ONSEMI MC74AC299DWR2

MC74AC299, MC74ACT299
8−Input Universal Shift/
Storage Register with
Common Parallel I/O Pins
The MC74AC299/74ACT299 is an 8−bit universal shift/storage
register with 3−state outputs. Four modes of operation are possible:
hold (store), shift left, shift right and load data. The parallel load inputs
and flip−flop outputs are multiplexed to reduce the total number of
package pins. Additional outputs are provided for flip−flops Q0, Q7 to
allow easy serial cascading. A separate active LOW Master Reset is
used to reset the register.
•
•
•
•
•
•
w
Common Parallel I/O for Reduced Pin Count
Additional Serial Inputs and Outputs for Expansion
Four Operating Modes: Shift Left, Shift Right, Load and Store
3−State Outputs for Bus−Oriented Applications
Outputs Source/Sink 24 mA
′ACT299 Has TTL Compatible Inputs
These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
VCC
S1
DS7
Q7
I/O7
I/O5
I/O3
I/O1
CP
DS0
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
S0
OE1
OE2
I/O6
I/O4
I/O2
I/O0
Q0
MR
GND
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PDIP−20
N SUFFIX
CASE 738
20
1
SO−20
DW SUFFIX
CASE 751
20
1
ORDERING INFORMATION
Device
Package
Shipping
MC74AC299N
PDIP−20
18 Units/Rail
MC74ACT299N
PDIP−20
18 Units/Rail
MC74AC299DW
SOIC−20
38 Units/Rail
MC74AC299DWR2
SOIC−20
1000 Tape & Reel
MC74ACT299DW
SOIC−20
38 Units/Rail
MC74ACT299DWR2
SOIC−20
1000 Tape & Reel
DEVICE MARKING INFORMATION
Figure 1. Pinout: 20−Lead Packages Conductors
(Top View)
See general marking information in the device marking
section on page 9 of this data sheet.
PIN ASSIGNMENT
PIN
FUNCTION
CP
Clock Pulse Input
DS0
Serial Data Input for Right Shift
DS7
Serial Data Input for Left Shift
S0, S1
Mode Select Inputs
MR
Asynchronous Master Reset
OE1, OE2
3−State Output Enable Inputs
I/O0−I/O7
Parallel Data Inputs or 3−State Parallel Outputs
Q0, Q7
Serial Outputs
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 8
1
Publication Order Number:
MC74AC299/D
MC74AC299, MC74ACT299
DS7
S0
DS0
Q7
DS7
S1
Q7
CP
D Q
CD
I/O7
OE MR Q I/O I/O I/O I/O I/O I/O I/O I/O
0
0
1
2
3
4
5
6
7
CP
D Q
CD
Figure 2. Logic Symbol
I/O6
CP
D Q
CD
I/O5
CP
D Q
CD
I/O4
CP
D Q
CD
I/O3
CP
D Q
CD
I/O2
CP
D Q
CD
I/O1
CP
D Q
CD
I/O0
S0
S1
DS0
NOTE:
CP
OE1
Q0 MR
That this diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation delays.
Figure 3. Logic Diagram
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2
OE2
MC74AC299, MC74ACT299
FUNCTIONAL DESCRIPTION
The MC74AC299/74ACT299 contains eight edge−triggered
D−type flip−flops and the interstage logic necessary to
perform synchronous shift left, shift right, parallel load and
hold operations. The type of operation is determined by S0
and S1, as shown in the Truth Table. All flip−flop outputs are
brought out through 3−state buffers to separate I/O pins that
also serve as data inputs in the parallel load mode. Q0 and Q7
are also brought out on other pins for expansion in serial
shifting of longer words.
A LOW signal on MR overrides the Select and CP inputs
and resets the flip−flops. All other state changes are initiated
by the rising edge of the clock. Inputs can change when the
clock is in either state provided only that the recommended
setup and hold times, relative to the rising edge of CP, are
observed.
A HIGH signal on either OE1 or OE2 disables the 3-state
buffers and puts the I/O pins in the high impedance state. In
this condition the shift, hold, load and reset operations can
still occur. The 3−state buffers are also disabled by HIGH
signals on both S0 and S1 in preparation for a parallel load
operation.
TRUTH TABLE
Inputs
MR
S1
S0
CP
L
H
H
H
H
X
H
L
H
L
X
H
H
L
L
X
X
Response
Asynchronous Reset; Q0−Q7 = LOW
Parallel Load; I/On → Qn
Shift Rights; DS0 → Q0, Q0 → Q1, etc.
Shift Left; DS7 → Q7, Q7 → Q6, etc.
Hold
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
= LOW-to-HIGH Transition
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
−0.5 to +7.0
V
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
VOUT
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
IIN
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the
Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VIN, VOUT
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Min
Typ
Max
Unit
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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3
ns/V
MC74AC299, MC74ACT299
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74AC
74AC
TA = +25°C
TA =
−40°C to
+85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
±1.0
μA
VI = VCC, GND
5.5
−
±0.6
±6.0
μA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
μA
VIN = VCC or GND
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOZT
Maximum 3−State
Current
IOLD
†Minimum Dynamic
Output Current
IOHD
ICC
Maximum Quiescent
Supply Current
IOUT = −50 μA
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
V
IOUT = 50 μA
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
V
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
fmax
Maximum Input
Frequency
3.3
5.0
90
130
−
−
−
−
80
105
−
−
MHz
3−3
tPLH
Propagation Delay
CP to Q0 or Q7
3.3
5.0
8.5
5.5
−
−
20.5
14
7.0
4.5
22
15
ns
3−6
tPHL
Propagation Delay
CP to Q0 or Q7
3.3
5.0
8.5
5.5
−
−
21.5
14.5
7.0
5.0
23
16
ns
3−6
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
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4
MC74AC299, MC74ACT299
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
CP to I/On
3.3
5.0
9.0
6.0
−
−
20.5
14.5
7.5
5.0
22.5
16
ns
3−6
tPHL
Propagation Delay
CP to I/On
3.3
5.0
10
6.5
−
−
23
16
8.5
6.0
24.5
17.5
ns
3−6
tPHL
Propagation Delay
MR to Q0 or Q7
3.3
5.0
9.0
5.5
−
−
22.5
15.5
7.5
5.0
25.0
17.0
ns
3−6
tPHL
Propagation Delay
MR to I/On
3.3
5.0
9.0
5.5
−
−
21.5
15.0
7.5
5.0
24.0
16.5
ns
3−6
tPZH
Output Enable Time
OE to I/On
3.3
5.0
7.0
4.5
−
−
18
12.5
6.0
4.0
19.5
13.5
ns
3−7
tPZL
Output Enable Time
OE to I/On
3.3
5.0
7.0
5.0
−
−
18
12.5
6.0
4.0
20.5
14
ns
3−8
tPHZ
Output Disable Time
OE to I/On
3.3
5.0
6.5
3.5
−
−
18.5
14
5.5
3.0
19.5
15
ns
3−7
tPLZ
Output Disable Time
OE to I/On
3.3
5.0
5.5
3.5
−
−
17
12.5
4.5
2.0
19
13.5
ns
3−8
Unit
Fig.
No.
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
AC OPERATING REQUIREMENTS
Symbol
VCC*
(V)
Parameter
Typ
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Guaranteed Minimum
ts
Setup Time, HIGH or LOW
S0 or S1 to CP
3.3
5.0
−
−
8.0
5.0
8.5
5.5
ns
3−9
th
Hold Time, HIGH or LOW
S0 or S1 to CP
3.3
5.0
−
−
0.5
1.0
0.5
1.0
ns
3−9
ts
Setup Time, HIGH or LOW
I/On to CP
3.3
5.0
−
−
5.5
3.5
6.0
4.0
ns
3−9
th
Hold Time, HIGH or LOW
I/On to CP
3.3
5.0
−
−
0
1.0
0
1.0
ns
3−9
ts
Setup Time, HIGH or LOW
DS0 or DS7 to CP
3.3
5.0
−
−
6.5
4.0
7.0
4.5
ns
3−6
th
Hold Time, HIGH or LOW
DS0 or DS7 to CP
3.3
5.0
−
−
0
1.0
0.5
1.0
ns
3−6
tw
CP Pulse Width, LOW
3.3
5.0
−
−
4.5
3.5
5.0
3.5
ns
3−6
tw
MR Pulse Width, LOW
3.3
5.0
−
−
4.5
3.5
5.0
3.5
ns
3−9
trec
Recovery TIme
MR to CP
3.3
5.0
−
−
1.5
1.5
1.5
1.5
ns
3−9
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
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5
MC74AC299, MC74ACT299
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74ACT
74ACT
TA = +25°C
TA =
−40°C to
+85°C
Typ
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
5.5
−
±0.1
±1.0
μA
VI = VCC, GND
VOL
Maximum Low Level
Output Voltage
V
V
IOUT = −50 μA
*VIN = VIL or VIH
−24 mA
IOH
−24 mA
IOUT = 50 μA
*VIN = VIL or VIH
24 mA
IOL
24 mA
IIN
Maximum Input
Leakage Current
IOZT
Maximum 3-State
Current
5.5
−
±0.6
±6.0
μA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
ΔICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
μA
VIN = VCC or GND
IOHD
ICC
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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6
MC74AC299, MC74ACT299
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
fmax
Maximum Input
Frequency
5.0
120
−
−
110
−
MHz
3−3
tPLH
Propagation Delay
CP to Q0 or Q7
5.0
4.0
−
12.5
3.0
14
ns
3−6
tPHL
Propagation Delay
CP to Q0 or Q7
5.0
4.0
−
13.5
3.5
15
ns
3−6
tPLH
Propagation Delay
CP to I/On
5.0
4.5
−
12.5
4.5
13.5
ns
3−6
tPHL
Propagation Delay
CP to I/On
5.0
5.0
−
15
4.5
16.5
ns
3−6
tPHL
Propagation Delay
MR to Q0 or Q7
5.0
4.0
−
15
4.0
18
ns
3−6
tPHL
Propagation Delay
MR to I/On
5.0
4.0
−
14.5
3.5
17.5
ns
3−6
tPZH
Output Enable Time
OE to I/On
5.0
2.5
−
12
1.5
13
ns
3−7
tPZL
Output Enable Time
OE to I/On
5.0
2.0
−
12
1.5
13.5
ns
3−8
tPHZ
Output Disable Time
OE to I/On
5.0
2.0
−
12.5
2.0
13.5
ns
3−7
tPLZ
Output Disable Time
OE to I/On
5.0
2.5
−
11.5
2.0
12.5
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
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7
MC74AC299, MC74ACT299
AC OPERATING REQUIREMENTS
Symbol
VCC*
(V)
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Typ
Unit
Fig.
No.
Guaranteed Minimum
ts
Setup Time, HIGH or LOW
S0 or S1 to CP
5.0
−
5.0
5.5
ns
3−9
th
Hold Time, HIGH or LOW
S0 or S1 to CP
5.0
−
1.0
1.0
ns
3−9
ts
Setup Time, HIGH or LOW
I/On to CP
5.0
−
4.0
4.5
ns
3−9
th
Hold Time, HIGH or LOW
I/On to CP
5.0
−
1.0
1.0
ns
3−9
ts
Setup Time, HIGH or LOW
DS0 or DS7 to CP
5.0
−
4.5
5.0
ns
3−6
th
Hold Time, HIGH or LOW
DS0 or DS7 to CP
5.0
−
1.0
1.0
ns
3−6
tw
CP Pulse Width
HIGH or LOW
5.0
−
4.0
4.5
ns
3−9
tw
MR Pulse Width, LOW
5.0
−
3.5
3.5
ns
3−9
trec
Recovery Time
MR to CP
5.0
−
1.5
1.5
ns
3−9
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
170
pF
VCC = 5.0 V
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8
MC74AC299, MC74ACT299
MARKING DIAGRAMS
PDIP−20
SO−20
MC74AC299N
AWLYYWW
AC299
AWLYYWW
MC74ACT299N
AWLYYWW
ACT299
AWLYYWW
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
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9
MC74AC299, MC74ACT299
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
20 PIN PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
−A−
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
−T−
K
SEATING
PLANE
G
M
N
E
F
D
J
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
M
T A
M
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
SO−20
DW SUFFIX
20 PIN PLASTIC SOIC PACKAGE
CASE 751D−05
ISSUE F
A
20
q
X 45 _
E
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
10X
0.25
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
11
B
M
D
18X
e
A1
SEATING
PLANE
C
T
http://onsemi.com
10
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74AC299, MC74ACT299
ON Semiconductor and
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