INTERSIL HS1-1840ARH-T

HS-1840ARH-T
Data Sheet
July 1999
Radiation Hardened 16 Channel CMOS
Analog Multiplexer with High-Z Analog
Input Protection
Intersil’s Satellite Applications FlowTM (SAF) devices are fully
tested and guaranteed to 100kRAD Total Dose. These QML
Class T devices are processed to a standard flow intended
to meet the cost and shorter lead-time needs of large
volume satellite manufacturers, while maintaining a high
level of reliability.
The HS-1840ARH-T is a Radiation Hardened, monolithic 16
channel multiplexer constructed with the Intersil Rad-Hard
Silicon Gate, Dielectric Isolation process. It is designed to
provide a high input impedance to the analog source if
device power fails (open), or the analog signal voltage
inadvertently exceeds the supply by up to ±35V, regardless
of whether the device is powered on or off. Selection of one
of sixteen channels is controlled by a 4-bit binary address
plus an Enable-Inhibit input, which conveniently controls the
ON/OFF operation of several multiplexers in a system. All
inputs have electrostatic discharge protection.
File Number
Features
• QML Class T, Per MIL-PRF-38535
• Radiation Performance
- Gamma Dose (γ) 1 x 105 RAD(Si)
- No Latch-Up, Dielectrically Isolated Device Islands
• Improved rDS(ON) Linearity
• Improved Access Time 1.5µs (Max) Over Temp and Rad
• High Analog Input Impedance 500MΩ During Power Loss
(Open)
• ±35V Input Over Voltage Protection (Power On or Off)
• Excellent in Hi-Rel Redundant Systems
• Break-Before-Make Switching
Pinouts
HS1-1840ARH-T (SBDIP), CDIP2-T28
TOP VIEW
Specifications
+VS 1
28 OUT
NC 2
27 -VS
NC 3
26 IN 8
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed below must be used when ordering.
IN 16 4
25 IN 7
IN 15 5
24 IN 6
IN 14 6
23 IN 5
Detailed Electrical Specifications for the HS-1840ARH-T
are contained in SMD 5962-95630. A “hot-link” is provided
from our website for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
IN 13 7
22 IN 4
IN 12 8
21 IN 3
IN 11 9
20 IN 2
IN 10 10
19 IN 1
Intersil’s Quality Management Plan (QM Plan), listing all
Class T screening operations, is also available on our
website.
www.intersil.com/quality/manuals.asp
Ordering Information
ORDERING
NUMBER
PART
NUMBER
TEMP.
RANGE
(oC)
4589.1
IN 9 11
18 ENABLE
GND 12
17 ADDR A0
(+5VS) VREF 13
16 ADDR A1
ADDR A3 14
15 ADDR A2
HS9-1840ARH-T (FLATPACK) CDFP3-F28
TOP VIEW
+VS
1
28
OUT
NC
2
27
-VS
NC
3
26
IN 8
IN 16
4
25
IN 7
IN 15
5
24
IN 6
IN 14
6
23
IN 5
IN 13
7
22
IN 4
IN 12
8
21
IN 3
NOTE: Minimum order quantity for -T is 150 units through
IN 11
9
20
IN 2
distribution, or 450 units direct.
IN 10
10
19
IN 1
IN 9
11
18
ENABLE
GND
12
17
ADDR A0
(+5VS) VREF
13
16
ADDR A1
ADDR A3
14
15
ADDR A2
5962R9563002TXC
HS1-1840ARH-T
-55 to 125
HS1-1840ARH/Proto
HS1-1840ARH/Proto
-55 to 125
5962R9563002TYC
HS9-1840ARH-T
-55 to 125
HS9-1840ARH/Proto
HS9-1840ARH/Proto
1
-55 to 125
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation.
HS-1840ARH-T
Functional Diagram
IN 1
A0
1
P
A1
DIGITAL
ADDRESS
A2
OUT
A3
16
P
EN
IN 16
ADDRESS INPUT
BUFFER AND
LEVEL SHIFTER
DECODERS
MULTIPLEX
SWITCHES
TRUTH TABLE
A3
A2
A1
A0
EN
“ON” CHANNEL
X
X
X
X
H
None
L
L
L
L
L
1
L
L
L
H
L
2
L
L
H
L
L
3
L
L
H
H
L
4
L
H
L
L
L
5
L
H
L
H
L
6
L
H
H
L
L
7
L
H
H
H
L
8
H
L
L
L
L
9
H
L
L
H
L
10
H
L
H
L
L
11
H
L
H
H
L
12
H
H
L
L
L
13
H
H
L
H
L
14
H
H
H
L
L
15
H
H
H
H
L
16
2
HS-1840ARH-T
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
(2820µm x 4080µm x 483µm ±25.4µm)
111 x 161 x 19mils ±1mil
Type: Nitride (Si3N4) over Silox (SiO2)
Nitride Thickness: 4.0kÅ ±0.5kÅ
Silox Thickness: 12.0kÅ ±1.3kÅ
METALLIZATION:
WORST CASE CURRENT DENSITY:
Type: Al Si Cu
Thickness: 16.0kÅ ±2kÅ
< 2.0e5 A/cm2
SUBSTRATE POTENTIAL:
TRANSISTOR COUNT:
Unbiased (DI)
407
BACKSIDE FINISH:
PROCESS:
Silicon
Radiation Hardened Silicon Gate, Dielectric Isolation
Metallization Mask Layout
IN1
IN2
IN3
IN4
IN5
IN6
IN7
HS-1840ARH-T
IN8
ENABLE
A0
-V
A1
OUT
A2
A3
+V
VREF
IN16
IN9
IN10
IN11
IN12
IN13
IN14
IN15
GND
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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