MC74LCX258 Low−Voltage CMOS Quad 2−Input Multiplexer With 5 V−Tolerant Inputs and Outputs (3−State, Inverting) http://onsemi.com The MC74LCX258 is a high performance, quad 2−input inverting multiplexer with 3−state outputs operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX258 inputs to be safely driven from 5 V devices. Four bits of data from two sources can be selected using the Select input. The four outputs present the selected data in the inverted form. The outputs may be switched to a high impedance state by placing a logic HIGH on the Output Enable (OE) input. Current drive capability is 24 mA at the outputs. MARKING DIAGRAMS 16 SOIC−16 D SUFFIX CASE 751B 16 1 1 16 Features • • • • • • • • • • • Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant − Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V TTL Compatible CMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in all Three Logic States (10 A) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA ESD Performance: Human Body Model >2000 V Machine Model >200 V Pb−Free Packages are Available* LCX258 AWLYWW 16 1 TSSOP−16 DT SUFFIX CASE 948F LCX 258 ALYW 1 16 SOEIAJ−16 M SUFFIX CASE 966 16 74LCX258 ALYW 1 1 A L, WL Y W, WW = = = = Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 4 1 Publication Order Number: MC74LCX258/D MC74LCX258 VCC OE A3 B3 Y3 A2 B2 Y2 16 15 14 13 12 11 10 9 1 S 2 A0 3 B0 4 5 Y0 A1 6 B1 7 PIN NAMES 8 Y1 GND Pins Function An Source 0 Data Inputs Bn Source B Data Inputs OE Enable Input S Select Input Yn Outputs Figure 1. Pinout: 16−Lead Plastic Package (Top View) TRUTH TABLE Inputs Outputs Output Enable Select Y0−Y3 H X Z L L A0−A3 L H B0−B3 X = Don’t Care A0−A3, B0−B3 = The levels of the respective Data−Word Inputs PIN DESCRIPTIONS INPUTS OUTPUTS A0−A3 (Pins 2, 5, 11, 14) Y0−Y3 (Pins 4, 7, 9, 12) Nibble A inputs. The data present on these pins is transferred to the outputs when the Select input is at a low level and the Output Enable input is at a low level. The data is presented to the outputs in inverted form for the LCX258. Data outputs. The selected input nibble is presented at these outputs when the Output Enable input is at a low level. The data present on these pins is in its inverted form for the LCX258. For the Output Enable input at a high level, the outputs are at a high level for the LCX258. B0−B3 (Pins 3, 6, 10, 13) Nibble B inputs. The data present on these pins is transferred to the outputs when the Select input is at a high level and the Output Enable input is at a low level. The data is presented to the outputs in inverted form for the LCX258. Select (Pin 1) Nibble select. This input determines the data word to be transferred to the outputs. A low level on this input selects the A inputs and a high level selects the B inputs. CONTROL INPUTS Output Enable (Pin 15) Output Enable input. A low level on this input allows the selected data to be presented at the outputs. A high level on this input sets all of the outputs to 3−state off. http://onsemi.com 2 MC74LCX258 A0 2 4 B0 A1 3 5 7 B1 Y0 6 Y1 Nibble Inputs A2 Data Outputs 11 9 B2 A3 10 14 12 B3 Select Output Enable Y2 13 1 15 Figure 2. Expanded Logic Diagram http://onsemi.com 3 Y3 MC74LCX258 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Value Condition Unit −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ VCC + 0.5 Note 1 V −50 VI < GND mA −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Output in HIGH or LOW State. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Typ Max Unit 2.0 1.5 2.3 to 3.3 3.6 3.6 V 0 5.5 V 0 VCC V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 mA IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 mA TA Operating Free−Air Temperature −40 +85 °C t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V (HIGH or LOW State) ORDERING INFORMATION Package Shipping† MC74LCX258D SOIC−16 48 Units / Rail MC74LCX258DG SOIC−16 (Pb−Free) 48 Units / Rail MC74LCX258DR2 SOIC−16 2500 Tape & Reel MC74LCX258DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel MC74LCX258DT TSSOP−16* 96 Units / Rail MC74LCX258DTR2 TSSOP−16* 2500 Tape & Reel MC74LCX258M SOEIAJ−16 48 Units / Rail MC74LCX258MEL SOEIAJ−16 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 4 MC74LCX258 DC ELECTRICAL CHARACTERISTICS TA = 40°C to 85°C Symbol Characteristic Condition Min Max Unit VIH Minimum HIGH Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 2.7 V VCC 3.0 V 3.0 V VCC 3.6 V VIL Maximum LOW Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 2.7 V VCC 3.0 V 3.0 V VCC 3.6 V VOH Minimum HIGH Level Output Voltage 2.3 V VCC 3.6 V; IOH = −100 A VCC = 2.3 V; IOH = −8 mA VCC = 2.7 V; IOH = −12 mA VCC = 3.0 V; IOH = −18 mA VCC = 3.0 V; IOH = −24 mA VOL Maximum LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = 100 A VCC = 2.3 V; IOH = 8 mA VCC = 2.7 V; IOH = 12 mA VCC = 3.0 V; IOH = 16 mA VCC = 3.0 V; IOH = 24 mA 0.2 0.7 0.4 0.4 0.55 V II Input Leakage Current 2.3 V VCC 3.6 V; 0 V VI 5.5 V 5.0 A ICC Quiescent Supply Current 2.3 V VCC 3.6 V; VI = VCC or GND 2.3 V VCC 3.6 V; 3.6 V VI 5.5 V 10 10 A 500 A 1.7 2.0 2.0 V 0.7 0.8 0.8 VCC − 0.2 1.7 2.2 2.4 2.2 V V ICC Increase in ICC per Input 2.3 V VCC 3.6 V; VIH = VCC − 0.6 V 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS Limits TA= −40°C to +85°C Symbol Parameter VCC= 3.0 V to 3.6 V VCC= 2.7 V CL= 50 pF CL= 50 pF VCC= 2.3 V to 2.7 V CL= 30pF Max Unit tPLH tPHL Propagation Delay A to B to Y 1.0 1.0 6.5 6.5 1.0 1.0 7.5 7.5 1.0 1.0 8.5 8.5 ns ns tPLH tPHL Propagation Delay S to Y 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 1.0 1.0 9.0 9.0 ns ns tPZL tPZH Propagation Delay OE to Y 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 1.0 1.0 9.0 9.0 ns ns tPLZ tPHZ Propagation Delay OE to Y 1.0 1.0 6.0 6.0 1.0 1.0 7.0 7.0 1.0 1.0 8.0 8.0 ns ns tOSHL tOSLH Output−to−Output Skew Min Max Min Max Min 1.0 1.0 ns ns DYNAMIC SWITCHING CHARACTERISTICS TA = 25°C Symbol VOLP Characteristic Dynamic LOW Peak Voltage (Note 3) Condition VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V Min Typ 0.8 Max Unit V VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Typical Unit CIN Symbol Input Capacitance Parameter VCC = 3.3 V, VI = 0 V or VCC Condition 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF http://onsemi.com 5 MC74LCX258 2.7 V 1.5 V A, B, S 1.5V 0V tPHL tPLH VOH Yn 1.5 V 1.5 V VOL WAVEFORM 1 − NONINVERTING PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V 1.5 V 1.5 V S 0V tPHL tPLH VOH Yn 1.5 V 1.5 V VOL WAVEFORM 2 − INVERTING PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V 1.5 V 1.5 V OE 0V tPHZ tPZH VCC VOH − 0.3 V 1.5 V Yn ≈ 0V tPZL Yn tPLZ ≈ 3.0 V 1.5 V VOL + 0.3 V GND WAVEFORM 3 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms http://onsemi.com 6 MC74LCX258 VCC R1 PULSE GENERATOR DUT RT CL Test Switch tPLH, tPHL Open tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ RL GND CL = 50 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit http://onsemi.com 7 6V OPEN GND MC74LCX258 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K DIM A B C D F G J K M P R F X 45 C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 S TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S K ÉÉ ÇÇ ÇÇ ÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G http://onsemi.com 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74LCX258 PACKAGE DIMENSIONS SOEIAJ−16 M SUFFIX CASE 966−01 ISSUE O 16 LE 9 Q1 M E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 9 MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.031 MC74LCX258 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 10 For additional information, please contact your local Sales Representative. MC74LCX258/D