FUJITSU MB506

Sept. 1995
Edition 3.0a
DATA SHEET
MB506
ULTRA HIGH FREQUENCY PRESCALER
ULTRA HIGH FREQUENCY PRESCALER
The Fujitsu MB506 is a high frequency, up to 2.4GHz, prescaler used with a
frequency synthesizer to form a Phase Locked Loop (PLL). It will divide the input
frequency by the modulus of 128 or 256 and the output level is 1.6V peak to peak
on ECL level.Operation in the 1.6GHz range meets the specification for
applications in Direct Broadcasting Satellite Systems (DBS), CATV systems, and
UHF Transceivers.
PLASTIC PACKAGE
DIP-08P-M01
FEATURES
High Frequency Operation
2.4GHz max.
Power Dissipation
90mW typ.
Wide Operation Temperature
-40°C to +85°C
Stable Output Amplitude
VOUT = 1.6Vp–p
PLASTIC PACKAGE
FPT-08P-M01
Complete PLL synthesizer circuit with the Fujitsu MB87006A, PLL
synthesizer IC
PIN ASSIGNMENT
Plastic 8-pin Standard Dual-In-Line Package or Flat Package
ABSOLUTE MAXIMUM RATINGS (See Note)
IN
1
VCC
2
8
IN
7
NC
TOP VIEW
Rating
Symbol
Value
Unit
Supply Voltage
VCC
–0.5 to +7.0
V
Input Voltage
VIN
–0.5 to VCC
V
Output Current
IO
10
mA
TSTG
–55 to +125
°C
Storage Temperature
Note:
Permanent device damage may occur if the above Absolute Maximum Ratings are
exceeded. Functional operation should be restricted to the conditions as detailed in
Copyright 1995 by FUJITSU LIMITED and FUJITSU MICROELECTRONICS
SW
3
6
SW2
OUT
4
5
GND
This device contains circuitry to protect the inputs against
damage due to high static voltages or electric fields. However,
it is advised that normal precautions be taken to avoid
application of any voltage higher than maximum rated voltages
to this high impedance circuit.
MB506
the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Input
Buffer
D Q
D Q
D Q
C Q
C Q
C Q
IN
IN
SW
SW
D Q
D Q
D Q
C Q
C Q
C Q
D Q
SW
C Q
D Q
SW
C Q
Output
Buffer
OUT
SW1
SW2
H
H
1/64
L
H
1/128
H
L
1/128
L
L
1/256
Note:
Divide Ratio
H = VCC, L = open
Figure 1. MB506 Block Diagram
PIN DESCRIPTION
2
Pin Number
Symbol
Function
1
IN
2
VCC
Power Supply Voltage
3
SW1
Divide Ratio Control Input Selecting Divide Ratio (See Divide Ratio Table)
4
OUT
Output
5
GND
Ground
6
SW2
Divide Ratio Control Input Selecting Divide Ratio (See Divide Ratio Table)
7
NC
No Connection
8
IN
Complementary Input
Input
MB506
RECOMMENDED OPERATING CONDITIONS
Value
Parameter
Symbol
Supply Voltage
VCC
Output Current
IO
Ambient Temperature
TA
Load Capacitance
CL
Unit
Min.
Typ.
Max.
4.5
5.0
5.5
1.2
–40
V
mA
+85
°C
12
pF
ELECTRICAL CHARACTERISTICS
(Recommended operating conditions unless otherwise noted.)
Value
Parameter
Symbol
Conditions
Unit
Min.
Supply Curent
ICC
Output Amplitude
VO
Input Frequency
fIN
Input Signal Amplitude
PIN
High Level Input Voltage for SW
VIHS*
Low Level Input Voltage for SW
VILS
1.0
Max.
18
mA
1.6
Vp–p
TA = –40°C
to 85°C
100
2200
TA = –40°C
to 60°C
100
2400
fIN = 100MHz to 1.3GHz
–16
5.5
fIN = 1.3MHz to 2.4GHz
–4
5.5
with input
coupling
capacitor
1000pF
MHz
dBm
VCC –0.1
VCC
Open
VCC +0.1
V
V
*Design Guarantee
MINIMUM INPUT SIGNAL AMPLITUDE (MVp–p)
Note:
Typ.
1000
VCC = 5.0V
TA = 25°C
800
600
400
200
0
100
200
500 1000 2000
INPUT FREQUENCY (MHz)
5000
Figure 2. Input Signal Amplitude vs. Input Frequency
3
MB506
PACKAGE DIMENSIONS
8-LEAD PLASTIC DUAL-IN-LINE PACKAGE
(CASE No.: DIP-08P-M01)
8-LEAD PLASTIC FLAT PACKAGE
(CASE No.: FPT-08P-M01)
15° MAX
INDEX
.010
.250 – .008
0.25
6.35 – 0.20
.244+.010
(6.20+0.25)
.002(0.05)
MIN
(STAND OFF)
.300(7.62)TYP
View “A”
.008(0.2)
.014
.035 – .012
0.35
0.89 – 0.30
INDEX
.010+.02
(0.25+0.5)
.016
.370 – .012
0.40
9.40 – 0.30
.016
.268 – .008
0.40
6.80 – 0.20
.209+.012
(5.30+0.25)
.307+.016
(7.8+0.4)
.020+.008
(0.5+0.2)
.100(2.54)TYP
.018+.004
(0.45+0.10)
.050(1.27)
TYP
.172(4.36)MAX
.020(0.5)
.007(0.18)
MAX
.027(0.68)
MAX
.002
.006 – .001
0.05
0.15 – 0.2
.085(2.15)MAX
.012
.039 – 0
0.3
0.99 – 0
.020*0.51)
MIN
.018+.003
(0.46+0.08)
.012
.060 – 0
.118(3.0)MIN
0.3
1.52 – 0
A
.0315+.008
(0.8+0.2)
Dimensions in
inches (millimeters)
1987 FUJITSU LIMITED D08006S-2C
All Rights Reserved. Circuit diagrams utilizing Fujitsu products are
included as a means of illustrating typical semiconductor applications.
Complete information sufficient for construction purposes is not
necessarily given. The information contained in this document has been
carefully checked and is believed to be reliable. However, Fujitsu
assumes no responsibility for inaccuracies.
Dimensions in
inches (millimeters)
1987 FUJITSU LIMITED F08002S-2C
The information contained in this document does not convey any license
under the copyrights, patent rights or trademarks claimed and owned by
Fujitsu. Fujitsu reserves the right to change products or specifications
without notice. No part of this publication may be copied or reproduced in
any form or by any means, or transferred to any third party without prior
written consent of Fujitsu.
FUJITSU LIMITED
For further information please contact:
Europe
Japan
FUJITSU MIKROELEKTRONIK GmbH
Am Siebenstein 6-10,
6072 Dreieich-Buchschlag,
Germany
Tel: (06103) 690-0
Telex: 411963
FAX: (06103) 690-122
FUJITSU LIMITED
International Marketing Div.
Furukawa Sogo Bldg., 6-1, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100, Japan
Tel: (03) 3216-3211
Telex: 781-2224361
FAX: (03) 3215-0662
North and South America
FUJITSU MICROELECTRONICS, INC.
Integrated Circuits Division
3545 North First Street
San Jose, CA 95134-1804, USA
Tel: 408-922-9000
FAX: 408-432-9044
FUJITSU LIMITED 1990
4
Asia
FUJITSU MICROELECTRONICS ASIA PTE LIMITED
51 Bras Basah Road,
Plaza By The Park,
#06-04 to #06-07
Singapore 0719
Tel: 336-1600
Telex: 55573
FAX: 336-1609
Printed in Japan PV0050–902A3