AMD AM79M576A

Am79M576A
Metering Subscriber Line Interface Circuit
DISTINCTIVE CHARACTERISTICS
■ Programmable constant-resistance feed
■ On-chip switching regulator for low-power
dissipation
■ Programmable loop-detect threshold
■ Two-wire impedance set by single external
impedance
■ Ground-key detect
■ Performs polarity reversal
■ Tip Open state for ground-start lines
■ Ring relay driver
■ Supports 2.2 Vrms metering (12 and 16 kHz)
■ On-hook transmission
■ Line feed characteristics independent of battery
variations
BLOCK DIAGRAM
A(TIP)
Ring Relay
Driver
RINGOUT/DGND
C1
Ground-Key
Detector
HPA
VCCRING
C2
Input Decoder
and Control
C3
E0
E1
HPB
B(RING)
Two-Wire
Interface
DET
VTX
Signal
Transmission
RSN
Off-Hook Detector
RD
Power-Feed
Controller
DA
DB
VREG
RDC
Ring-Trip
Detector
L
VBAT
Switching
Regulator
BGND
CHS QBAT CHCLK
VCC
VEE
AGND/DGND
Publication# 18412 Rev: D Amendment: /0
Issue Date: October 1999
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the elements below.
Am79M576A
J
C
TEMPERATURE RANGE
C = Commercial (0°C to 70°C)*
PACKAGE TYPE
J = 32-pin Plastic Leaded Chip Carrier (PL 032)
PERFORMANCE GRADE
Blank = Standard Specification
–1 = Performance Grading
–2 = Performance Grading
DEVICE NUMBER/DESCRIPTION
Am79M576A
Metering Subscriber Line Interface Circuit
Valid Combinations
Am79M576A
–1
–2
JC
Valid Combinations
Valid Combinations list configurations planned to
be supported in volume for this device. Consult
the local AMD sales office to confirm availability
of specific valid combinations, to check on newly
released combinations, and to obtain additional
data on AMD’s standard military grade products.
Note:
* Functionality of the device from 0°C to +70°C is guaranteed by production testing. Performance from –40°C to +85°C is
guaranteed by characterization and periodic sampling of production units.
2
Am79M576A Data Sheet
CONNECTION DIAGRAM
Top View
RINGOUT/DGND
VCC
VREG
BGND
B(RING)
A(TIP)
DB
32-Pin PLCC
4
3
2
1
32
31
30
VCCRING
6
28
DA
L
7
27
RD
VBAT
8
26
HPB
QBAT
9
25
HPA
CHS
10
24
VTX
CHCLK
11
23
VEE
RSVD
12
22
RSN
E1
13
21
AGND
17 18
19 20
DGND
16
RDC
15
C1
14
C3
TP
C2
29
DET
5
E0
TP
Notes:
1. Pin 1 is marked for orientation.
2. TP is a thermal conduction pin tied to substrate.
3. RSVD = Reserved. Do not connect to this pin.
SLIC Products
3
PIN DESCRIPTIONS
Pin Names
Type
Description
AGND
Gnd
Analog (quiet) ground
A(TIP)
Output
Output of A(TIP) power amplifier
BGND
Gnd
Battery (power) ground
B(RING)
Output
Output of B(RING) power amplifier
C3–C1
Input
Decoder. TTL compatible. C3 is MSB and C1 is LSB.
CHCLK
Input
Chopper clock. Input to switching regulator (TTL compatible). Freq = 256 kHz (Nominal).
CHS
Input
Chopper Stabilization. Connection for external stabilization components.
DA
Input
Ring-trip negative. Negative input to ring-trip comparator.
DB
Input
Ring-trip positive. Positive input to ring-trip comparator.
DET
Output
Detector. When enabled, a logic Low indicates that the selected detector is tripped. Logic inputs
C3–C1, E1, and E0 select the detector. Open-collector with a built-in 15 kΩ pull-up resistor.
DGND
Gnd
Digital ground
E0
Input
A logic High enables DET. A logic Low disables DET.
E1
Input
Ground-key enable. E1 = High connects the ground-key detector to DET, and E1 = Low connects
the off-hook or ring-trip detector to DET.
HPA
Capacitor
High-pass filter capacitor. A(TIP) side of high-pass filter capacitor.
HPB
Capacitor
High-pass filter capacitor. B(RING) side of high-pass filter capacitor.
L
Output
Switching Regulator Power Transistor. Connection point for filter inductor and anode of catch
diode. Has up to 60 V of pulse waveform and must be isolated from sensitive circuits. Keep the
diode connections short because of the high currents and high di/dt.
QBAT
Battery
Quiet Battery. Filtered battery supply for the signal processing circuits.
RD
Resistor
Detector resistor. Threshold modification and filter point for the off-hook detector.
RDC
Resistor
DC feed resistor. Connection point for the DC feed current programming network, which also
connects to the Receiver Summing Node (RSN). VRDC is negative for normal polarity and positive
for reverse polarity.
RINGOUT/
DGND
Output
Relay ground for 5 V relays—externally connected to DGND.
RSN
Input
The metallic current (AC and DC) between A(TIP) and B(RING) is equal to 1000 x the current into
this pin. The networks that program receive gain, two-wire impedance, and feed current all
connect to this node.
TP
Thermal
Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as
open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper
on the board to enhance heat dissipation.
VBAT
Battery
Battery supply
VCC
Power
+5 V power supply
VCCRING
Input
Ring relay driver (sinks current to RINGOUT).
VEE
Power
–5 V power supply
VREG
Input
Regulated Voltage. Provides negative power supply for power amplifiers, connection point for
inductor, filter capacitor, and chopper stabilization.
VTX
Output
Transmit Audio. This output is 0.510 times the A(TIP) and B(RING) metallic voltage.The other end
of the two-wire input impedance programming network connects here.
4
Am79M576A Data Sheet
ABSOLUTE MAXIMUM RATINGS
OPERATING RANGES
Storage temperature ......................... –55°C to +150°C
Commercial (C) Devices
Ambient temperature, operating ........... –0°C to +70°C
Ambient temperature ............................. 0°C to +70°C*
VCC with respect to AGND ................. –0.4 V to +7.0 V
VCC ..................................................... 4.75 V to 5.25 V
VEE with respect to AGND ................. +0.4 V to –7.0 V
VEE ................................................. –4.75 V to –5.25 V
VBAT with respect to AGND ................ +0.4 V to –70 V
VBAT .................................................. –46.4 V to –54 V
Note: Rise time of VBAT (dv/dt) must be limited to 27 V/µs or
less when QBAT bypass is 0.33 µF.
VCCRING ................................................. 0 V to 5.25 V
BGND with respect to AGND/DGND.. +1.0 V to –3.0 V
BGND with respect to AGND.................... –2 V to +2 V
A(TIP) or B(RING) to BGND:
Load resistance on VTX to ground .............. 10 kΩ min
Continuous ......................................... –70 V to +2 V
10 ms (f = 0.1 Hz) ............................... –70 V to +5 V
1 µs (f = 0.1 Hz) ................................ –90 V to +10 V
250 ns (f = 0.1 Hz) .......................... –120 V to +15 V
Current from A(TIP) or B(RING) ....................... ±150 mA
Voltage on VCCRING ........................... –0.3 V to +7 V
AGND/DGND.......................................................... 0 V
Operating Ranges define those limits between which device
functionality is guaranteed.
* Functionality of the device from 0°C to +70°C is guaranteed
by production testing. Performance from –40°C to +85°C is
guaranteed by characterization and periodic sampling of
production units.
Current through relay drivers or
internal driver catch diodes ..............................60 mA
Voltage on ring-trip inputs DA and DB .......VBAT to 0 V
Current into ring-trip inputs.................................. ±10 mA
Peak current into regulator switch (L pin) ........150 mA
Switcher transient peak off voltage on L pin ......+1.0 V
C3–C1, E0, E1, CHCLK
to AGND...................................–0.4 V to VCC + 0.4 V
Maximum power dissipation (see note) ....... TA = 70°C
In 32-pin PLCC package..................................1.2 W
Note: Thermal limiting circuitry on-chip will shut down the
circuit at a junction temperature of about 165°C. The device should never be exposed to this temperature. Operation above 145°C junction temperature may degrade
device reliability. See the SLIC Packaging Considerations
for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
SLIC Products
5
ELECTRICAL CHARACTERISTICS
Description
Test Conditions (See Note 1)
Min
Analog output (VTX) impedance
Analog (VTX) output offset
0°C to +25°C
+25°C to +85°C
–40°C to 0°C
Analog (RSN) input impedance
Longitudinal impedance at A or B
Overload level
4-wire
2-wire
Typ
Max
Unit
3
20
Ω
+40
+35
+45
mV
4
—
4
20
35
Ω
4
+3.1
+5.5
Vpk
2
dB
4
–40
–35
–45
300 Hz to 3.4 kHz
1
–3.1
–5.5
ZIN = 600 to 900 Ω
Note
Transmission Performance, 2-Wire Impedance
2-wire return loss
(See Test Circuit D)
300 Hz to 500 Hz
500 Hz to 2.5 kHz
2.5 kHz to 3.4 kHz
OHT 300 Hz to 3.4 kHz
26
26
20
14
Longitudinal Balance (2-Wire and 4-Wire, See Test Circuit C); RL = 600 Ω
Longitudinal to metallic L-T, L-4
300 Hz to 3.4 kHz
48
Longitudinal sum (L-T) + (T-L)
300 Hz to 3.4 kHz
95
Longitudinal signal generation
4-L or T-L
300 Hz to 800 Hz
800 Hz to 3.4 kHz
40
35
Longitudinal current capability
per wire
Active state, 50 Hz to 200 Hz
OHT state, 50 Hz to 200 Hz
17
8
dB
mA
peak
Dial pulse make or break
response time of DET
3
4
ms
Insertion Loss (See Test Circuits A and B)
2- to 4-wire
VAB = 0 dBm, 1 kHz
0°C to +70°C
–40°C to +85°C
5.70
5.65
4- to 2-wire
VRX = 0 dBm, 1 kHz
0°C to +70°C
–40°C to +85°C
–0.15
–0.20
5.85
5.85
6.00
6.05
+0.15
+0.20
4- to 2-wire (In the presence of
2.2 Vrms metering)
—
4
dB
1.5
—
4
4
Metering Signal Insertion Loss (See Test Circuit B)
4- to 2-wire
RL = 260, VAB = 2.86 Vrms
RTMG = 139.5 kΩ
f = 12 kHz or 16 kHz
–0.8
–0.2
+0.4
dB
4
Insertion Loss vs. Frequency (See Test Circuits A and B)
2- to 4-wire or
4- to 2-wire
300 Hz to 3.4 kHz
Relative to 1 kHz
0°C to +70°C
–40°C to +85°C
–0.1
–0.15
+0.1
+0.15
dB
—
4
+7 dBm to –55 dBm
0°C to +70°C
Reference: 0 dBm
–40°C to +85°C
–0.1
–0.15
+0.1
+0.15
dB
—
4
Gain Tracking (See Test Circuits A and B)
2- to 4-wire or
4- to 2-wire
Balance Return Signal (4- to 4-Wire, See Test Circuit B)
6
Gain accuracy
0 dBm, 1 kHz
0°C to +70°C
–40°C to +85°C
–6.00
–6.05
Variation with frequency relative
to 1 kHz
300 Hz to 3.4 kHz
0°C to +70°C
–40°C to +85°C
–0.1
–0.15
+0.1
+0.15
Gain tracking
+3 dBm to –55 dBm
0°C to +70°C
Reference: –4 dBm –40°C to +85°C
–0.1
–0.15
+0.1
+0.15
Group delay
f = 1 kHz
3.3
Am79M576A Data Sheet
–5.85
–5.85
5.3
–5.70
–5.65
7.3
—
4
dB
3, 4
4
—
4
µs
4
ELECTRICAL CHARACTERISTICS (continued)
Description
Test Condition (See Note 1)
Min
Typ
Max
Unit
Note
Total Harmonic Distortion (2- to 4-Wire or 4- to 2-Wire) without Metering (See Test Circuits A and B)
0 dBm
+9 dBm
–64
–55
300 Hz to 3.4 kHz
–50
–40
–35
Total Harmonic Distortion
with metering
dB
4, 11
Idle Channel Noise without Metering
Psophometric weighted noise
2-wire
4-wire
–75
–80
Psophometric idle channel noise
with metering
2-wire
4-wire
–46
–52
7
dBmp
4, 7, 12
4, 7, 12
Single Frequency Out-of-Band Noise (See Test Circuit E)
Metallic
4 kHz to 9 kHz
9 kHz to 1 MHz
256 kHz and harmonics
–76
–76
–57
Longitudinal
1 kHz to 15 kHz
Above 15 kHz
256 kHz and harmonics
–70
–85
–57
dBm
4, 5, 9
4, 5, 9
4, 5
4, 5, 9
4, 5, 9
4, 5
Line Characteristics (See Figures 1a, 1b, and 1c) BAT = 48 V, VBAT = –47.3 V, RL = 600 Ω and 900 Ω
Apparent battery voltage
Active state
47
Loop current accuracy
Active state
–7.5
Loop current, Tip Open state
Open Circuit state
RL = 600 Ω
RL = 0 Ω
Loop current limit accuracy
OHT state
IL = 13.5 mA, RL = 0 Ω
Loop current—Active state
RL = 2.25 kΩ
14.33
Loop current—Active state
Battery = –48.0 V
RL = 1.96 kΩ
RL = 0 Ω
17.5
41
50
Loop current—OHT
Battery = –47.0 V
RL = 2.25 kΩ
RL = 0 Ω
9.35
15.5
Fault current limit, ILLIM, A and
B shorted to GND in OHT state
50
–15
56
Fault current limit, ILLIM,
A and B shorted to GND in
Active state
53
V
+7.5
%
1.0
mA
+15
%
80
10
mA
110
Battery Current in Fault Condition
OHT state
A and B to GND
40
Active state
A and B to GND
55
mA
Power Dissipation
On hook, Open Circuit state
On hook, OHT state
On hook, Active state
Off hook, OHT state
Off hook, Active state
(See Figure 2)
RL = 600 Ω
40
140
190
350
80
200
300
500
RL = 600 Ω
RL = 220 Ω
750
900
900
1100
SLIC Products
mW
7
ELECTRICAL CHARACTERISTICS (continued)
Description
Test Conditions (See Note 1)
Min
Typ
Max
Unit
Note
Supply Currents
VCC, on-hook supply current
Open Circuit state
OHT state
Active state
2
5
6
4.0
7.0
9.0
VEE, on-hook supply current
Open Circuit state
OHT state
Active state
1.0
2.3
2.3
2.0
4.0
4.5
VBAT, on-hook supply current
Open Circuit state
OHT state
Active state
0.4
2.2
3.2
1.0
3.5
5.0
VBAT, off-hook supply current
OHT state
RL = 0 to 2.2 kΩ
mA
15.5
Power Supply Rejection Ration (VRIPPLE = 50 mVrms, Saturation Guard Inactive)
VCC
40 Hz to 3.4 kHz
3.4 kHz to 50 kHz
18
18
35
30
VEE
40 Hz to 3.4 kHz
3.4 kHz to 50 kHz
20
13
30
25
VBAT
40 Hz to 3.4 kHz
3.4 kHz to 50 kHz
27
20
30
30
IDET = 365/RD
–15
6, 7
dB
6, 7
6, 7
Off-Hook Detector
Current threshold
+15
%
10.0
kΩ
Ground-Key Off-Hook Detector Thresholds, Active State
Resistance threshold
B(RING) to GND
Current threshold
B(RING) to GND
Midpoint to GND
2.0
5
9
mA
–5
–0.05
µA
–50
0
8
Ring-Trip Detector Inputs
Bias current
Offset voltage
Source resistance = 0 to 200 kΩ
+50
mV
Logic Inputs (C3–C1, E0, E1, and CHCLK)◆
Input High voltage
2.0
Input Low voltage
Input High current
0.8
All inputs except E1
Input E1
Input Low current
–75
–75
40
45
–0.4
V
µA
mA
Logic Output (DET)
Output Low voltage
IOUT = 0.8 mA
Output High voltage
IOUT = –0.1 mA
0.4
2.4
V
Relay Driver
On voltage
(VCCRING to RINGOUT)
50 mA to VCCRING, RINGOUT
connected to AGND/DGND
Off leakage
0.5
Zener breakover voltage
100 µA
Zener On voltage
30 mA
6.0
8
Am79M576A Data Sheet
V
100
µA
7.2
10.0
Note:
◆ C3–C1, and E0 have an internal pull up. E1 has an internal pull down.
1.25
11.0
V
*
RELAY DRIVER SCHEMATIC
VCCRING
7V
RINGOUT/DGND
QBAT
SWITCHING CHARACTERISTICS
Symbol
Parameter
Test Conditions
E1 Low to DET High (E0 = 1)
Temperature
Ranges
Min
Typ
Max
0°C to +70°C
–40°C to 85°C
3.8
4.0
0°C to +70°C
–40°C to 85°C
1.1
1.6
0°C to +70°C
–40°C to 85°C
1.1
1.6
Unit
Note
µs
4
tgkde
E1 Low to DET Low (E0 = 1)
Ground-Key Detect state
RL open, RG connected
(See Figure H)
tgkdd
E0 High to DET Low (E1 = 0)
tgkd0
E0 Low to DET High (E1 = 0)
0°C to +70°C
–40°C to 85°C
3.8
4.0
E1 High to DET Low (E0 = 1)
0°C to +70°C
–40°C to 85°C
1.2
1.7
0°C to +70°C
–40°C to 85°C
3.8
4.0
0°C to +70°C
–40°C to 85°C
1.1
1.6
0°C to +70°C
–40°C to 85°C
3.8
4.0
tshde
E1 High to DET High (E0 = 1)
tshdd
E0 High to DET Low (E1 = 1)
tshd0
E0 Low to DET High (E1 = 1)
Switchhoook Detect state
RL = 600 Ω, RG open
(See Figure G)
SLIC Products
9
SWITCHING WAVEFORMS
E1 to DET
E1
DET
tgkde
tshde
tgkde
tshde
E0 to DET
E1
E0
DET
tshdd
Note:
All delays measured at 1.4 V level.
tshd0
tgkdd
tgkd0
Notes:
* When any power supplies to the MSLIC are removed and the MSLIC is not in the Ringing state, the relay driver must not
activate when the relay coil connected to VCCRING is supplied by the same VCC used for powering the MSLIC.
If the relay coil connected to VCCRING is supplied by a voltage other than the VCC used for powering the MSLIC, you must:
– Provide redundancy of VCC from the supply voltage of the relay
– As an alternative, limit the current flowing to all digital inputs to less than 1 mA.
1. Unless otherwise noted, test conditions are BAT = 48 V (voltage at chip VBAT pin = –47.3 V), VCC = +5 V, VEE = –5 V,
RL = 600 Ω, CHP = 0.22 µF, RDC1 = RDC2 = 18.7 kΩ, CDC = 0.15 µF, Rd = 57.6 kΩ, no fuse resistors, two-wire AC output
impedance programming impedance (ZT) = 306 kΩ resistive, receive input summing impedance (ZRX) = 300 kΩ resistive.
(See Table 2 for component formulas.) Operation in polarity reverse is tested in production.
2. Overload level is defined when THD = 1%.
3. Balance return signal is the signal generated at VTX by VRX. This specification assumes that the two-wire AC load impedance
matches the impedance programmed by ZT.
4. Not tested in production. This parameter is guaranteed by characterization or correlation to other tests.
5. These tests are performed with a longitudinal impedance of 90 Ω and metallic impedance of 300 Ω for frequencies < 12 kHz and
135 Ω for frequencies >12 kHz. These tests are extremely sensitive to circuit board layout. Refer to application notes for details.
6. This parameter is tested at 1 kHz in production. Performance at other frequencies is guaranteed by characterization.
7. When the SLIC is in the anti-sat 2 operating region, this parameter will be degraded. The exact degradation will depend on
system design. The anti-sat 2 region occurs at high loop resistances when |VBAT| – |VAX – VBX| is less than approximately 13 V.
8. “Midpoint” is defined as the connection point between two 300 Ω series resistors connected between A(TIP) and B(RING).
9. Fundamental and harmonics from 256 kHz switch regulator chopper are not included.
10. Calculate loop current limit, which depends upon the programmed apparent open circuit voltage and the feed resistance, is
as follows:
50 • V APPARENT
-------------------------------------------In OHT state: ILIMIT = 0.202 and
R DC
= 0.68
In Active state: I
LIMIT
10
Am79M576A Data Sheet
11. Total Harmonic distortion with metering is specified with a metering signal of 2.2 Vrms at the two-wire output, and a transmit
signal of +3 dBm or receive signal of –4 dBm. The transmit or receive signals are single-frequency inputs, and the distortion
is measured as the highest in band harmonic at the two-wire or the four-wire output relative to the input signal.
12. Noise with metering is measured by applying a 2.2 Vrms metering signal (measured at the two-wire output) and measuring
the psophometric noise at the two-wire outputs over a 200 ms time interval.
Table 1. SLIC Decoding
DET Output
State
C3 C2 C1
E0 = 1*
E1 = 0
Two-Wire Status
E0 = 1*
E1 = 1
0
0
0
0
Open Circuit
Ring trip
Ring trip
1
0
0
1
Ringing
Ring trip
Ring trip
2
0
1
0
Active
Loop detector
Ground key
3
0
1
1
On-hook TX (OHT)
Loop detector
Ground key
4
1
0
0
Tip Open
Loop detector
—
5
1
0
1
Reserved
Loop detector
—
6
1
1
0
Active Polarity Reversal
Loop detector
Ground key
7
1
1
1
OHT Polarity Reversal
Loop detector
Ground key
Note:
* A logic Low on E0 disables DET output into the Open Collector state.
Table 2.
User-Programmable Components
Z T = 510 ( Z2WIN – 2R F )
ZT is connected between the VTX and RSN pins. The fuse
resistors are RF, and Z2WIN is the desired two-wire AC input
impedance. When computing ZT, the internal current amplifier
pole and any external stray capacitance between VTX and
RSN must be taken into account.
Z RX = 0.98 ( Z T )
ZRX is connected from VRX to RSN. ZT is defined above. This
equation sets the receive gain to 0 dB when the SLIC
terminates with an impedance equal to Z2WIN.
R DC1 + R DC2 = 50 • ( R FEED – 2R F )
RDC1, RDC2, and CDC form the network connected to the RDC
pin. RDC1 and RDC2 are approximately equal.
R DC1 + R DC2
C DC = 1.5 ms • --------------------------------RDC1 • R DC2
0.5 ms
C D = ---------------RD
RD and CD form the network connected from RD to –5 V and IT
is the threshold current between on-hook and off-hook.
K 1 ( ω )ZL • Z T
VMG
Z M = ---------------- • ------------------------------------------------------------------------------------V M2W Z T + 0.51 V • K 1 ( ω ) • ( 2R F + ZL )
ZM is connected from VMG (metering source) to the RSN pin,
VM2W is the desired magnitude of the metering signal at the
2-wire output (usually 2.2 Vrms) and K1 ( ω ) is defined below.
365
R D = --------- ,
IT
1000
K 1 ( ω ) = -------------------------------------------------------------------------------------------------------–
9
CX
1 + jω  11.5 • 10 + -------- ( 36 + ZL + 2R F )
2
where: CX = The values of the identical capacitors from
A and B to GND
ω = 2π • metering frequency
SLIC Products
11
DC FEED CHARACTERISTICS
3
4
2
1
VBAT = 50 V
VBAT = 47.3 V
5
RDC = 37.5 kΩ
Active state
OHT state
Notes:
1. Constant-resistance read region:
RDC
V AB = 49.6 – I L  -------------
49.87
2. Anti-sat (battery-tracking) turn-on:
V AB = 0.8975 V BAT – 6.835
3. Open Circuit voltage:
V AB = 0.7915 V BAT – 0.113 ,
V BAT < 62.8 V
V AB = 49.6 V ,
V BAT ≥ 62.8 V
4. Anti-sat (battery-tracking) region:
R DC
V AB = 0.7915 V BAT – 0.113 – I L  -----------
 815 
5. Current limit:
1724
IL = -----------R DC
a. VA–VB (VAB) Voltage vs. Loop Current (Typical)
12
Am79M576A Data Sheet
DC FEED CHARACTERISTICS (continued)
VBAT = 47.3 V
RDC = 37.5 kΩ
b. Loop Current vs. Load Resistance (Typical)
A
a
RL
SLIC
IL
RSN
RDC1
b
RDC2
CDC
B
RDC
Feed current programmed by RDC1 and RDC2
c. Feed Programming
Figure 1. DC Feed Characteristics
SLIC Products
13
Am79M576APC – Power @ VBAT = –48 V
POWER, Watts
1.5
1
0.5
0
0
1250
2500
3750
Line Resistance (RL), Ω
Figure 2. Active State Total Power Dissipation (Typical)
14
Am79M576A Data Sheet
5000
TEST CIRCUITS
VTX
A(TIP)
VTX
A(TIP)
RL
RT
2
SLIC
VAB
VL
RTMG
SLIC
RL
VAB
AGND
RL
RT
AGND
VRX
RRX
2
RRX
B(RING) RSN
B(RING) RSN
IL4-2 = –20 log (VAB / VRX)
IL2-4 = –20 log (VTX / VAB)
VRX
BRS = 20 log (VTX / VRX)
A. Two- to Four-Wire Insertion Loss
1
ωC
B. Four- to Two-Wire Insertion Loss and Balance Return Signal
ZD
<< RL
A(TIP)
VTX
A(TIP)
VTX
RL
2
C
S1
VL
VL
SLIC
AGND
RL
RT
RT
VM
VS
S2
2
B(RING)
SLIC
R
AGND
R
RRX
ZIN
RSN
B(RING)
RSN
VRX
S2 Open, S1 Closed
L-T Long. Bal. = 20 log (VAB / VL)
Note:
ZD is the desired impedance (e.g., the
characteristic impedance of the line).
L-4 Long. Bal. = 20 log (VTX / VL)
S2 Closed, S1 Open
RRX
RL = log (2 VM / VS)
4-L Long. Sig. Gen. = 20 log (VL / VRX)
C. Longitudinal Balance
D. Two-Wire Return Loss Test Circuit
SLIC Products
15
TEST CIRCUITS (continued)
68 Ω
C
RL
A(TIP)
56 Ω
IDC
A(TIP)
SM
SLIC
RL
B(RING)
68 Ω C
RG
B(RING)
1
ωC
SE
Current Feed
or Ground Key
<< 90 Ω
F. Ground-Key Detection
E. Single Frequency Noise
VCC
6.2 kΩ
A(TIP)
A(TIP)
DET
15 pF
RL = 600 Ω
B(RING)
E0
RG = 3.9 kΩ
B(RING)
E1
G. Loop-Detector Switching
16
Am79M576A Data Sheet
H. Ground-Key Switching
PHYSICAL DIMENSION
PL032
.447
.453
.485
.495
.009
.015
.585
.595
.042
.056
.125
.140
Pin 1 I.D.
.080
.095
.547
.553
SEATING
PLANE
.400
REF.
.490
.530
.013
.021
.050 REF.
.026
.032
TOP VIEW
SIDE VIEW
16-038FPO-5
PL 032
DA79
6-28-94 ae
REVISION SUMMARY
Revision A to Revision B
•
Minor changes were made to the data sheet style and format to conform to AMD standards.
Revision B to Revision C
•
In the Pin Description table, inserted/changed TP pin description to: “Thermal pin. Connection for heat dissipation.
Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP
pins can connect to an area of copper on the board to enhance heat dissipation.”
• Minor changes were made to the data sheet style and format to conform to AMD standards.
Revision C to Revision D
•
The physical dimension (PL032) was added to the Physical Dimension section.
•
Deleted the Ceramic DIP and Plastic DIP packages and references to them.
•
Updated the Pin Description table to correct inconsistencies.
SLIC Products
17
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