V to +10 V 250 ns (f = 0.1 Hz) .......................... –120 V to +15 V Current from A(TIP) or B(RING) ....................... ±150 mA Voltage on VCCRING ........................... –0.3 V to +7 V AGND/DGND.......................................................... 0 V Operating Ranges define those limits between which device functionality is guaranteed. * Functionality of the device from 0°C to +70°C is guaranteed by production testing. Performance from –40°C to +85°C is guaranteed by characterization and periodic sampling of production units. Current through relay drivers or internal driver catch diodes ..............................60 mA Voltage on ring-trip inputs DA and DB .......VBAT to 0 V Current into ring-trip inputs.................................. ±10 mA Peak current into regulator switch (L pin) ........150 mA Switcher transient peak off voltage on L pin ......+1.0 V C3–C1, E0, E1, CHCLK to AGND...................................–0.4 V to VCC + 0.4 V Maximum power dissipation (see note) ....... TA = 70°C In 32-pin PLCC package..................................1.2 W Note: Thermal limiting circuitry on-chip will shut down the circuit at a junction temperature of about 165°C. The device should never be exposed to this temperature. Operation above 145°C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. SLIC Products 5 ELECTRICAL CHARACTERISTICS Description Test Conditions (See Note 1) Min Analog output (VTX) impedance Analog (VTX) output offset 0°C to +25°C +25°C to +85°C –40°C to 0°C Analog (RSN) input impedance Longitudinal impedance at A or B Overload level 4-wire 2-wire Typ Max Unit 3 20 Ω +40 +35 +45 mV 4 — 4 20 35 Ω 4 +3.1 +5.5 Vpk 2 dB 4 –40 –35 –45 300 Hz to 3.4 kHz 1 –3.1 –5.5 ZIN = 600 to 900 Ω Note Transmission Performance, 2-Wire Impedance 2-wire return loss (See Test Circuit D) 300 Hz to 500 Hz 500 Hz to 2.5 kHz 2.5 kHz to 3.4 kHz OHT 300 Hz to 3.4 kHz 26 26 20 14 Longitudinal Balance (2-Wire and 4-Wire, See Test Circuit C); RL = 600 Ω Longitudinal to metallic L-T, L-4 300 Hz to 3.4 kHz 48 Longitudinal sum (L-T) + (T-L) 300 Hz to 3.4 kHz 95 Longitudinal signal generation 4-L or T-L 300 Hz to 800 Hz 800 Hz to 3.4 kHz 40 35 Longitudinal current capability per wire Active state, 50 Hz to 200 Hz OHT state, 50 Hz to 200 Hz 17 8 dB mA peak Dial pulse make or break response time of DET 3 4 ms Insertion Loss (See Test Circuits A and B) 2- to 4-wire VAB = 0 dBm, 1 kHz 0°C to +70°C –40°C to +85°C 5.70 5.65 4- to 2-wire VRX = 0 dBm, 1 kHz 0°C to +70°C –40°C to +85°C –0.15 –0.20 5.85 5.85 6.00 6.05 +0.15 +0.20 4- to 2-wire (In the presence of 2.2 Vrms metering) — 4 dB 1.5 — 4 4 Metering Signal Insertion Loss (See Test Circuit B) 4- to 2-wire RL = 260, VAB = 2.86 Vrms RTMG = 139.5 kΩ f = 12 kHz or 16 kHz –0.8 –0.2 +0.4 dB 4 Insertion Loss vs. Frequency (See Test Circuits A and B) 2- to 4-wire or 4- to 2-wire 300 Hz to 3.4 kHz Relative to 1 kHz 0°C to +70°C –40°C to +85°C –0.1 –0.15 +0.1 +0.15 dB — 4 +7 dBm to –55 dBm 0°C to +70°C Reference: 0 dBm –40°C to +85°C –0.1 –0.15 +0.1 +0.15 dB — 4 Gain Tracking (See Test Circuits A and B) 2- to 4-wire or 4- to 2-wire Balance Return Signal (4- to 4-Wire, See Test Circuit B) 6 Gain accuracy 0 dBm, 1 kHz 0°C to +70°C –40°C to +85°C –6.00 –6.05 Variation with frequency relative to 1 kHz 300 Hz to 3.4 kHz 0°C to +70°C –40°C to +85°C –0.1 –0.15 +0.1 +0.15 Gain tracking +3 dBm to –55 dBm 0°C to +70°C Reference: –4 dBm –40°C to +85°C –0.1 –0.15 +0.1 +0.15 Group delay f = 1 kHz 3.3 Am79M576A Data Sheet –5.85 –5.85 5.3 –5.70 –5.65 7.3 — 4 dB 3, 4 4 — 4 µs 4 ELECTRICAL CHARACTERISTICS (continued) Description Test Condition (See Note 1) Min Typ Max Unit Note Total Harmonic Distortion (2- to 4-Wire or 4- to 2-Wire) without Metering (See Test Circuits A and B) 0 dBm +9 dBm –64 –55 300 Hz to 3.4 kHz –50 –40 –35 Total Harmonic Distortion with metering dB 4, 11 Idle Channel Noise without Metering Psophometric weighted noise 2-wire 4-wire –75 –80 Psophometric idle channel noise with metering 2-wire 4-wire –46 –52 7 dBmp 4, 7, 12 4, 7, 12 Single Frequency Out-of-Band Noise (See Test Circuit E) Metallic 4 kHz to 9 kHz 9 kHz to 1 MHz 256 kHz and harmonics –76 –76 –57 Longitudinal 1 kHz to 15 kHz Above 15 kHz 256 kHz and harmonics –70 –85 –57 dBm 4, 5, 9 4, 5, 9 4, 5 4, 5, 9 4, 5, 9 4, 5 Line Characteristics (See Figures 1a, 1b, and 1c) BAT = 48 V, VBAT = –47.3 V, RL = 600 Ω and 900 Ω Apparent battery voltage Active state 47 Loop current accuracy Active state –7.5 Loop current, Tip Open state Open Circuit state RL = 600 Ω RL = 0 Ω Loop current limit accuracy OHT state IL = 13.5 mA, RL = 0 Ω Loop current—Active state RL = 2.25 kΩ 14.33 Loop current—Active state Battery = –48.0 V RL = 1.96 kΩ RL = 0 Ω 17.5 41 50 Loop current—OHT Battery = –47.0 V RL = 2.25 kΩ RL = 0 Ω 9.35 15.5 Fault current limit, ILLIM, A and B shorted to GND in OHT state 50 –15 56 Fault current limit, ILLIM, A and B shorted to GND in Active state 53 V +7.5 % 1.0 mA +15 % 80 10 mA 110 Battery Current in Fault Condition OHT state A and B to GND 40 Active state A and B to GND 55 mA Power Dissipation On hook, Open Circuit state On hook, OHT state On hook, Active state Off hook, OHT state Off hook, Active state (See Figure 2) RL = 600 Ω 40 140 190 350 80 200 300 500 RL = 600 Ω RL = 220 Ω 750 900 900 1100 SLIC Products mW 7 ELECTRICAL CHARACTERISTICS (continued) Description Test Conditions (See Note 1) Min Typ Max Unit Note Supply Currents VCC, on-hook supply current Open Circuit state OHT state Active state 2 5 6 4.0 7.0 9.0 VEE, on-hook supply current Open Circuit state OHT state Active state 1.0 2.3 2.3 2.0 4.0 4.5 VBAT, on-hook supply current Open Circuit state OHT state Active state 0.4 2.2 3.2 1.0 3.5 5.0 VBAT, off-hook supply current OHT state RL = 0 to 2.2 kΩ mA 15.5 Power Supply Rejection Ration (VRIPPLE = 50 mVrms, Saturation Guard Inactive) VCC 40 Hz to 3.4 kHz 3.4 kHz to 50 kHz 18 18 35 30 VEE 40 Hz to 3.4 kHz 3.4 kHz to 50 kHz 20 13 30 25 VBAT 40 Hz to 3.4 kHz 3.4 kHz to 50 kHz 27 20 30 30 IDET = 365/RD –15 6, 7 dB 6, 7 6, 7 Off-Hook Detector Current threshold +15 % 10.0 kΩ Ground-Key Off-Hook Detector Thresholds, Active State Resistance threshold B(RING) to GND Current threshold B(RING) to GND Midpoint to GND 2.0 5 9 mA –5 –0.05 µA –50 0 8 Ring-Trip Detector Inputs Bias current Offset voltage Source resistance = 0 to 200 kΩ +50 mV Logic Inputs (C3–C1, E0, E1, and CHCLK)◆ Input High voltage 2.0 Input Low voltage Input High current 0.8 All inputs except E1 Input E1 Input Low current –75 –75 40 45 –0.4 V µA mA Logic Output (DET) Output Low voltage IOUT = 0.8 mA Output High voltage IOUT = –0.1 mA 0.4 2.4 V Relay Driver On voltage (VCCRING to RINGOUT) 50 mA to VCCRING, RINGOUT connected to AGND/DGND Off leakage 0.5 Zener breakover voltage 100 µA Zener On voltage 30 mA 6.0 8 Am79M576A Data Sheet V 100 µA 7.2 10.0 Note: ◆ C3–C1, and E0 have an internal pull up. E1 has an internal pull down. 1.25 11.0 V * RELAY DRIVER SCHEMATIC VCCRING 7V RINGOUT/DGND QBAT SWITCHING CHARACTERISTICS Symbol Parameter Test Conditions E1 Low to DET High (E0 = 1) Temperature Ranges Min Typ Max 0°C to +70°C –40°C to 85°C 3.8 4.0 0°C to +70°C –40°C to 85°C 1.1 1.6 0°C to +70°C –40°C to 85°C 1.1 1.6 Unit Note µs 4 tgkde E1 Low to DET Low (E0 = 1) Ground-Key Detect state RL open, RG connected (See Figure H) tgkdd E0 High to DET Low (E1 = 0) tgkd0 E0 Low to DET High (E1 = 0) 0°C to +70°C –40°C to 85°C 3.8 4.0 E1 High to DET Low (E0 = 1) 0°C to +70°C –40°C to 85°C 1.2 1.7 0°C to +70°C –40°C to 85°C 3.8 4.0 0°C to +70°C –40°C to 85°C 1.1 1.6 0°C to +70°C –40°C to 85°C 3.8 4.0 tshde E1 High to DET High (E0 = 1) tshdd E0 High to DET Low (E1 = 1) tshd0 E0 Low to DET High (E1 = 1) Switchhoook Detect state RL = 600 Ω, RG open (See Figure G) SLIC Products 9 SWITCHING WAVEFORMS E1 to DET E1 DET tgkde tshde tgkde tshde E0 to DET E1 E0 DET tshdd Note: All delays measured at 1.4 V level. tshd0 tgkdd tgkd0 Notes: * When any power supplies to the MSLIC are removed and the MSLIC is not in the Ringing state, the relay driver must not activate when the relay coil connected to VCCRING is supplied by the same VCC used for powering the MSLIC. If the relay coil connected to VCCRING is supplied by a voltage other than the VCC used for powering the MSLIC, you must: – Provide redundancy of VCC from the supply voltage of the relay – As an alternative, limit the current flowing to all digital inputs to less than 1 mA. 1. Unless otherwise noted, test conditions are BAT = 48 V (voltage at chip VBAT pin = –47.3 V), VCC = +5 V, VEE = –5 V, RL = 600 Ω, CHP = 0.22 µF, RDC1 = RDC2 = 18.7 kΩ, CDC = 0.15 µF, Rd = 57.6 kΩ, no fuse resistors, two-wire AC output impedance programming impedance (ZT) = 306 kΩ resistive, receive input summing impedance (ZRX) = 300 kΩ resistive. (See Table 2 for component formulas.) Operation in polarity reverse is tested in production. 2. Overload level is defined when THD = 1%. 3. Balance return signal is the signal generated at VTX by VRX. This specification assumes that the two-wire AC load impedance matches the impedance programmed by ZT. 4. Not tested in production. This parameter is guaranteed by characterization or correlation to other tests. 5. These tests are performed with a longitudinal impedance of 90 Ω and metallic impedance of 300 Ω for frequencies < 12 kHz and 135 Ω for frequencies >12 kHz. These tests are extremely sensitive to circuit board layout. Refer to application notes for details. 6. This parameter is tested at 1 kHz in production. Performance at other frequencies is guaranteed by characterization. 7. When the SLIC is in the anti-sat 2 operating region, this parameter will be degraded. The exact degradation will depend on system design. The anti-sat 2 region occurs at high loop resistances when |VBAT| – |VAX – VBX| is less than approximately 13 V. 8. “Midpoint” is defined as the connection point between two 300 Ω series resistors connected between A(TIP) and B(RING). 9. Fundamental and harmonics from 256 kHz switch regulator chopper are not included. 10. Calculate loop current limit, which depends upon the programmed apparent open circuit voltage and the feed resistance, is as follows: 50 • V APPARENT -------------------------------------------In OHT state: ILIMIT = 0.202 and R DC = 0.68 In Active state: I LIMIT 10 Am79M576A Data Sheet 11. Total Harmonic distortion with metering is specified with a metering signal of 2.2 Vrms at the two-wire output, and a transmit signal of +3 dBm or receive signal of –4 dBm. The transmit or receive signals are single-frequency inputs, and the distortion is measured as the highest in band harmonic at the two-wire or the four-wire output relative to the input signal. 12. Noise with metering is measured by applying a 2.2 Vrms metering signal (measured at the two-wire output) and measuring the psophometric noise at the two-wire outputs over a 200 ms time interval. Table 1. SLIC Decoding DET Output State C3 C2 C1 E0 = 1* E1 = 0 Two-Wire Status E0 = 1* E1 = 1 0 0 0 0 Open Circuit Ring trip Ring trip 1 0 0 1 Ringing Ring trip Ring trip 2 0 1 0 Active Loop detector Ground key 3 0 1 1 On-hook TX (OHT) Loop detector Ground key 4 1 0 0 Tip Open Loop detector — 5 1 0 1 Reserved Loop detector — 6 1 1 0 Active Polarity Reversal Loop detector Ground key 7 1 1 1 OHT Polarity Reversal Loop detector Ground key Note: * A logic Low on E0 disables DET output into the Open Collector state. Table 2. User-Programmable Components Z T = 510 ( Z2WIN – 2R F ) ZT is connected between the VTX and RSN pins. The fuse resistors are RF, and Z2WIN is the desired two-wire AC input impedance. When computing ZT, the internal current amplifier pole and any external stray capacitance between VTX and RSN must be taken into account. Z RX = 0.98 ( Z T ) ZRX is connected from VRX to RSN. ZT is defined above. This equation sets the receive gain to 0 dB when the SLIC terminates with an impedance equal to Z2WIN. R DC1 + R DC2 = 50 • ( R FEED – 2R F ) RDC1, RDC2, and CDC form the network connected to the RDC pin. RDC1 and RDC2 are approximately equal. R DC1 + R DC2 C DC = 1.5 ms • --------------------------------RDC1 • R DC2 0.5 ms C D = ---------------RD RD and CD form the network connected from RD to –5 V and IT is the threshold current between on-hook and off-hook. K 1 ( ω )ZL • Z T VMG Z M = ---------------- • ------------------------------------------------------------------------------------V M2W Z T + 0.51 V • K 1 ( ω ) • ( 2R F + ZL ) ZM is connected from VMG (metering source) to the RSN pin, VM2W is the desired magnitude of the metering signal at the 2-wire output (usually 2.2 Vrms) and K1 ( ω ) is defined below. 365 R D = --------- , IT 1000 K 1 ( ω ) = -------------------------------------------------------------------------------------------------------– 9 CX 1 + jω 11.5 • 10 + -------- ( 36 + ZL + 2R F ) 2 where: CX = The values of the identical capacitors from A and B to GND ω = 2π • metering frequency SLIC Products 11 DC FEED CHARACTERISTICS 3 4 2 1 VBAT = 50 V VBAT = 47.3 V 5 RDC = 37.5 kΩ Active state OHT state Notes: 1. Constant-resistance read region: RDC V AB = 49.6 – I L ------------- 49.87 2. Anti-sat (battery-tracking) turn-on: V AB = 0.8975 V BAT – 6.835 3. Open Circuit voltage: V AB = 0.7915 V BAT – 0.113 , V BAT < 62.8 V V AB = 49.6 V , V BAT ≥ 62.8 V 4. Anti-sat (battery-tracking) region: R DC V AB = 0.7915 V BAT – 0.113 – I L ----------- 815 5. Current limit: 1724 IL = -----------R DC a. VA–VB (VAB) Voltage vs. Loop Current (Typical) 12 Am79M576A Data Sheet DC FEED CHARACTERISTICS (continued) VBAT = 47.3 V RDC = 37.5 kΩ b. Loop Current vs. Load Resistance (Typical) A a RL SLIC IL RSN RDC1 b RDC2 CDC B RDC Feed current programmed by RDC1 and RDC2 c. Feed Programming Figure 1. DC Feed Characteristics SLIC Products 13 Am79M576APC – Power @ VBAT = –48 V POWER, Watts 1.5 1 0.5 0 0 1250 2500 3750 Line Resistance (RL), Ω Figure 2. Active State Total Power Dissipation (Typical) 14 Am79M576A Data Sheet 5000 TEST CIRCUITS VTX A(TIP) VTX A(TIP) RL RT 2 SLIC VAB VL RTMG SLIC RL VAB AGND RL RT AGND VRX RRX 2 RRX B(RING) RSN B(RING) RSN IL4-2 = –20 log (VAB / VRX) IL2-4 = –20 log (VTX / VAB) VRX BRS = 20 log (VTX / VRX) A. Two- to Four-Wire Insertion Loss 1 ωC B. Four- to Two-Wire Insertion Loss and Balance Return Signal ZD << RL A(TIP) VTX A(TIP) VTX RL 2 C S1 VL VL SLIC AGND RL RT RT VM VS S2 2 B(RING) SLIC R AGND R RRX ZIN RSN B(RING) RSN VRX S2 Open, S1 Closed L-T Long. Bal. = 20 log (VAB / VL) Note: ZD is the desired impedance (e.g., the characteristic impedance of the line). L-4 Long. Bal. = 20 log (VTX / VL) S2 Closed, S1 Open RRX RL = log (2 VM / VS) 4-L Long. Sig. Gen. = 20 log (VL / VRX) C. Longitudinal Balance D. Two-Wire Return Loss Test Circuit SLIC Products 15 TEST CIRCUITS (continued) 68 Ω C RL A(TIP) 56 Ω IDC A(TIP) SM SLIC RL B(RING) 68 Ω C RG B(RING) 1 ωC SE Current Feed or Ground Key << 90 Ω F. Ground-Key Detection E. Single Frequency Noise VCC 6.2 kΩ A(TIP) A(TIP) DET 15 pF RL = 600 Ω B(RING) E0 RG = 3.9 kΩ B(RING) E1 G. Loop-Detector Switching 16 Am79M576A Data Sheet H. Ground-Key Switching PHYSICAL DIMENSION PL032 .447 .453 .485 .495 .009 .015 .585 .595 .042 .056 .125 .140 Pin 1 I.D. .080 .095 .547 .553 SEATING PLANE .400 REF. .490 .530 .013 .021 .050 REF. .026 .032 TOP VIEW SIDE VIEW 16-038FPO-5 PL 032 DA79 6-28-94 ae REVISION SUMMARY Revision A to Revision B • Minor changes were made to the data sheet style and format to conform to AMD standards. Revision B to Revision C • In the Pin Description table, inserted/changed TP pin description to: “Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation.” • Minor changes were made to the data sheet style and format to conform to AMD standards. Revision C to Revision D • The physical dimension (PL032) was added to the Physical Dimension section. • Deleted the Ceramic DIP and Plastic DIP packages and references to them. • Updated the Pin Description table to correct inconsistencies. SLIC Products 17 The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. © 1999 Advanced Micro Devices, Inc. All rights reserved. Trademarks AMD, the AMD logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.