NLSX3018 8-Bit 100 Mb/s Configurable Dual-Supply Level Translator The NLSX3018 is a 8−bit configurable dual−supply bidirectional level translator without a direction control pin. The I/O VCC− and I/O VL−ports are designed to track two different power supply rails, VCC and VL respectively. The VCC supply rail is configurable from 1.3 V to 4.5 V while the VL supply rail is configurable from 0.9 V to (VCC − 0.4) V. This allows lower voltage logic signals on the VL side to be translated into higher voltage logic signals on the VCC side, and vice−versa. Both I/O ports are auto−sensing; thus, no direction pin is required. The Output Enable (EN) input, when Low, disables both I/O ports by putting them in 3−state. This significantly reduces the supply currents from both VCC and VL. The EN signal is designed to track VL. http://onsemi.com MARKING DIAGRAMS UQFN20 MU SUFFIX CASE 517AK LA M G SOIC−20 DW SUFFIX CASE 751D • Wide High−Side VCC Operating Range: 1.3 V to 4.5 V Wide Low−Side VL Operating Range: 0.9 V to (VCC − 0.4) V High−Speed with 100 Mb/s Guaranteed Date Rate for VL > 1.6 V Low Bit−to−Bit Skew Overvoltage Tolerant Enable and I/O Pins Non−preferential Powerup Sequencing Small packaging: 4.0 mm x 2.0 mm UQFN20 This is a Pb−Free Device A WL YY WW G PIN ASSIGNMENT 20 I/O VCC1 I/O VL2 2 19 I/O VCC2 I/O VL3 3 18 I/O VCC3 I/O VL4 4 17 I/O VCC4 VL 5 16 VCC EN 6 15 GND I/O VL5 7 14 I/O VCC5 I/O VL6 8 13 I/O VCC6 I/O VL7 9 12 I/O VCC7 I/O VL8 10 11 I/O VCC8 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package TSSOP−20 DT SUFFIX CASE 948E • Mobile Phones, PDAs, Other Portable Devices 1 NLSX3018 AWLYYWWG 1 Typical Applications I/O VL1 = Specific Device Code = Date Code = Pb−Free Package 20 Features • • • • • • LAM G A L Y W G NLSX 3018 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. (Top View) © Semiconductor Components Industries, LLC, 2009 June, 2009 − Rev. 0 1 Publication Order Number: NLSX3018/D NLSX3018 VL EN VCC GND I/O VL1 I/O VCC1 I/O VL2 I/O VCC2 I/O VL3 I/O VCC3 I/O VL4 I/O VCC4 I/O VL5 I/O VCC5 I/O VL6 I/O VCC6 I/O VL7 I/O VCC7 I/O VL8 I/O VCC8 Figure 1. Logic Diagram http://onsemi.com 2 NLSX3018 P One−Shot VL +1.8V +3.6V VL +1.8 V System NLSX3018 4 kW VCC N One−Shot +3.6 V System I/O VL I/O1 I/On GND EN I/O VL1 VCC I/O VCC1 I/O1 I/O VLn I/O VCCn EN GND I/On I/O VCC P One−Shot GND 4 kW N One−Shot Figure 2. Typical Application Circuit Figure 3. Simplified Functional Diagram (1 I/O Line) (EN = 1) PIN ASSIGNMENT Pins FUNCTION TABLE Description EN Operating Mode VCC VCC Input Voltage L Hi−Z VL VL Input Voltage H I/O Buses Connected GND Ground EN Output Enable I/O VCCn I/O Port, Referenced to VCC I/O VLn I/O Port, Referenced to VL http://onsemi.com 3 NLSX3018 MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC VCC Supply Voltage −0.5 to +5.5 V VL VL Supply Voltage −0.5 to +5.5 V I/O VCC VCC−Referenced DC Input/Output Voltage −0.5 to (VCC + 0.3) V I/O VL VL−Referenced DC Input/Output Voltage −0.5 to (VL + 0.3) V VEN Enable Control Pin DC Input Voltage −0.5 to +5.5 V IIK Input Diode Clamp Current −50 VI < GND mA IOK Output Diode Clamp Current −50 VO < GND mA ICC DC Supply Current Through VCC $100 mA IL DC Supply Current Through VL $100 mA IGND DC Ground Current Through Ground Pin $100 mA TSTG Storage Temperature −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC VL Parameter Min Max Unit VCC Supply Voltage 1.3 4.5 V VL Supply Voltage 0.9 VCC − 0.4 V GND 4.5 V GND GND 4.5 4.5 V −40 +85 °C 0 10 ns VEN Enable Control Pin Voltage VIO Bus Input/Output Voltage TA Operating Temperature Range DI/DV I/O VCC I/O VL Input Transition Rise or Rate VI, VIO from 30% to 70% of VCC; VCC = 3.3 V $ 0.3 V http://onsemi.com 4 NLSX3018 DC ELECTRICAL CHARACTERISTICS −405C to +855C Symbol Test Conditions (Note 1) Parameter VCC (V) (Note 2) VL (V) (Note 3) Min Typ (Note 4) Max Unit VIHC I/O VCC Input HIGH Voltage 1.3 to 4.5 0.9 to (VCC – 0.4) 0.8 * VCC − − V VILC I/O VCC Input LOW Voltage 1.3 to 4.5 0.9 to (VCC – 0.4) − − 0.2 * VCC V VIHL I/O VL Input HIGH Voltage 1.3 to 4.5 0.9 to (VCC – 0.4) 0.8 * VL − − V VILL I/O VL Input LOW Voltage 1.3 to 4.5 0.9 to (VCC – 0.4) − − 0.2 * VL V VIH Control Pin Input HIGH Voltage TA = +25°C 1.3 to 4.5 0.9 to (VCC – 0.4) 0.8 * VL − − V VIL Control Pin Input LOW Voltage TA = +25°C 1.3 to 4.5 0.9 to (VCC – 0.4) − − 0.2 * VL V VOHC I/O VCC Output HIGH Voltage I/O VCC Source Current = 20 mA 1.3 to 4.5 0.9 to (VCC – 0.4) 0.8 * VCC − − V VOLC I/O VCC Output LOW Voltage I/O VCC Sink Current = 20 mA 1.3 to 4.5 0.9 to (VCC – 0.4) − − 0.2 * VCC V VOHL I/O VL Output HIGH Voltage I/O VL Source Current = 20 mA 1.3 to 4.5 0.9 to (VCC – 0.4) 0.8 * VL − − V VOLL I/O VL Output LOW Voltage I/O VL Sink Current = 20 mA 1.3 to 4.5 0.9 to (VCC – 0.4) − − 0.2 * VL V 1. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 2. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 3. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC – 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC – 0.4) V. 4. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25°C. All units are production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design. POWER CONSUMPTION Symbol Parameter Test Conditions (Note 5) VCC (V) (Note 6) VL (V) (Note 7) −405C to +855C Min Typ Max Unit IQ−VCC Supply Current from EN = VL; I/O VCCn = 0 V, I/O VLn = 0 V, 1.3 to 3.6 0.9 to (VCC – 0.4) VCC I/O VCCn = VCC or I/O VLn = VL and Io = 0 − − 1.0 mA IQ−VL Supply Current from EN = VL; I/O VCCn = 0 V, I/O VLn = 0 V, 1.3 to 3.6 0.9 to (VCC – 0.4) VL I/O VCCn = VCC or I/O VLn = VL and Io = 0 − − 1.0 mA − − 2.0 EN = VL, I/O VCCn = 0 V, I/O VLn = 0 V, I/O VCCn = VCC or I/O VLn = (VCC − 0.2 V) and Io = 0 ITS−VCC ITS−VL IOZ IEN < (VCC – 0.2) VCC Tristate Output Mode Supply Current EN = 0 V 1.3 to 3.6 0.9 to (VCC – 0.4) − − 1.0 mA VL Tristate Output Mode Supply Current EN = 0 V 1.3 to 3.6 0.9 to (VCC – 0.4) − − 0.2 mA − − 2.0 I/O Tristate Output Mode Leakage Current EN = 0 V − − 0.15 − − 2.0 Output Enable Pin Input Current − − − 1.0 EN = 0 V VCC − 0.2 1.3 to 3.6 0.9 to (VCC – 0.4) EN = 0 V VCC – 0.2 1.3 to 3.6 0.9 to (VCC – 0.4) mA mA 5. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 6. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 3.6 V. 7. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC – 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC – 0.4) V. http://onsemi.com 5 NLSX3018 TIMING CHARACTERISTICS −405C to +855C Symbol Parameter Test Conditions (Note 8) VCC (V) (Note 9) VL (V) (Note 10) Min Typ (Note 11) Max Unit tR−VCC I/O VCC Rise Time (Output = I/O_VCC) CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 0.7 2.4 ns tF−VCC I/O VCC Falltime (Output = I/O_VCC) CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 0.5 1.0 ns tR−VL I/O VL Risetime (Output = I/O_VL) CIOVL = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 1.0 3.8 ns tF−VL I/O VL Falltime (Output = I/O_VL) CIOVL = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 0.6 1.2 ns ZO−VCC I/O VCC One−Shot Output Impedance 1.3 to 4.5 0.9 to (VCC – 0.4) 30 W ZO−VL I/O VL One−Shot Output Impedance 1.3 to 4.5 0.9 to (VCC – 0.4) 30 W tPD_VL−VCC Propagation Delay (Output = I/O_VCC, tPHL, tPLH) CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 4.5 9.3 ns tPD_VCC−VL Propagation Delay (Output = I/O_VL, tPHL, tPLH) CIOVL = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 3.0 6.5 ns Channel−to−Channel Skew (Output = I/O_VCC) CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 0.2 0.3 nS tSK_VCC−VL Channel−to−Channel Skew (Output = I/O_VL) CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 0.2 0.3 nS (Output = I/O_VCC, CIOVCC = 15 pF) (Output = I/O_VL, CIOVL = 15 pF) 1.3 to 4.5 0.9 to (VCC – 0.4) 110 > 2.2 > 1.8 140 tSK VL−VCC MDR Maximum Data Rate Mb/s 8. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 9. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 10. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC – 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC – 0.4) V. 11. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25°C. All units are production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design. http://onsemi.com 6 NLSX3018 ENABLE / DISABLE TIME MEASUREMENTS −405C to +855C tEN−VL Unit 0.9 to (VCC – 0.4) 130 180 ns 1.3 to 4.5 0.9 to (VCC – 0.4) 100 150 ns CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 95 185 ns CIOVL = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 70 110 ns CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 175 250 ns CIOVL = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 150 190 ns CIOVCC = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 180 250 ns CIOVL = 15 pF 1.3 to 4.5 0.9 to (VCC – 0.4) 160 220 ns VL (V) (Note 14) Turn−On Enable Time (Output = I/O_VCC, tpZH) CIOVCC = 15 pF 1.3 to 4.5 Turn−On Enable Time (Output = I/O_VCC, tpZL) CIOVL = 15 pF Turn−On Enable Time (Output = I/O_VL, tpZH) Turn−On Enable Time (Output = I/O_VL, tpZL) tDIS−VCC Turn−Off Disable Time (Output = I/O_VCC, tpHZ) Propagation Delay (Output = I/O_VCC, tPLZ) tDIS−VL Max VCC (V) (Note 13) Parameter tEN−VCC Typ (Note 15) Test Conditions (Note 12) Symbol Turn−Off Disable Time (Output = I/O_VL, tpHZ) Propagation Delay (Output = I/O_VL, tPLZ) Min 12. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 13. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 14. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC – 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC – 0.4) V. 15. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25 °C. All units are production tested at TA = +25 °C. Limits over the operating temperature range are guaranteed by design. NLSX3018 VL VCC NLSX3018 VL EN Source I/O VL VCC EN I/O VL I/O VCC I/O VCC CIOVL CIOVCC Source tRISE/FALL v 3 ns I/O VL 90% 50% 10% tPD_VL−VCC I/O VCC I/O VCC tRISE/FALL v 3 ns 90% 50% 10% tPD_VCC−VL I/O VL tPD_VL−VCC 90% 50% 10% tPD_VCC−VL 90% 50% 10% tF−VCC tR−VCC tF−VL Figure 4. Driving I/O VL Test Circuit and Timing tR−VL Figure 5. Driving I/O VCC Test Circuit and Timing http://onsemi.com 7 NLSX3018 VCC PULSE GENERATOR 2xVCC OPEN R1 DUT RT CL Test RL Switch tPZH, tPHZ Open tPZL, tPLZ 2 x VCC CL = 15 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 50 kW or equivalent RT = ZOUT of pulse generator (typically 50 W) Figure 6. Test Circuit for Enable/Disable Time Measurement tR tF Input tPLH Output 90% 50% 10% tR EN VCC 90% 50% 10% tPHL GND VL 50% tPZL Output 50% tPZH tF Output 50% GND tPLZ tPHZ HIGH IMPEDANCE 10% VOL 90% VOH Figure 7. Timing Definitions for Propagation Delays and Enable/Disable Measurement http://onsemi.com 8 HIGH IMPEDANCE NLSX3018 IMPORTANT APPLICATIONS INFORMATION Level Translator Architecture the device and drives the I/O VCC and I/O VL pins to a high impedance state. Normal translation operation occurs when the EN pin is equal to a logic high signal. The EN pin is referenced to the VL supply and has Over−Voltage Tolerant (OVT) protection. The NLSX3018 auto sense translator provides bi−directional voltage level shifting to transfer data in multiple supply voltage systems. This device has two supply voltages, VL and VCC, which set the logic levels on the input and output sides of the translator. When used to transfer data from the VL to the VCC ports, input signals referenced to the VL supply are translated to output signals with a logic level matched to VCC. In a similar manner, the VCC to VL translation shifts input signals with a logic level compatible to VCC to an output signal matched to VL. The NLSX3018 consists of four bi−directional channels that independently determine the direction of the data flow without requiring a directional pin. The one−shot circuits are used to detect the rising or falling input signals. In addition, the one shots decrease the rise and fall time of the output signal for high−to−low and low−to−high transitions. Uni−Directional versus Bi−Directional Translation The NLSX3018 can function as a non−inverting uni−directional translator. One advantage of using the translator as a uni−directional device is that each I/O pin can be configured as either an input or output. The configurable input or output feature is especially useful in applications such as SPI that use multiple uni−directional I/O lines to send data to and from a device. The flexible I/O port of the auto sense translator simplifies the trace connections on the PCB. Power Supply Guidelines It is recommended that the VL supply should be less than or equal to the value of the VCC minus 0.4 V. The sequencing of the power supplies will not damage the device during the power up operation; however, the current consumption of the device will increase if VL exceeds VCC minus 0.4 V. In addition, the I/O VCC and I/O VL pins are in the high impedance state if either supply voltage is equal to 0 V. For optimal performance, 0.01 to 0.1 mF decoupling capacitors should be used on the VL and VCC power supply pins. Ceramic capacitors are a good design choice to filter and bypass any noise signals on the power supply voltage lines to the ground plane of the PCB. The noise immunity will be maximized by placing the capacitors as close as possible to the supply and ground pins, along with minimizing the PCB connection traces. Input Driver Requirements For proper operation, the input driver to the auto sense translator should be capable of driving 2.0 mA of peak output current. Output Load Requirements The NLSX3018 is designed to drive CMOS inputs. Resistive pullup or pulldown loads of less than 50 kW should not be used with this device. The NLSX3373 or NLSX3378 open−drain auto sense translators are alternate translator options for an application such as the I2C bus that requires pullup resistors. Enable Input (EN) The NLSX3018 has an Enable pin (EN) that provides tri−state operation at the I/O pins. Driving the Enable pin to a low logic level minimizes the power consumption of ORDERING INFORMATION Package Shipping† NLSX3018MUTAG UQFN20 (Pb−Free) 3000 / Tape & Reel NLSX3018DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel NLSX3018DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 NLSX3018 PACKAGE DIMENSIONS UDFN20 4x2, 0.4P CASE 517AK−01 ISSUE O A B D 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. L1 0.15 C E PIN 1 REFERENCE DETAIL A NOTE 5 2X 0.15 C TOP VIEW (A3) 0.10 C DIM A A1 A3 b D E e L L1 L2 A 20X 0.08 C SIDE VIEW A1 DETAIL A 1 C 19X SEATING PLANE L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 4.00 BSC 2.00 BSC 0.40 BSC 0.50 0.60 0.00 0.03 0.60 0.70 10 MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 20 e e/2 BOTTOM VIEW 11 19X 20X 20X 0.78 0.22 b 0.10 M C A B 0.05 M C NOTE 3 2.30 0.88 1 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 NLSX3018 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V K K1 S J J1 11 B −U− PIN 1 IDENT ÍÍÍ ÍÍÍ ÍÍÍ SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING DIM A B C D F G H J J1 K K1 L M PLANE SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 11 MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NLSX3018 PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE G A 20 q X 45 _ M E h H 10X 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B B 0.25 M T A S B S L A 18X e A1 SEATING PLANE C T DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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