NCV4264 150 mA Low Dropout Linear Regulator The NCV4264 is a wide input range, precision fixed output, low dropout integrated voltage regulator with a full load current rating of 150 mA. The output voltage is accurate within "2.0%, and maximum dropout voltage is 500 mV at 100 mA load current. It is internally protected against 45 V input transients, input supply reversal, output overcurrent faults, and excess die temperature. No external components are required to enable these features. http://onsemi.com MARKING DIAGRAM TAB Features • • • • • • • • • 5.0 V Fixed Output "2.0% Output Accuracy, Over Full Temperature Range Quiescent Current 400 mA at IOUT = 1.0 mA 500 mV Maximum Dropout Voltage at 100 mA Load Current Wide Input Voltage Operating Range of 5.5 V to 45 V Internal Fault Protection ♦ −42 V Reverse Voltage ♦ Short Circuit/Overcurrent ♦ Thermal Overload NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes AEC−Q100 Qualified This is a Pb−Free Device 1 2 3 A Y W V64_5x x G SOT−223 ST SUFFIX CASE 318E AYW V64_5x G 1 = Assembly Location = Year = Work Week = Specific Device Code = 5 (5.0 V) = Pb−Free Package PIN CONNECTIONS GND 1 VIN GND VOUT (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. P0 1 Publication Order Number: NCV4264/D NCV4264 IN OUT 1.3 V Reference + Error Amp − Thermal Shutdown GND Figure 1. Block Diagram PIN FUNCTION DESCRIPTION Pin No. Symbol 1 VIN Function Unregulated input voltage; 5.5 V to 45 V. 2 GND Ground; substrate. 3 VOUT Regulated output voltage; collector of the internal PNP pass transistor. TAB GND Ground; substrate and best thermal connection to the die. MAXIMUM RATINGS Rating Symbol Min Max Unit VIN −42 +45 V VOUT −0.3 +16 V Storage Temperature Tstg −55 +150 _C Moisture Sensitivity Level MSL VIN, DC Input Voltage VOUT, DC Voltage 1 − ESD Capability, Human Body Model (Note 1) VESDHB 4000 − V ESD Capability, Machine Model (Note 1) VESDMIM 200 − V − 265 pk Lead Temperature Soldering Reflow (SMD Styles Only), Lead Free (Note 2) Tsld _C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. OPERATING RANGE Pin Symbol, Parameter Symbol Min Max Unit VIN, DC Input Operating Voltage VIN 5.5 +45 V Junction Temperature Operating Range TJ −40 +150 _C 1. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A 114C) ESD MM tested per AEC−Q100−003 (EIA/JESD22−A 115C) 2. Lead Free, 60 sec – 150 sec above 217_C, 40 sec max at peak. http://onsemi.com 2 NCV4264 THERMAL RESISTANCE Parameter Symbol Condition Min Max Unit °C/W Junction−to−Ambient SOT−223 RqJA − 99 (Note 3) Junction−to−Case SOT−223 RqJC − 17 ELECTRICAL CHARACTERISTICS (VIN = 13.5 V, Tj = −40_C to +150_C, unless otherwise noted.) Characteristic Symbol Test Conditions Min Typ Max Unit Output Voltage VOUT 5.0 mA v IOUT v 100 mA (Note 4) 6.0 V v VIN v 28 V 4.900 5.000 5.100 V Line Regulation DVOUT vs. VIN IOUT = 5.0 mA 6.0 V v VIN v 28 V −30 5.0 +30 mV Load Regulation DVOUT vs. IOUT 5.0 mA v IOUT v 100 mA (Note 4) −40 5.0 +40 mV Dropout Voltage VIN−VOUT IOUT = 100 mA (Notes 4 & 5) − 275 500 mV Iq IOUT = 1.0 mA − 83 400 mA Active Ground Current IG(ON) IOUT = 50 mA (Note 4) − 1.5 15 mA Power Supply Rejection PSRR VRIPPLE = 0.5 VP−P, F = 100 Hz − 67 − dB Output Capacitor for Stability COUT ESR IOUT = 1.0 mA to 100 mA (Notes 4) 10 − 9.0 mF W Current Limit IOUT(LIM) VOUT = 4.5 V (Note 4) 150 − 500 mA Short Circuit Current Limit IOUT(SC) VOUT = 0 V (Note 4) 40 − 500 mA TTSD (Note 6) 150 − 200 _C Quiescent Current PROTECTION Thermal Shutdown Threshold 3. 1 oz., 100 mm2 copper area. 4. Use pulse loading to limit power dissipation. 5. Dropout voltage = (VIN–VOUT), measured when the output voltage has dropped 100 mV relative to the nominal value obtained with VIN = 13.5 V. 6. Not tested in production. Limits are guaranteed by design. 5.5−45 V Input II CI1 100 mF Vin 1 100 nF 4264 3 IQ Vout COUT 10 mF 2 Output RL GND Figure 2. Measurement Circuit 5.5−45 V Input Vin Cin 100 nF 1 4264 3 Vout 5.0 V Output COUT 10 mF 2 GND Figure 3. Applications Circuit http://onsemi.com 3 NCV4264 TYPICAL CHARACTERISTIC CURVES 1000 0.45 DROPOUT VOLTAGE (V) ESR (W) 10 1 0.1 Stable Region 0.01 0 20 40 80 100 120 140 160 −40°C 0.20 0.15 0.10 0 50 100 150 Figure 4. ESR Characterization Figure 5. Dropout Voltage vs. Output Load 200 14 CURRENT CONSUMPTION (mA) 14 12 10 8.0 6.0 RL = 50 W 4.0 RL = 100 W 0 10 20 30 40 125°C 10 25°C −40°C 8.0 6.0 4.0 2.0 0 50 100 150 CURRENT CONSUMPTION (mA) OUTPUT CURRENT (mA) Figure 6. Current Consumption vs. Input Voltage Figure 7. Current Consumption vs. Output Current 450 125°C 400 350 25°C 5.08 −40°C 5.06 250 200 150 100 50 5.0 10 200 5.10 300 0 12 0 50 OUTPUT VOLTAGE (V) INPUT VOLTAGE (V) 0.25 OUTPUT LOAD (mA) 2.0 QUIESCENT CURRENT (mA) 25°C LOAD CURRENT (mA) 18 0 0.30 0 180 16 0 0.35 0.05 Vin = 13.5 V 60 125°C 0.40 Maximum ESR Cout = 10, 22 mF 100 15 5.04 5.02 5.00 4.98 4.96 4.94 4.92 4.90 −50 20 0 50 100 OUTPUT LOAD (mA) TEMPERATURE (°C) Figure 8. Quiescent Current vs. Output Load Figure 9. Output Voltage vs. Temperature http://onsemi.com 4 150 NCV4264 6.0 180 5.0 140 OUTPUT VOLTAGE (V) OUTPUT CURRENT (mA) 160 120 100 80 TA = 25°C 60 40 0 0 10 20 30 3.0 2.0 1.0 TA = 125°C 20 4.0 40 0 50 RL = 50 W 0 2.0 4.0 6.0 8.0 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 10. Output Current vs. Input Voltage Figure 11. Input Voltage vs. Output Voltage http://onsemi.com 5 10 NCV4264 Circuit Description Calculating Power Dissipation in a Single Output Linear Regulator The NCV4264 is a precision trimmed 5.0 V fixed output regulator. The device has current capability of 150 mA, with 500 mV of dropout voltage at 100 mA of current. The regulation is provided by a PNP pass transistor controlled by an error amplifier with a bandgap reference. The regulator is protected by both current limit and short circuit protection. Thermal shutdown occurs above 150°C to protect the IC during overloads and extreme ambient temperatures. The maximum power dissipation for a single output regulator (Figure 3) is: PD(max) + [VIN(max) * VOUT(min)] @ IQ(max) ) VI(max) @ Iq (eq. 1) Where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IQ(max) is the maximum output current for the application, and Iq is the quiescent current the regulator consumes at IQ(max). Once the value of PD(Max) is known, the maximum permissible value of RqJA can be calculated: Regulator The error amplifier compares the reference voltage to a sample of the output voltage (Vout) and drives the base of a PNP series pass transistor by a buffer. The reference is a bandgap design to give it a temperature−stable output. Saturation control of the PNP is a function of the load current and input voltage. Over saturation of the output power device is prevented, and quiescent current in the ground pin is minimized. PqJA + 150 oC * TA PD (eq. 2) The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA’s less than the calculated value in Equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. The current flow and voltages are shown in the Measurement Circuit Diagram. Regulator Stability Considerations The input capacitor CIN1 in Figure 2 is necessary for compensating input line reactance. Possible oscillations caused by input inductance and input capacitance can be damped by using a resistor of approximately 1 W in series with CIN2. The output or compensation capacitor, COUT helps determine three main characteristics of a linear regulator: startup delay, load transient response and loop stability. The capacitor value and type should be based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (−25°C to −40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer ’s data sheet usually provides this information. The value for the output capacitor COUT shown in Figure 2 should work for most applications; however, it is not necessarily the optimized solution. Stability is guaranteed at values CQ = 10 mF and an ESR = 9 W within the operating temperature range. Actual limits are shown in a graph in the Typical Performance Characteristics section. Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: RqJA + RqJC ) RqCS ) RqSA (eq. 3) Where: RqJC = the junction−to−case thermal resistance, RqCS = the case−to−heat sink thermal resistance, and RqSA = the heat sink−to−ambient thermal resistance. RqJA appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heat sink and the interface between them. These values appear in data sheets of heat sink manufacturers. Thermal, mounting, and heat sinking are discussed in the ON Semiconductor application note AN1040/D, available on the ON Semiconductor Website. http://onsemi.com 6 NCV4264 120 qJA (°C/W) 100 SOT223 80 60 40 20 0 0 100 200 300 400 500 600 700 COPPER AREA (mm2) Figure 12. 100 SOT223 R(t) (°C/W) 10 1.0 0.1 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 PULSE TIME (sec) Figure 13. ORDERING INFORMATION Device NCV4264ST50T3G Marking Package Shipping† V64_5 SOT−223 4000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 7 NCV4264 PACKAGE DIMENSIONS SOT−223 (TO−261) ST SUFFIX CASE 318E−04 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. D b1 4 HE 1 2 3 b e1 e C q A 0.08 (0003) DIM A A1 b b1 c D E e e1 L1 HE E A1 q MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10° − MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° L1 SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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