CS9201
Micropower 5.0 V, 100 mA
Low Dropout Linear
Regulator with NOCAP
The CS9201 is a precision 5.0 V, 100 mA voltage regulator with low
quiescent current (450 µA typ. @ 100 µA load). The 5.0 V output is
accurate within ±2% and supplies 100 mA of load current with a
maximum dropout voltage of only 600 mV.
The regulator is protected against reverse battery, short circuit, over
voltage, and over temperature conditions. The device can withstand
74 V peak transients making it suitable for use in automotive
environments. ON’s proprietary NOCAP solution is the first
technology which allows the output to be stable without the use of an
external capacitor. NOCAP is suitable for slow switching or steady
loads.
1
PIN CONNECTIONS AND
MARKING DIAGRAM
VOUT
GND
GND
NC
A
WL, L
YY, Y
WW, W
1
8
VIN
GND
GND
NC
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
VOUT
VIN
SO–8
DF SUFFIX
CASE 751
8
CS920
ALYW1
Features
NOCAP
Low Quiescent Current (450 µΑ typ. @ 100 µA load)
5.0 V, ±2% Output
100 mA Output Current Capability
Fault Protection
– 74 V Peak Transient Voltage
– –15 V Reverse Voltage
– Short Circuit
– Thermal Shutdown
– Overvoltage Shutdown
• Internally Fused Leads
•
•
•
•
•
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Package
Shipping
CS9201YDF8
SO–8
95 Units/Rail
CS9201YDFR8
SO–8
2500 Tape & Reel
Over
Voltage
Shutdown
Current Source
(Circuit Bias)
NOCAP
+
Current Limit
Sense
Sense(1)
– Error
Amplifier
Thermal
Shutdown
Bandgap
Reference
(1)
GND
Contact factory for optional Sense lead.
Figure 1. Block Diagram
Semiconductor Components Industries, LLC, 2001
November, 2001 – Rev. 13
1
Publication Order Number:
CS9201/D
CS9201
MAXIMUM RATINGS*
Parameter
Value
Unit
Internally Limited
–
–15 to 36
74
V
V
Internally Limited
–
ESD Susceptibility (Human Body Model)
4.0
kV
Package Thermal Resistance:
Junction–to–Case, RθJC
Junction–to–Ambient, RθJA
25
110
°C/W
°C/W
Junction Temperature
–40 to +150
°C
Storage Temperature
–55 to +150
°C
230 Peak
°C
Power Dissipation
Input Voltage (VIN):
DC
Peak Transient Voltage (60 V Load Dump @ VIN = 14 V)
Output Current
Lead Temperature Soldering:
Reflow (SMD styles only) Note 1
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V, IOUT = 1.0 mA, –40°C ≤ TJ ≤ 125°C; unless otherwise stated.)
Parameter
Test Conditions
Min
Typ
Max
Unit
4.90
4.85
5.00
5.00
5.10
5.15
V
V
Output Stage
Output Voltage, VOUT
9.0 V < VIN < 16 V, 100 uA ≤ IOUT ≤ 100 mA
6.0 V < VIN < 26 V, 100 uA ≤ IOUT ≤ 100 mA
Dropout Voltage (VIN–VOUT)
IOUT = 100 mA
IOUT = 100 µA
–
400
100
600
150
mV
mV
Load Regulation
VIN = 14 V, 100 µA ≤ IOUT ≤ 100 mA
–
5
50
mV
Line Regulation
6.0 V < V < 26 V, IOUT = 1.0 mA
–
5
50
mV
Quiescent Current, (IQ)
IOUT = 100 µA, VIN = 12 V
IOUT ≤ 50 mA
IOUT ≤ 100 mA
–
450
4
12
750
6
20
µA
mA
mA
Ripple Rejection
7.0 V ≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz
60
75
–
dB
–
105
200
–
mA
25
125
–
mA
150
180
–
°C
28
32
36
V
Current Limit
Short Circuit Output Current
VOUT = 0 V
Thermal Shutdown (Note 2)
Overvoltage Shutdown
–
VOUT ≤ 1.0 V
2. This parameter is guaranteed by design, but not parametrically tested in production.
PACKAGE LEAD DESCRIPTION
Package Lead Number
SO–8
Lead Symbol
1
VOUT
4, 5
NC
2, 3, 6, 7
GND
8
VIN
Function
5.0 V, ± 2%, 100 mA output.
No connection.
Ground.
Input voltage.
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2
CS9201
20
18
16
14
12
5.04
Output Voltage (V)
10
8
6
125°C
25°C
100 mA
5.02
100 µA
20 mA
5.01
5.00
4.99
4.98
4.97
0
10
20
30
40
50
60
70
80
90
4.96
–40 –20
100
0
20
Output Current (mA)
100
120 140
1
125°C
Quiescent Current (mA)
12
10
8
6
4
2
0
–2
–4
–6
–8
–10
–12
40
60
80
Temperature (°C)
Figure 3. Output Voltage vs. Temperature VIN = 14 V
Figure 2. Load Regulation vs. Output Current
VIN = 14 V
Line Regulation (mV)
–40°C
25°C
125°C
0.9
0.8
0.7
–40°C
0.6
0.5
25°C
0.4
0.3
6
8
10
12
14
16
18
20
22
24
0
26
1
2
3
4
5
6
7
8
9
10
Output Current (mA)
Input Voltage (V)
Figure 4. Line Regulation vs. Input Voltage
IOUT = 100 µA
Figure 5. Quiescent Current vs. Output
Current (Lightly Loaded) VIN = 14 V
14
0.70
25°C
12
Quiescent Current (mA)
4
2
0
–2
5.03
–40°C
Quiescent Current (mA)
Load Regulation (mV)
TYPICAL PERFORMANCE CHARACTERISTICS
10
8
125°C
6
4
–40°C
2
0.60
0
10
20
30
40
50
60
70
80
90
25°C
125°C
0.55
0.50
0.45
0.40
0.35
0.30
0
–40°C
0.65
100
4
6
8
10
12 14 16 18 20
22
24 26
Input Voltage (V)
Output Current (mA)
Figure 6. Quiescent Current vs. Output
Current VIN = 14 V
Figure 7. Quiescent Current vs. Input Voltage
IOUT = 100 µA
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3
CS9201
CIRCUIT DESCRIPTION
> 32 V
VOLTAGE REFERENCE AND OUTPUT
CIRCUITRY
VIN
Output Stage Protection
VOUT
The output stage is protected against overvoltage, short
circuit and thermal runaway conditions (Figure 8).
If the input voltage rises above 32 V (typ), the output shuts
down. This response protects the internal circuitry and
enables the IC to survive unexpected voltage transients.
Should the junction temperature of the power device
exceed 180°C (typ) the power transistor is turned off.
Thermal shutdown is an effective means to prevent die
overheating since the power transistor is the principle heat
source in the IC.
IOUT
Load
Dump
Thermal
Shutdown
Figure 8. Typical Circuit Waveforms for Output
Stage Protection
VIN
C1 *
0.1 µF
Short
Circuit
VOUT
CS9201
GND
* C1 is required if regulator is distant from power source filter.
Figure 9. Application and Test Diagram
APPLICATION NOTES
STABILITY CONSIDERATIONS / NOCAP
NOCAP is an ON Semiconductor exclusive output stage
which internally compensates the LDO regulator over
temperature, load and line variations without the need for an
expensive external capacitor
NOCAP is ideally suited for slow switching or steady
loads. If the load is characterized by transient current events,
an output storage capacitor may be needed. If this is the case,
the capacitor should be no larger than 100 nF. With loads
that require greater transient suppression, a regulator with a
traditional output stage (such as the CS8221) may be better
suited for proper operation.
Normally a low dropout or quasi–low dropout regulator
(or any type requiring a slow lateral PNP in the control loop)
necessitates a large external compensation capacitor at the
output of the IC. The external capacitor is also used to curtail
overshoot, determine startup delay time and load transient
response.
Traditional LDO regulators typically have low unity gain
bandwidth, display overshoot and poor ripple rejection.
Compensation is also an issue and depends on the external
capacitor value, ESR (Equivalent Series Resistance) and
board layout parasitics that all can create oscillations if not
properly accounted for.
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4
CS9201
CALCULATING POWER DISSIPATION IN A
SINGLE OUTPUT LINEAR REGULATOR
The value of RΘJA can then be compared with those in the
package section of the data sheet. Those packages with
RΘJA ’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
The maximum power dissipation for a single output
regulator (Figure 10) is:
PD(max) {VIN(max) VOUT(min)} IOUT(max)
VIN(max)IQ
(1)
HEAT SINKS
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RΘJA:
Once the value of PD(max) is known, the maximum
permissible value of RΘJA can be calculated:
RJA 150°C TA
PD
IIN
RJA RJC RCS RSA
where:
RΘJC = the junction–to–case thermal resistance,
RΘCS = the case–to–heatsink thermal resistance, and
RΘSA = the heatsink–to–ambient thermal resistance.
(2)
IOUT
VIN
CS9201
(3)
RΘJC appears in the package section of the data sheet.
Like RΘJA, it too is a function of package type. RΘCS and
RΘSA are functions of the package type, heatsink and the
interface between them. These values appear in heat sink
data sheets of heat sink manufacturers.
VOUT
IQ
Figure 10. Single output regulator with key
performance parameters labeled.
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5
CS9201
PACKAGE DIMENSIONS
SO–8
DF SUFFIX
CASE 751–07
ISSUE W
–X–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
A
8
5
0.25 (0.010)
S
B
1
M
Y
M
4
K
–Y–
G
C
N
X 45 SEATING
PLANE
–Z–
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
S
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6
J
DIM
A
B
C
D
G
H
J
K
M
N
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0
8
0.010
0.020
0.228
0.244
CS9201
Notes
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CS9201
NOCAP is a trademark of ON Semiconductor, and is patented.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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CS9201/D