Double Balanced Mixers (Relay Headers) MC-600R Series These mixers mix the RF signal and LO signal to produce the IF signal (i.e., fIF = fRF - fLO) ■Features 1.Suited for High-Density Mounting Ultraminiature design with a 2.54 mm pitch enables high-density mounting. 2.LO Level of +7 dBm Mixers operate at a LO level of +7 dBm. MC-602R 3.Highly Reliable Design The metal case is designed with a hermetically sealed construction which contains inert gas. This permits quality to be maintained over a long period. 4.Easy Soldering The leads have received solder dip processing which makes soldering work easier. MC-601R 5.Prevention of Flux Creepage Use of the supplied Teflon sheet permits the prevention of solder flux creepage. ■Product Specifications Frequency range (Note) Characteristic impedance Maximum Input Power (Total input power) Ratings 30 to 1800 MHz 50 ohms 30 mW Operating temperature range Operating relative humidity -10ç to +65ç 95% Max. Note: The frequency range will differ depending on the products. Item Standard Conditions Frequency of 10 to 2000 Hz, overall amplitude of 1.5 mm, acceleration of 98 m/s2 for 4 hours in each of 3 directions 1.Vibration 2.Shock No damage, cracks, or parts dislocation Acceleration of 294 m/s2, sine half-wave waveform, 3 cycles in each of the 3 axis Temperature: -35ç → +5ç to +35ç → +80ç → +5ç to +35ç Time: 30 → 15 max. → 30 → 15 max. (Minutes) 5 cycles 3.Temperature cycle ●The test method conforms to MIL-STD-202. ■Materials ■External Dimensions Teflon sheet (t=0.2) Part Material Finish External Cladding Iron Nickel plating Contacts Iron-nickel alloy Solder dip Hermetic seal Glass ---------- ■Ordering Information ■Function Diagram MC - 6 0 1 R 1 2 3 4 5 1 Series Name: MC 4 Suffix 2 6: Indicates double balanced mixer. 5 Form of Case R: Relay header 3 LO level 0: +7dBm 54 Green hermetic seal 1.6 mm dia. 2, 5, 6, and 7 are ground. (Note that 2 is case ground.) 2, 3, 5, 6, and 7 are ground. (Note that 2, 3, 5, 6, and 7 are case ground.) ■Specifications Part Number Frequency Range (MHz) LO Power (dBm) Conversion Loss (dB Max) RF/LO IF MC-601R 30~700 DC~700 +7 9.5 MC-602R 600~1,800 30~200 +7 9.5 Isolation (dB Min) LO-RF LO-IF 20 15 20(,0600~1,000) 15(,0600~1,000) 15(1,000~1,800) 10(1,000~1,800) RF Input for 1dB Compression Level (dBm typ.) Weight (g) +3 3 +5 3 NOTE: The frequency range will differ depending on the product. ■Typical Data MC-601R MC-602R 55 ■Circuit Diagrams MC-601R MC-602R Numbers in parentheses ( ) indicate port numbers. ■PCB Mounting Pattern (Parts mounting side) Land (NOTE 1) (Soldering side) Through hole (Parts mounting side) Land (NOTE 1) Through hole (Soldering side) (NOTE 2) MC-601R (NOTE 2) MC-602R ∏ Note 1: One example is given for the form dimensions of the land. Note 2: When glass epoxy board ( r~ _ 4.7 ) of 0.8 mm thickness is used, the width (W) of the 50ø impedance micro stripline becomes W ≈1.4 mm. ■Precautions ●This product uses diodes and therefore care must be taken against static electricity when handling. When using a soldering iron, please solder with a grounded soldering iron. The soldering conditions are as described below. Soldering temperature: 260ç or less Soldering time: 10 seconds or less ●Please use the supplied Teflon sheet to prevent solder flux creepage and so that the leads do not become shorted due to solder flowing to the board mounting surface. 56