HITACHI HRW0202

HRW0202A
Silicon Schottky Barrier Diode for Rectifying
ADE-208-209E (Z)
Rev 5
Jul. 1998
Features
• Low forward voltage drop and suitable for high effifiency rectifying.
• MPAK Package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HRW0202A
S17
MPAK
Outline
3
2
(Top View)
1
1 Anode
2 Anode
3 Cathode
HRW0202A
Absolute Maximum Ratings (Ta = 25°C) *1
Item
Symbol
*2
RRM
Repetitive peak reverse
voltage
V
Average rectified current
I O*2
*3
Value
Unit
20
V
200
mA
3
A
Non-Repetitive peak
forward surge current
I FSM
Junction temperature
Tj
125
°C
Storage temperature
Tstg
–55 to +125
°C
Notes 1. Two device total
Notes 2. See from Fig.4 to Fig.7
Notes 3. 10msec sine wave 1 pulse
Electrical Characteristics (Ta = 25°C) *1
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Forward voltage
VF
—
—
0.40
V
I F = 100 mA
Reverse current
IR
—
—
50
µA
VR = 20V
Thermal resistance
Rth(j-a)
—
350
—
°C/W Polyimide board *2
Notes 1. Per one device
Notes 2. Polyimide board
3.0
1.5
1.5
1.5
2
0.8
20hx15wx0.8t
Unit: mm
HRW0202A
Main Characteristic
1.0
10 –3
Pulse test
10
10
Reverse current I R (A)
10
Ta = 75°C
–2
–3
Ta = 25°C
–4
10
10
–5
–6
0
0.1
0.2
0.3
0.4
0.5
0.6
Fig.1 Forward current Vs. Forward voltage
10
10
10
–4
Ta = 75°C
–5
Ta = 25°C
10
10
Forward voltage VF (V)
10
–6
–7
–8
0
15
20
5
10
Reverse voltage VR (V)
25
Fig.2 Reverse current Vs. Reverse voltage
2
f = 1MHz
Pulse test
Capacitance C (pF)
Forward current I F (A)
10
Pulse test
–1
10
1.0
1.0
10
Reverse voltage VR (V)
40
Fig.3 Capacitance Vs. Reverse voltage
3
HRW0202A
Main Characteristic
0.25
0A
D=1/6
t
T
t
Tj =25°C D= T\
0.06
Sin( ˘=180°)
D=1/3
D=1/2
0.04
DC
0.02
0
Reverse power dissipation Pd (W)
Forward power dissipation Pd (W)
0.08
0.02
0.04
t
D= \
T
D=5/6
Tj =125°C
0.15
D=2/3
D=1/2
0.10
Sin( ˘=180°)
0.05
0
Vs. Forward current
10
5
15
20
25
Reverse voltage @ @VR @(V)
@ @IF @(A)
Fig5. Reverse power dissipation
Vs. Reverse voltage
0.25
0.10
DC
0.08
Average rectified current
Sin( ˘=180°)
D=1/2
D=1/3
0.06
D=1/6
0.04
VR=VRRM/2
0.02 Tj =125°C
Rth(j-a)=350°C/W
Per one device
0
-25
0
25
50
@Io (A)
0.12
@Io (A)
T
0.1
0.06 0.08
Fig4. Forward power dissipation
Average rectified current
t
0.20
0
0
Forward current
4
0V
75 100 125
0.20
DC
Sin( ˘=180°)
D=1/2
0.15 D=1/3
D=1/6
0.10
V =V
/2
RRM
0.05 TjR=125°C
Rth(j-a)=350°C/W
Two device total
0
-25
0
25
50
75 100 125
Ambient temperature Ta ( °C)
Ambient temperature Ta ( °C)
Fig.6 Average rectified current Vs. Ambient temperature
Fig.7 Average rectified current Vs. Ambient temperature
HRW0202A
Package Dimensions
0.65 – 0.3
+ 0.10
0.4 – 0.05
Laser Mark
+ 0.1
Unit : mm
+ 0.10
0.16 – 0.06
0.3
2.8 +– 0.1
+ 0.2
– 0.6
2.8
2 Anode
3 Cathode
+ 0.2
1.9
1 Anode
1.1 – 0.1
1
0.95
0 – 0.10
0.1
0.65 +– 0.3
2
0.95
0.3
S17
1.5
3
Hitachi Code
JEDEC Code
EIAJ Code
Weight (g)
MPAK(1)
—
SC-59A
0.011
5
HRW0202A
Cautions
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
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traffic, safety equipment or medical equipment for life support.
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for maximum rating, operating supply voltage range, heat radiation characteristics, installation
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beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
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