19-1614; Rev 0; 6/00 UAL IT MAN TION K A ET U E L H A EV TA S WS DA FOLLO SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package Features ♦ +2.7V to +5.5V Single Supply ♦ Low Operating Current 8.5mA for High Linearity 4.5mA for Paging 4.1mA in Low-Gain, High-Linearity Mode ♦ Low Noise Figure: 1.5dB Cellular ♦ Adjustable IIP3 ♦ Two Gain Settings ♦ < 1µA Shutdown Mode ♦ Ultra-Small 6-Bump UCSP (1mm x 1.5mm) The MAX2374 provides two gain modes. High-gain mode optimizes system sensitivity, while low-gain mode optimizes system linearity. Ordering Information Applications CDMA Phones PART TEMP. RANGE PINPACKAGE MAX2374EBT -40°C to +85°C 6 UCSP* TDMA Phones Wireless Local Loop (WLL) TOP MARK AAB *UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this data sheet for more information. GSM Handsets Land Mobile Radio Wireless Data Pin Configuration appears at end of data sheet. Typical Application Circuit VCC = + 2.75V 100pF A3 5pF 0.01µF LNA INPUT A2 VCC GND 8.2nH MAX2374 LNAIN B3 LNAOUT 2pF B2 LNA OUTPUT VCC A1 6.8nH GAIN-CONTROL LOGIC OUTPUT GAIN BIAS B1 RBIAS ________________________________________________________________ Maxim Integrated Products 1 For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800. For small orders, phone 1-800-835-8769. MAX2374 General Description The MAX2374 silicon-germanium (SiGe), switchablegain, variable-linearity, low-noise amplifier (LNA) is designed for cellular-band, code-division multipleaccess (CDMA). It can be used for applications such as TDMA and PDC or wherever high dynamic range and low noise are required. This LNA provides a high intermodulation intercept point (IIP3), which is adjustable to meet specific system requirements by selecting an appropriate external resistor. To achieve high gain and low noise, the LNA is packaged in a tiny ultra-chip-scale package (UCSP) with six solder bumps. The LNA operates from a +2.7V to +5.5V single supply and consumes just 8.5mA while achieving a +6.2dBm input IIP3. Supply current reduces to less than 1µA in shutdown mode. MAX2374 SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +6.0V GAIN, BIAS Voltage to GND...................-0.3V to (VCC + 0.3V) GAIN, BIAS Current ......................................................±10mA RF Input Power LNAIN .........................................................................+10dBm LNAOUT to GND ....................................-0.3V to (VCC + 0.6V) Continuous Power Dissipation (TA = +85°C) ...................540mW Operating Temperature Range MAX2374 .........................................................-40°C to +85°C Storage Temperature.........................................-65°C to +150°C Junction Temperature ......................................................+150°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (VCC = +2.7V to +5.5V, RBIAS = 20kΩ, VGAIN = high, LNAOUT = VCC, no input signals at LNAIN, TA = -40°C to +85°C. Typical values are at VCC = +2.75V, TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER CONDITIONS MIN TYP MAX UNITS 5.5 V VCC = 2.75V 8.5 10.5 VCC = 5.5V 10.5 SUPPLY Supply Voltage Supply Current Shutdown Supply Current 2.7 mA RBIAS = 10kΩ 15 RBIAS = 43kΩ 4.5 GAIN = 0.6V, VCC = 2.75V 4.5 5.5 BIAS = open circuit 0.1 1 µA GAIN CONTROL INPUT Input Logic Voltage High 1.5 V Input Logic Voltage Low Input Current -5 0.6 V 5 µA VCC 1.16 BIAS Pin Voltage (Note 2) V AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, VGAIN = high, fLNAIN = 881MHz, RBIAS = 20kΩ, TA = +25°C. Typical values are at VCC = +2.75V, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS Recommended Operating Frequency Range (Note 3) Input and Output Return Loss Reverse Isolation TYP 750 Input and output ports externally matched to 50Ω 14 VGAIN = high -20 VGAIN = low -9 Output 1dB Compression VCC = 2.75V Maximum Stable Load VSWR All modes, f ≤ 6.5GHz 2 MIN VGAIN = high 6 VGAIN = low -3.5 10:1 _______________________________________________________________________________________ MAX UNITS 1000 MHz dB dB dBm SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package (Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, VGAIN = high, fLNAIN = 881MHz, RBIAS = 18kΩ, TA = +25°C. Typical values are at VCC = +2.75V, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS MIN TYP MAX TA = +25°C 13.8 15 15.6 TA = -40°C to +85°C 12.5 UNITS HIGH-GAIN MODE (GAIN = VCC) Gain Noise Figure VCC = 2.75V 1.5 RBIAS = 10kΩ Input Third-Order Intercept Point (Note 4) MAX2374 dB 17 1.7 dB 7.2 RBIAS = 20kΩ 4.5 dBm 6.2 RBIAS = 43kΩ 4.2 LOW-GAIN MODE (GAIN = GND) Gain TA = -40°C to +85°C TA = +25°C 0.4 TA = -40°C to +85°C -1 1.2 Noise Figure 3 RBIAS = 10kΩ Input Third-Order Intercept Point (Note 4) MAX2374 dB 3.5 dB 10.5 RBIAS = 20kΩ 5.8 dBm 7.2 RBIAS = 43kΩ Note 1: Note 2: Note 3: Note 4: 2 3.5 1 Production tested at TA = +25°C. Maximum and minimum limits are guaranteed by design and characterization. Guaranteed by design and characterization. Operation over this frequency range is possible with a matching network tuned to the desired operating frequency. Measured with two-tone test with PLNAIN = -25dBm per tone, f1 = 881MHz, f2 = 881.9MHz. Typical Operating Characteristics (Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, fLNAIN = 881MHz, RBIAS = 20kΩ, TA = +25°C, unless otherwise noted.) S21, S11, S22, S12 vs. FREQUENCY S21, S11, S22, S12 vs. FREQUENCY 5 10 10 VCC = 2.75V GAIN = GND 0 8 TA = -40°C GAIN = VCC TA = -40°C TA = +85°C TA = +25°C 6 MAGNITUDE (dB) S21 MAGNITUDE (dB) ICC (mA) VCC = GAIN = 2.75V MAX2374-04 MAX2374-01 RBIAS = 20kΩ TA = +85°C TA = +25°C 20 MAX2374-03 ICC vs. VCC AND TEMPERATURE 12 0 S22 S11 -10 S22 S21 -5 -10 S12 GAIN = GND -20 -15 S11 S12 -30 4 2.5 3.0 3.5 4.0 VCC (V) 4.5 5.0 5.5 -20 750 800 850 900 FREQUENCY (MHz) 950 1000 750 800 850 900 950 1000 FREQUENCY (MHz) _______________________________________________________________________________________ 3 MAX2374 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = +2.7V to +5.5V, PLNAIN = -30dBm, fLNAIN = 881MHz, RBIAS = 20kΩ, TA = +25°C, unless otherwise noted.) TA = +85°C MAX2374-05 TA = -40°C 20 TA = +25°C A = VGAIN = GND B = VGAIN = VCC 15 15 TA = +85°C 10 IIP3 (dBm) GAIN (dB) GAIN = VCC VCC = 2.75V VCC = 2.75V, f = 881MHz, 882MHz MAX2374-06 IIP3 vs. RBIAS AND TEMPERATURE GAIN vs. RBIAS AND TEMPERATURE 20 TA = +25°C TA = -40°C A 10 TA = -40°C B GAIN = GND TA = +85°C 5 TA = +25°C B TA = +25°C TA = +85°C 0 0 5 15 25 35 0 45 20 60 CURRENT vs. VOLTAGE AND RBIAS NOISE FIGURE vs. FREQUENCY 20 MAX2374-07 4.5 4.0 RBIAS = 10kΩ, GAIN = VCC 15 3.5 40 RBIAS (kΩ) RBIAS (kΩ) MAX2374-08 TA = -40°C 5 VCC = 2.75V RBIAS = 10kΩ, GAIN = GND RBIAS = 20kΩ, GAIN = VCC 3.0 ICC (mA) NOISE FIGURE (dB) MAX2374 SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package 2.5 2.0 10 RBIAS = 43kΩ, GAIN = VCC 5 GAIN = VCC RBIAS = 20kΩ, GAIN = GND 1.5 RBIAS = 43kΩ, GAIN = GND 1.0 0 750 800 850 900 950 2.5 1000 FREQUENCY (MHz) 3.0 3.5 4.0 4.5 5.0 5.5 VCC (V) Pin Description 4 PIN NAME FUNCTION A3 GND A2 LNAIN LNA Input Port. Blocking capacitor is required, which may be used as part of the matching network. A1 GAIN Gain-Control Logic Input. Drive high for high-gain mode. Drive low for low-gain mode. B1 BIAS LNA Bias Setting Pin. For nominal bias, connect 20kΩ resistor to VCC. Adjust the resistor value to alter the linearity of the LNA. B2 LNAOUT B3 VCC Ground LNA Output Port. This port requires an external pullup inductor, which may be used as part of the matching network. Supply Voltage Input. Bypass with a 100pF capacitor to GND. _______________________________________________________________________________________ SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374 Table 1a. S-Parameters (VCC = VGAIN = 2.75V) FREQ (MHz) S11 MAGNITUDE 50 0.929 250 S21 ANGLE MAGNITUDE -11.89 12.84 0.728 -49 500 0.571 S12 S22 ANGLE MAGNITUDE ANGLE MAGNITUDE -151.3 0.007 123.5 0.908 78.8 9.83 122.73 0.026 69 0.842 -20.2 -77.5 6.19 79.42 0.041 47.6 0.728 -54.8 ANGLE 750 0.524 -101 4.21 49.35 0.053 33.3 0.68 -81 1000 0.529 -123.7 3.12 24.18 0.06 21 0.671 -105 1250 0.568 -145.2 2.38 1 0.063 11.19 0.68 -128 1500 0.612 -165 1.77 -19.2 0.057 5.042 0.704 -150 1750 0.639 176 1.46 -35 0.061 15 0.732 -171 2000 0.652 163 1.07 -51 0.094 17 0.697 162 2250 0.664 149 1.01 -60.5 0.161 -12.9 0.626 158.7 2500 0.691 139 0.892 -77 0.1 -45.4 0.689 146.5 2750 0.716 125 0.781 -91.7 0.078 -37 0.693 128 3000 0.72 111.5 0.662 -104 0.074 -33.3 0.686 110 ANGLE MAGNITUDE ANGLE Table 1b. S-Parameters (VCC = 2.75V, VGAIN = GND) FREQ (MHz) S11 S21 S12 MAGNITUDE ANGLE MAGNITUDE ANGLE MAGNITUDE S22 50 0.987 -8.93 1.25 -148.7 0.01 127 0.374 85.8 250 0.916 -42.4 1.21 128.8 0.06 85.7 0.471 1.23 500 0.8 -77 1 72.4 0.14 52.2 0.596 -42 750 0.75 -106 0.772 28.18 0.189 19.6 0.659 -82 1000 0.754 -132.7 0.583 -6.87 0.2 -9.33 0.689 -117.3 1250 0.782 -158 0.429 -34.5 0.184 -30.7 0.694 -147.5 1500 0.803 180 0.301 -54 0.146 -47 0.695 -173 1750 0.811 159.5 0.228 -66 0.117 -53.4 0.681 164.6 2000 0.797 141.5 0.148 -66 0.096 -42.5 0.629 141.7 2250 0.739 126.3 0.196 -62 0.175 -47 0.534 140 2500 0.745 112 0.156 -89 0.123 -77.2 0.623 126.35 2750 0.701 92.4 0.096 -83 0.082 -63.3 0.6 103.2 3000 0.591 73 0.112 -73.48 0.103 -62.8 0.566 85.8 _______________________________________________________________________________________ 5 SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package MAX2374 Pin Configuration TOP VIEW (BUMPS ON BOTTOM) MAX2374 GND A3 B3 VCC LNAIN A2 B2 LNAOUT GAIN A1 B1 BIAS UCSP Detailed Description The MAX2374 SiGe LNA is packaged in a UCSP package in order to deliver high gain, high linearity, and low noise in the smallest package possible. The special feature of this LNA is that its linearity is adjusted by an external resistor, RBIAS. The LNA has two digitally controllable gain modes to increase system dynamic range. Digital high at GAIN selects the high-gain mode, and digital low selects the low-gain mode. Adjust the LNA bias current to control the amplifier’s linearity. The resistor RBIAS connected between BIAS and VCC controls the LNA current. The amplifier’s linearity is directly related to the operating current. Increasing the bias current of the LNA increases the IIP3. VBIAS is approximately constant at VCC - 1.16V. Connecting a resistor from BIAS to VCC results in a supply current that can be calculated as follows: VCC = (High Gain) ~ – (150 - 1.16V) / RBIAS IBIAS can be set by a fixed resistor to VCC as described above, or it can be generated with a switched network. To operate the LNA in high-gain/high-linearity mode, set RBIAS = 20kΩ and drive GAIN high. Do this in the presence of a transmit signal to minimize cross-modulation. To operate the LNA in low-gain/low-linearity mode, set RBIAS = 43kΩ and drive GAIN high. This mode draws less current and should be used in the absence of a transmit signal (paging mode). Shutdown of the IC is accomplished by switching RBIAS to open circuit. Layout Issues Design the layout for the IC to be as compact as possible to minimize the parasitics. The chip-scale IC package uses a bump pitch of 0.5mm (19.7mil) and bump diameter of 0.3mm (~12mil). Therefore, lay out the solder-pad spacing on 0.5mm (19.7mil) centers, using a 6 pad size of 0.25mm (~10mil) and a solder mask opening of 0.33mm (13mil). Round or square pads are permissible. Connect multiple vias from the ground plane as close to the ground pins as possible. Install capacitors as close as possible to the IC supply voltage pin and supply end of the series inductor. Place the ground end of these capacitors near the IC GND pins to provide a low-impedance return path for the signal current. Prototype Chip Installation Alignment keys on the PC board around the area where the chip is located will be helpful in the prototype assembly process. It is better to align the chip on the board before any other components are placed, and then place the board on a hot plate or hot surface until the solder starts melting. Remove the board from the hot plate without disturbing the position of the chip, and let it cool down to room temperature before processing the board further. UCSP Reliability The ultra-chip-scale package (UCSP) represents a unique packaging form factor that may not perform equally well as a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP package. Performance through operating-life test and moisture resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for UCSP packages. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Comprehensive reliability tests have been performed and are available upon request. In conclusion, the UCSP performs reliably through environmental stresses. Marking Information A A A A A A ORIENTATION PRODUCT ID CODE LOT CODE Chip Information TRANSISTOR COUNT: 296 _______________________________________________________________________________________ SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package 6L,UCSP.EPS _______________________________________________________________________________________ 7 MAX2374 Package Information MAX2374 SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package NOTES 8 _______________________________________________________________________________________