NLU1GT50 Single Buffer, Non-Inverting, TTL Level TTL-Compatible Inputs The NLU1GT50 MiniGatet is an advanced CMOS high-speed non-inverting buffer in ultra-small footprint. The device input is compatible with TTL-type input thresholds and the output has a full 5.0 V CMOS level output swing. The NLU1GT50 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com MARKING DIAGRAMS UDFN6 MU SUFFIX CASE 517AA LM ULLGA6 1.0 x 1.0 CASE 613AD LM ULLGA6 1.2 x 1.0 CASE 613AE LM ULLGA6 1.45 x 1.0 CASE 613AF LM 1 Features •Designed for 1.65 to 5.5 V VCC Operation •High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V •Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •TTL-Compatible Input: VIL = 0.8 V; VIH = 2.0 V, VCC = 5.0 V •CMOS-Compatible Output: VOH > 0.8 VCC; VOL < 0.1 VCC @ Load •Power Down Protection Provided on inputs •Balanced Propagation Delays •Ultra-Small Packages •These are Pb-Free Devices 1 1 1 NC 1 6 VCC IN A 2 5 NC L M = Device Marking = Date Code PIN ASSIGNMENT GND 3 4 OUT Y Figure 1. Pinout (Top View) IN A 1 1 NC 2 IN A 3 GND 4 OUT Y 5 NC 6 VCC OUT Y FUNCTION TABLE Figure 2. Logic Symbol A Y L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2008 March, 2008 - Rev. 2 1 Publication Order Number: NLU1GT50/D NLU1GT50 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR VESD ILATCHUP1 Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V-0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125 °C (Note 5) > 2000 > 200 N/A V ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22-A114-A. 3. Tested to EIA / JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V -55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 NLU1GT50 DC ELECTRICAL CHARACTERISTICS TA = 25 5C Symbol Parameter VIH Low-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage VIN = VIH or VIL Typ TA = +855C VCC (V) Min Max Min 1.65 to 2.29 0.50 x VCC 0.50 x VCC 2.3 to 2.99 0.45 x VCC 0.45 x VCC 3.0 1.4 1.4 4.5 to 5.5 2.0 Max TA = -555C to +1255C Min Max V 2.0 1.65 to 2.29 0.10 x VCC 0.10 x VCC 0.10 x VCC 2.3 to 2.99 0.15 x VCC 0.15 x VCC 0.15 x VCC 3.0 0.53 0.53 0.53 4.5 to 5.5 0.8 0.8 0.8 VCC– 0.1 VCC– 0.1 3.0 2.9 2.9 4.5 4.4 4.4 2.48 3.80 2.34 3.66 V V 1.65 to 2.99 VCC– 0.1 3.0 2.9 4.5 4.4 VIN = VIH or VIL IOH = -4 mA IOH = -8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 1.65 to 2.99 0 0.1 0.1 0.1 3.0 0 0.1 0.1 0.1 4.5 0 0.1 0.1 0.1 IOH = -50 mA Unit VIN = VIH or VIL IOL = 4 mA IOL = 8 mA 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 = VIN = 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 = VIN = VCC 5.5 1.0 20 40 mA ICCT Quiescent Supply Current VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10 mA http://onsemi.com 3 NLU1GT50 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 n) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y TA = 25 5C VCC (V) Test Condition 1.65 to 1.95 CL = 15 pF 16.6 2.3 to 2.7 CL = 15 pF Min Typ CL = 50 pF 3.0 to 3.6 4.5 to 5.5 CIN Input Capacitance CPD Power Dissipation Capacitance (Note 6) Max TA = +855C TA = -555C to +1255C Min Min Max Max Unit 18.0 22.0 ns 13.3 14.5 17.5 19.5 22.0 25.5 CL = 15 pF 4.5 10.0 11.0 13.0 CL = 50 pF 6.3 13.5 15.0 17.5 CL = 15 pF 3.5 6.7 7.5 8.5 CL = 50 pF 4.3 7.7 8.5 9.5 5 10 10 10.0 5.0 12 pF pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. VCC A 50% GND tPLH tPHL VOH Y 50% VCC VOL Figure 3. Switching Waveforms TEST POINT OUTPUT DEVICE UNDER TEST CL * *Includes all probe and jig capacitance Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† UDFN6 (Pb-Free) 3000 / Tape & Reel NLU1GT50AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLU1GT50BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLU1GT50CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device NLU1GT50MUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU1GT50 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA-01 ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C ÉÉÉ ÉÉÉ ÉÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X (A3) 0.10 C A1 A 0.08 C A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 ÉÉÉ ÉÉÉ EXPOSED Cu 0.10 C 10X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NLU1GT50 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 6X 0.22 e 5X L NOTE 4 3 1 1.18 L1 0.53 6 4 6X b 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE 0.05 C NOTE 3 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLU1GT50 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 e 5X L NOTE 4 3 1 6X 0.26 1.24 L1 0.53 6 4 6X b 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLU1GT50 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF-01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 NOTE 4 3 1 6X 0.30 1.24 L1 0.53 6 4 BOTTOM VIEW 6X b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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