MF1 IC S70 01 Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1 — 18 April 2007 Product data sheet 101731 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader environment, which is built according to NXP specification. This specification describes electrical, physical and dimensional properties of wafers. 2. Ordering information Table 1. Ordering information Type number Package Name MF1ICS7001W/V9D Description Ordering Code Die on sawn wafer 9352 774 53005 3. Mechanical specification 3.1 Wafer • • • • Diameter: 8” Thickness: 150 µm ± 15 µm PGDW: 15601 PCM location: reticle area 3.2 Wafer backside • Material: • Treatment: • Roughness: Si ground and stress relieve Ra max. 0.5 µm Rt max. 5 µm 3.3 Chip dimensions • Chip size: • Scribe lines: 1.42 x 1.34 mm x-line: 86.4 µm y-line: 86.4 µm MF1 IC S70 01 NXP Semiconductors Standard 4Kbyte card IC 3.4 Passivation • Type: • Material: • Thickness: sandwich structure PSG / Nitride(on top) 500 nm / 600 nm 3.5 Bond pads • Pad size: – LA,LB 118 × 118 µm1 – TESTIO 95 × 110 µm2 – VSS 108 × 108 µm2 • Material: • Thickness: Al-Cu 0.85 µm Remark: Substrate is connected to VSS. 1.Passivation window: 90 x 90 µm 2. Pads VSS and TESTIO are disconnected when wafer is sawn. 101731 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 3.1 — 18 April 2007 2 of 7 MF1 IC S70 01 NXP Semiconductors Standard 4Kbyte card IC 4. Limiting values Table 2. Limiting values[1][2][3] In accordance with the Absolute Maximum Rating System (IEC 134) Symbol Parameter Min Max Unit IIN Input Current - 30 mA Ptot Total power dissipation per package - 200 mW Tstg Storage temperature range -55 +125 °C Tamb Operating temperature -25 70 °C VESD electrostatic discharge voltage LA-LB ILU Latch-up current [4] 2 kV ± 100 mA [1] Stresses above one or more of the limiting values may cause permanent damage to the device [2] These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section of the specification is not implied [3] Exposure to limiting values for extended periods may affect device reliability [4] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kW 5. Characteristics Table 3. Electrical characteristics Symbol Parameter fIN input frequency CIN Input capacitance [1][2][3] Conditions 22 °C, Cp-D, Min Typ Max Unit - 13.56 - MHz 14.4 16.1 17.4 pF 2.9 - ms (LCR meter HP4258) 13.56 MHz, 2 V tW EEPROM write time - tRET EEPROM data retention 10 years NWE EEPROM write endurance 105 cycles [1] Stresses above one or more of the limiting values may cause permanent damage to the device [2] These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section of the specification is not implied [3] Exposure to limiting values for extended periods may affect device reliability 101731 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 3.1 — 18 April 2007 3 of 7 MF1 IC S70 01 NXP Semiconductors Standard 4Kbyte card IC 6. Chip orientation and bond pad locations Widths and lengths are measured from metal to metal ( top layer). 1 PAD location x[ µm] 2 y [ µm] VSS( 108 x 108) -1.1 1091.9 TESTIO( 95 x 110) 0.0 0.0 LA( 118 x118) 223.4 1.7 LB( 118 x118) 1160..9 1081.9 1) Reference point : 2) Pad size in µm Lower left corner of. pad Y (1) (7) (8) LB VSS (4) (6) TESTIO LA X (5) (2) (3) (1 (2 (3 (4 ) ) ) ) x - Scribeline width y - Scribeline width Chip step, x- length Chip step, y- length 86. 4 µm 86. 4 µm 1. 42 mm 1. 34 mm (5 (6 (7 (8 ) ) ) ) LA pad edge to chip edgey -length LA pad edge to chip edgex - length LB pad edge to chip edgey - length LB pad edge to chip edgex - length 28. 251. 26. 26. 6µm 8µm 8µm 2µm Fig 1. Chip orientation and bond pad locations 101731 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 3.1 — 18 April 2007 4 of 7 MF1 IC S70 01 NXP Semiconductors Standard 4Kbyte card IC 7. Application information 8. References • • • • data sheet “general wafer specification for 8” wafers on uv-tape” data sheet “standard 4kbyte card ic mf1 ic s70 functional specification” product qualification package “standard card ic mf1 ic s70 01” application note “mifare‚ card ic coil design guide” 9. Revision history Table 4. Revision history Document ID Release date Data sheet status 101730 August 2004 Initial version Revision 3.0 101731 18 April 2007 Product data sheet Revision 3.1 Modifications: Supersedes • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name. 101731 Product data sheet Change notice © NXP B.V. 2007. All rights reserved. Rev. 3.1 — 18 April 2007 5 of 7 MF1 IC S70 01 NXP Semiconductors Standard 4Kbyte card IC 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Mifare — is a trademark of NXP B.V. 11. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 101731 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 3.1 — 18 April 2007 6 of 7 MF1 IC S70 01 NXP Semiconductors Standard 4Kbyte card IC 12. Tables Table 1. Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .1 Limiting values[1][2][3] . . . . . . . . . . . . . . . . . . . . . .3 Table 3. Table 4. Electrical characteristics [1][2][3] . . . . . . . . . . . . . 3 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 13. Figures Fig 1.Chip orientation and bond pad locations4 14. Contents 1 2 3 3.1 3.2 3.3 3.4 3.5 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 13 14 General description . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Mechanical specification . . . . . . . . . . . . . . . . . Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Wafer backside . . . . . . . . . . . . . . . . . . . . . . . . . Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bond pads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Chip orientation and bond pad locations . . . . Application information. . . . . . . . . . . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 3 3 4 5 5 5 6 6 6 6 6 6 7 7 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 18 April 2007 Document identifier: 101731