Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Features The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary device can be operated in a standby unpowered mode affording no additional power drain. More significantly, a very high impedance exists between the active and inactive devices preventing any interaction. One of sixteen channel selections is controlled by a 4-bit binary address plus an Enable-Inhibit input which conveniently controls the ON/OFF operation of several multiplexers in a system. All inputs have electrostatic discharge protection. The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are processed and screened in full compliance with MIL-PRF-38535 and QML standards. The devices are available in a 28 Ld SBDIP and a 28 Ld Ceramic Flatpack. • QML Qualified per MIL-PRF-38535 Requirements • Electrically Screened to SMD # 5962-95630 • Pin-to-Pin for Intersil’s HS-1840RH and HS-1840/883S • Improved Radiation Performance - Gamma Dose (γ) 3x105RAD(Si) • Improved rDS(ON) Linearity • Improved Access Time 1.5µs (Max) Over Temp and Post Rad • High Analog Input Impedance 500MΩ During Power Loss (Open) • ±35V Input Overvoltage Protection (Power On or Off) • Dielectrically Isolated Device Islands • Excellent in Hi-Rel Redundant Systems • Break-Before-Make Switching • No Latch-Up Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95630. A “hot-link” is provided on our homepage for downloading: http://www.landandmaritime.dla.mil/Downloads/MilSpec/Smd/956 30.pdf April 6, 2012 FN4355.5 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2002, 2009-2012. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Ordering Information INTERNAL MKT. NUMBER (Note) ORDERING NUMBER TEMP. RANGE (°C) PART MARKING NO. PACKAGE (RoHS Compliant) 5962F9563002QXC HS1-1840ARH-8 -55 to +125 Q 5962F95 63002QXC 28 Ld SBDIP 5962F9563002QYC HS9-1840ARH-8 -55 to +125 Q 5962F95 63002QYC 28 Ld Flatpack 5962F9563002VXC HS1-1840ARH-Q -55 to +125 Q 5962F95 63002VXC 28 Ld SBDIP 5962F9563002VYC HS9-1840ARH-Q -55 to +125 Q 5962F95 63002VYC 28 Ld Flatpack HS1-1840ARH/PROTO HS1-1840ARH/PROTO -55 to +125 HS1- 1840ARH /PROTO 28 Ld SBDIP HS9-1840ARH/PROTO HS9-1840ARH/PROTO -55 to +125 HS9- 1840ARH /PROTO 28 Ld Flatpack HS1-1840ARH-T HS1-1840ARH-T -55 to +125 Q 5962R95 63002TXC 28 Ld SBDIP 5962F9563002V9A HS0-1840ARH-Q -55 to +125 5962F9563004V9A HS0-1840AEH-Q -55 to +125 5962F9563004VXC HS1-1840AEH-Q -55 to +125 Q 5962F95 63004VXC 28 Ld SBDIP 5962F9563004VYC HS9-1840AEH-Q -55 to +125 Q 5962F95 63004VYC 28 Ld Flatpack 5962F9563005V9A HS0-1840BEH-Q -55 to +125 5962F9563005VXC HS1-1840BEH-Q -55 to +125 Q 5962F95 63005VXC 28 Ld SBDIP 5962F9563005VYC HS9-1840BEH-Q -55 to +125 Q 5962F95 63005VYC 28 Ld Flatpack 5962F9563003QXC HS1-1840BRH-8 -55 to +125 Q 5962F95 63003QXC 28 Ld SBDIP 5962F9563003QYC HS9-1840BRH-8 -55 to +125 Q 5962F95 63003QYC 28 Ld Flatpack 5962F9563003VXC HS1-1840BRH-Q -55 to +125 Q 5962F95 63003VXC 28 Ld SBDIP 5962F9563003VYC HS9-1840BRH-Q -55 to +125 Q 5962F95 63003VYC 28 Ld Flatpack HS1-1840BRH/PROTO HS1-1840BRH/PROTO -55 to +125 HS1- 1840BRH /PROTO 28 Ld SBDIP HS9-1840BRH/PROTO HS9-1840BRH/PROTO -55 to +125 HS9- 1840BRH /PROTO 28 Ld Flatpack 5962F9563003V9A HS0-1840BRH-Q -55 to +125 NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pin Configurations HS9-1840ARH, HS9-1840AEH, HS9-1840BRH (28 LD FLATPACK) CDFP3-F28 TOP VIEW HS1-1840ARH, HS1-1840AEH, HS1-1840BRH (28 LD SBDIP) CDIP2-T28 TOP VIEW +VS 1 28 OUT +VS 1 28 OUT NC 2 27 -VS NC 2 27 -VS NC 3 26 IN 8 NC 3 26 IN 8 IN 16 4 25 IN 7 IN 15 5 24 IN 6 IN 14 6 23 IN 5 IN 16 4 25 IN 7 IN 15 5 24 IN 6 IN 14 6 23 IN 5 IN 13 7 22 IN 4 IN 13 7 22 IN 4 IN 12 8 21 IN 3 IN 12 8 21 IN 3 IN 11 9 20 IN 2 20 IN 2 IN 10 10 19 IN 1 IN 9 11 18 ENABLE GND 12 17 ADDR A0 (+5VS) VREF 13 16 ADDR A1 ADDR A3 14 15 ADDR A2 IN 11 9 19 IN 1 IN 10 10 IN 9 11 18 ENABLE GND 12 17 ADDR A0 (+5VS) VREF 13 16 ADDR A1 ADDR A3 14 15 ADDR A2 2 FN4355.5 April 6, 2012 HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Functional Diagram VDD IN1 A0 1 MAINSWITCH 1 A1 DIGITAL ADDRESS A2 A3 OUT IN16 16 EN MAINSWITCH 16 ADDRESS INPUT BUFFER AND LEVEL SHIFTER DECODERS MULTIPLEX SWITCHES NOTE: MAINSWITCH INXX: SWITCH ON, BODY TIED TO SOURCE SWITCH OFF, BODY TIED TO VCC-0.7V TABLE 1. TRUTH TABLE A3 A2 A1 A0 EN “ON” CHANNEL X X X X H None L L L L L 1 L L L H L 2 L L H L L 3 L L H H L 4 L H L L L 5 L H L H L 6 L H H L L 7 L H H H L 8 H L L L L 9 H L L H L 10 H L H L L 11 H L H H L 12 H H L L L 13 H H L H L 14 H H H L L 15 H H H H L 16 3 FN4355.5 April 6, 2012 HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Burn-In/Life Test Circuits R +VS R 1 28 2 27 3 26 25 4 5 6 F4 -VS R R 24 23 8 22 21 7 GND +VS 9 20 10 19 11 12 18 F5 F1 13 17 16 14 15 F3 F2 GND VR 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 R -VS R R NOTE: R = 1kΩ ±5%, 1/4W. C1 = C2 = 0.01µF MINIMUM, 1 EACH PER SOCKET, MINIMUM. VS+ = 15.5V ±0.5V, VS- = -15.5V ±0.5V, VR = 15.5 ±0.5V NOTE: VS+ = +15.5V ±0.5V, VS- = -15.5V ±0.5V. R = 1kΩ ±5%. C1 = C2 = 0.01µF ±10%, 1 EACH PER SOCKET, MINIMUM. D1 = D2 = 1N4002, 1 EACH PER BOARD, MINIMUM. INPUT SIGNALS: SQUARE WAVE, 50% DUTY CYCLE, 0V TO 15V PEAK ±10%. F1 = 100kHz; F2 = F1/2; F3 = F1/4; F4 = F1/8; F5 = F1/16. FIGURE 2. .STATIC BURN-IN TEST CIRCUIT FIGURE 1. DYNAMIC BURN-IN AND LIFE TEST CIRCUIT NOTES: 1. The above test circuits are utilized for all package types. 2. The Dynamic Test Circuit is utilized for all life testing. Irradiation Circuit HS-1840ARH, HS-1840AEH, HS-1840BRH +15V 1 28 NC 2 27 NC 3 26 +1V 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 -15V 1kΩ +5V NOTE: 3. All irradiation testing is performed in the 28 lead CERDIP package. 4 FN4355.5 April 6, 2012 HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Die Characteristics DIE DIMENSIONS: ASSEMBLY RELATED INFORMATION: (2820µmx4080µm x 483µm ±25.4μm) 111 milsx161 milsx19 mils ±1 mil Substrate Potential: Unbiased (DI) INTERFACE MATERIALS: ADDITIONAL INFORMATION: Glassivation: Worst Case Current Density: Type: PSG (Phosphorus Silicon Glass) Thickness: 8.0kÅ ±1kÅ Modified SEM Transistor Count: Top Metallization: 407 Type: AlSiCu Thickness: 16.0kÅ ±2kÅ Process: Radiation Hardened Silicon Gate, DI Wafer, Dielectric Isolation Backside Finish: Silicon Metallization Mask Layout IN1 IN2 IN3 IN4 IN5 IN6 IN7 HS-1840ARH, HS-1840BRH IN8 ENABLE A0 -V A1 OUT A2 A3 +V VREF IN16 5 IN9 IN10 IN11 IN12 IN13 IN14 IN15 GND FN4355.5 April 6, 2012 HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C) LEAD FINISH c1 -A- 28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S (c) SECTION A-A D S D BASE PLANE Q S2 -C- SEATING PLANE A L S1 eA A A b2 b e eA/2 c aaa M C A - B S D S ccc M C A - B S D S NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. INCHES SYMBOL MIN MILLIMETERS MAX MIN MAX NOTES A - 0.232 - 5.92 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 1.490 - 37.85 - E 0.500 0.610 15.49 - e 12.70 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC - eA/2 0.300 BSC 7.62 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7 α 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N 28 28 8 Rev. 0 5/18/94 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH. For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 6 FN4355.5 April 6, 2012 HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Ceramic Metal Seal Flatpack Packages (Flatpack) K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A A e INCHES PIN NO. 1 ID AREA SYMBOL -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S C E -D- A -C- -HL E2 E3 SEATING AND BASE PLANE c1 L E3 BASE METAL (c) b1 M M (b) SECTION A-A MILLIMETERS MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019 0.38 0.48 - c 0.004 0.009 0.10 0.23 - c1 0.004 0.006 0.10 0.15 - D - 0.740 - 18.80 3 E 0.460 0.520 E1 - 0.550 - E2 0.180 - 4.57 - - E3 0.030 - 0.76 - 7 2 e LEAD FINISH MIN 11.68 0.050 BSC 13.21 - 13.97 3 1.27 BSC - k 0.008 0.015 0.20 0.38 L 0.250 0.370 6.35 9.40 - Q 0.026 0.045 0.66 1.14 8 S1 0.00 - 0.00 - 6 M - 0.0015 - 0.04 - N 28 28 Rev. 0 5/18/94 NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. 7 FN4355.5 April 6, 2012