MAXIM MAX2410EEI

19-1320; Rev 1; 3/98
NUAL
KIT MA
ATION
EET
H
S
A
EVALU
T
WS DA
O
L
L
O
F
Low-Cost RF Up/Downconverter
with LNA and PA Driver
____________________________Features
The MAX2410 performs the RF front-end transmit/receive
function in time-division-duplex (TDD) communication
systems. It operates over a wide frequency range and
is optimized for RF frequencies around 1.9GHz.
Applications include most popular cordless and PCS
standards.
The MAX2410 contains a low-noise amplifier (LNA), a
downconverter mixer, a local-oscillator (LO) buffer, an
upconverter mixer, and a variable-gain power-amplifier
(PA) driver in a low-cost, plastic surface-mount package.
The LNA has a 2.4dB (typical) noise figure and a
-10dBm input third-order intercept point (IP3). The downconverter mixer has a low 9.8dB noise figure and a
3.3dBm IP3. Image and LO filtering are implemented offchip for maximum flexibility. The PA driver has 15dB of
gain, which can be reduced over a 35dB (typical) range.
Power consumption is only 60mW in receive mode or
90mW in transmit mode and drops to less than 0.3µW in
shutdown mode.
A similar part, the MAX2411A, features the same functionality as the MAX2410 but offers a differential
bidirectional (transmit and receive) IF port. This allows
the use of a single IF filter for transmit (TX) and receive
(RX). For applications requiring a receive function only,
consult the data sheet for the MAX2406, a low-cost
downconverter with low-noise amplifier.
♦ Low-Cost Silicon Bipolar Design
♦ Integrated Upconvert/Downconvert Function
________________________Applications
___________________Pin Configuration
PWT1900
DCS1800/PCS1900
PHS/PACS
DECT
ISM-Band Transceiver
Iridium Handsets
♦ Operates from Single +2.7V to +5.5V Supply
♦ 3.2dB Combined Receiver Noise Figure:
2.4dB (LNA)
9.8dB (Mixer)
♦ Flexible Power-Amplifier Driver:
18dBm Output Third-Order Intercept (OIP3)
35dB Gain Control Range
♦ LO Buffer for Low LO Drive Level
♦ Low Power Consumption:
60mW Receive
90mW Full-Power Transmit
♦ 0.3µW Shutdown Mode
♦ Flexible Power-Down Modes Compatible with
MAX2510/MAX2511 IF Transceivers
_______________Ordering Information
TEMP. RANGE
PIN-PACKAGE
MAX2410EEI
PART
-40°C to +85°C
28 QSOP
MAX2410E/D
-40°C to +85°C
Dice*
*Dice are specified at TA = +25°C, DC parameters only.
TOP VIEW
28 GND
GND 1
27 LNAOUT
LNAIN 2
Functional Diagram
GND 3
26 GND
GND 4
25 GND
24 RXMXIN
VCC 5
LNAOUT
RXMXIN
LNA
IFOUT
RX MIXER
LNAIN
RXEN
TXEN
PADROUT
RXEN 6
POWER
MANAGEMENT
MAX2410
PA DRIVER
MAX2410
LO 7
22 IFIN
LO 8
21 IFOUT
20 GND
TXEN 9
LO
LO
TX MIXER
IFIN
VCC 10
19 TXMXOUT
GC 11
18 GND
GND 12
17 GND
PADROUT 13
16 PADRIN
GND 14
GC PADRIN
23 GND
15 GND
TXMXOUT
QSOP
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
MAX2410
________________General Description
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V
LNAIN Input Power.........................................................+15dBm
LO, LO Input Power........................................................+10dBm
PADRIN Input Power ......................................................+10dBm
RXMXIN Input Power ......................................................+10dBm
IFIN Input Power.............................................................+10dBm
RXEN, TXEN, GC Voltage...........................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
QSOP (derate 11mW/°C above +70°C) .......................909mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 5.5V, VGC = 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to VCC with 50Ω resistors, TXMXOUT pulled
up to VCC with 125Ω resistor, LNAOUT pulled up to VCC with 100Ω resistor, all other RF and IF inputs open, TA = -40°C to +85°C,
unless otherwise noted. Typical values are at TA = +25°C and VCC = 3.0V.)
PARAMETER
CONDITIONS
Supply Voltage Range
MIN
TYP
2.7
Digital Input Voltage High
RXEN, TXEN pins
Digital Input Voltage Low
RXEN, TXEN pins
RXEN Input Bias Current (Note 1)
RXEN = 2V
0.1
TXEN Input Bias Current (Note 1)
TXEN = 2V
GC Input Bias Current
GC = 3V, TXEN = 2V
Supply Current, Receive Mode
RXEN = 2V
Supply Current, Transmit Mode
Supply Current, Standby Mode
Supply Current, Shutdown Mode
MAX
UNITS
5.5
V
2.0
V
0.6
V
1
µA
0.1
1
µA
35
46
µA
20
29.5
mA
TXEN = 2V
30
44.5
mA
RXEN = 2V, TXEN = 2V
160
520
µA
VCC = 3V
0.1
10
µA
AC ELECTRICAL CHARACTERISTICS
(MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN =
1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω
environment. TA = +25°C, unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
14.2
12.6
16.2
17.4
19.1
dB
LOW-NOISE AMPLIFIER (RXEN = High)
Gain (Note 1)
TA = +25°C
TA = TMIN to TMAX
Noise Figure
Input IP3
(Note 2)
Output 1dB Compression
LO to LNAIN Leakage
RXEN = high or low
2.4
dB
-10
dBm
-5
dBm
-49
dBm
RECEIVE MIXER (RXEN = High)
Conversion Gain (Note 1)
TA = +25°C
TA = TMIN to TMAX
Noise Figure
Single sideband
9.8
dB
Input IP3
(Note 3)
3.3
dBm
Input 1dB Compression
8.3
9.8
10.8
-8
IFOUT Frequency
(Notes 1, 4)
Minimum LO Drive Level
(Note 5)
2
6.6
5.4
dBm
450
-17
_______________________________________________________________________________________
dB
MHz
dBm
Low-Cost RF Up/Downconverter
with LNA and PA Driver
(MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN =
1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω
environment. TA = +25°C, unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
TA = +25°C
8.6
10
TA = TMIN to TMAX
7.3
MAX
UNITS
TRANSMIT MIXER (TXEN = high)
Conversion Gain (Note 1)
Output IP3
(Note 6)
Output 1dB Compression Point
LO Leakage
Noise Figure
Single sideband
IFIN Frequency
(Notes 1, 4)
Intermod Spurious Response
(Note 7)
11.1
11.8
dB
-0.3
dBm
-11.4
dBm
-52
dBm
8.2
dB
450
MHz
fOUT = 2LO-2IF = 2.2GHz
-44
dBc
fOUT = 2LO-3IF = 1.8GHz
-74
dBc
fOUT = 3LO-6IF = 2.1GHz
-90
dBc
POWER AMPLIFIER DRIVER (TXEN = high)
TA = +25°C
Gain (Note 1)
TA = TMIN to TMAX
Output IP3
(Note 3)
13
15
12.3
16.4
17
dB
18
dBm
Output 1dB Compression Point
6.3
dBm
Gain-Control Range
35
dB
12
dB/V
Gain-Control Sensitivity
(Note 8)
LOCAL OSCILLATOR INPUTS (RXEN = TXEN = high)
Input Relative VSWR Normalized to
Standby-Mode Impedance
Receive (TXEN = Low)
1.10
Transmit (RXEN = Low)
1.02
POWER MANAGEMENT (RXEN = TXEN = low)
Receiver Turn-On Time
(Notes 1, 9)
0.5
2.5
µs
Transmitter Turn-On Time
(Notes 1, 10)
0.3
2.5
µs
Guaranteed by design and characterization.
Two tones at 1.9GHz and 1.901GHz at -32dBm per tone
Two tones at 1.9GHz and 1.901GHz at -22dBm per tone
Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the Typical Operating
Characteristics for graphs of IFIN and IFOUT Impedance vs. IF Frequency.
Note 5: At this LO drive level the mixer conversion gain is typically 1dB lower than with -10dBm LO drive.
Note 6: Two tones at 400MHz and 401MHz at -32dBm per tone.
Note 7: Transmit mixer output at -17dBm.
Note 8: Calculated from measurements taken at VGC = 1.0V and VGC = 1.5V.
Note 9: Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on LNAIN and LNAOUT.
Note 10: Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on PADRIN and PADROUT.
Note 1:
Note 2:
Note 3:
Note 4:
_______________________________________________________________________________________
3
MAX2410
AC ELECTRICAL CHARACTERISTICS (continued)
__________________________________________Typical Operating Characteristics
(MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN =
1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω
environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
VCC = 4.0V
32
30
VCC = 3.0V
28
VCC = 2.7V
26
VCC = 5.5V
22
VCC = 4.0V
21
20
19
VCC = 3.0V
18
VCC = 2.7V
0.06
0.05
0.04
35
60
85
400
0
-40
-15
10
35
60
300
VCC = 4.0V
200
0
60
40
0
RXEN = VCC
80
-40
60
-80
40
-120
1.0
TEMPERATURE (°C)
REAL
0.5
1.0
0
13
3.0
1.5
2.0
2.5
-125
3.0
LNA INPUT IP3 vs. TEMPERATURE
VCC = 5.5V
16
14
2.5
-100
FREQUENCY (GHz)
17
5
FREQUENCY (GHz)
-75
0
-5
RXEN = VCC
-6
VCC = 4.0V
15
2.0
100
0
INPUT IP3 (dBm)
10
1.5
-50
-7
LNA GAIN (dB)
15
1.0
150
3.0
MAX2410-08
MAX2410-07
RXEN = VCC
19
18
20
0.5
2.5
20
RXEN = VCC
0
2.0
-25
LNA GAIN vs. TEMPERATURE
1pF SHUNT CAPACITOR AT LNA INPUT
USING EV KIT MATCHING CIRCUIT (OPTIMIZED
FOR 1.9GHz)
25
1.5
0
IMAGINARY
FREQUENCY (GHz)
LNA GAIN vs. FREQUENCY
30
MAX2410-06
50
-200
0.5
85
200
-160
0
60
250
IMAGINARY
100
85
35
RXEN = VCC
0
35
10
LNA OUTPUT IMPEDANCE
vs. FREQUENCY
20
VCC = 2.7V
10
-15
TEMPERATURE (°C)
REAL
VCC = 3.0V
-15
-40
85
MAX2410-05
120
REAL IMPEDANCE (Ω)
VCC = 5.5V
-40
VCC = 3.0V
VCC = 2.7V
LNA INPUT IMPEDANCE
vs. FREQUENCY
RXEN = TXEN = 2.0V
100
VCC = 4.0V
0.02
TEMPERATURE (°C)
MAX2410-04
500
VCC = 5.5V
0.03
REAL IMPEDANCE (Ω)
10
STANDBY SUPPLY CURRENT
vs. TEMPERATURE
STANDBY SUPPLY CURRENT (µA)
0.07
0.01
IMAGINARY IMPEDANCE (Ω)
-15
TEMPERATURE (°C)
4
0.08
17
-40
RXEN = TXEN = GND
0.09
-8
-9
-10
VCC = 4.0V
-11
-12
VCC = 2.7V
VCC = 5.5V
-13
VCC = 3.0V
VCC = 3.0V
VCC = 2.7V
-14
-15
-40
-15
10
35
TEMPERATURE (°C)
60
85
-40
-20
0
20
40
60
TEMPERATURE (°C)
_______________________________________________________________________________________
80
100
IMAGINARY IMPEDANCE (Ω)
34
23
0.10
MAX2410-09
VCC = 5.5V
RXEN = VCC
SHUTDOWN SUPPLY CURRENT (µA)
36
24
MAX2410-02
TXEN = VCC
RECEIVE-MODE SUPPLY CURRENT (mA)
MAX2410-01
TRANSMIT-MODE SUPPLY CURRENT (mA)
38
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
RECEIVE-MODE SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-03
TRANSMIT-MODE SUPPLY CURRENT
vs. TEMPERATURE
LNA GAIN (dB)
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
Low-Cost RF Up/Downconverter
with LNA and PA Driver
(MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN =
1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω
environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
3.0
2.5
2.0
1.5
1.0
0.5
0
-2
-3
-4
480
860
1240
1620
2000
100
-50
80
-90
60
-130
-170
REAL
20
-210
0
2.7
3.2
3.7
4.2
4.7
-250
0
5.2
0.5
1.0
1.5
2.0
2.5
PA DRIVER OUTPUT IMPEDANCE
vs. FREQUENCY
PA DRIVER GAIN vs. FREQUENCY
PA DRIVER GAIN AND OUTPUT IP3
vs. GAIN-CONTROL VOLTAGE
-50
125
-100
100
-150
75
-200
50
-250
REAL
TXEN = VCC
20
10
5
-300
0
1.5
2.0
2.5
0.5
1.0
1.5
2.0
2.5
TXEN = VCC
17
PA DRIVER GAIN (dB)
18
VCC = 4.0V
VCC = 3.0V
VCC = 4.0V
15
VCC = 2.7V
14
15
13
14
12
40
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
PA DRIVER OUTPUT 1dB COMPRESSION
POINT vs. SUPPLY VOLTAGE
VCC = 5.5V
16
VCC = 2.7V
20
-20
3.0
VCC = 5.5V
60
TEMPERATURE (°C)
-15
GAIN-CONTROL VOLTAGE (V)
18
MAX2410-16
20
0
-10
PA DRIVER GAIN vs. TEMPERATURE
TXEN = VCC
-20
GAIN
FREQUENCY (GHz)
21
16
0
-5
-30
0
3.0
PA DRIVER OUTPUT IP3
vs. TEMPERATURE
17
IP3
5
-25
FREQUENCY (GHz)
19
10
80
100
VCC = 3.0V
8
MAX2410-18
1.0
TXEN = VCC
15
0
-350
0.5
15
20
OUTPUT 1dB COMPRESSION POINT (dBm)
25
25
GAIN (dB)
IMAGINARY
150
IMAGINARY IMPEDANCE (Ω)
0
3.0
MAX2410-15
USING EV KIT MATCHING NETWORK
(OPTIMIZED FOR 1.9GHz)
GAIN (dB) OR OUTPUT IP3 (dBm)
30
50
MAX2410-14
FREQUENCY (GHz)
175
REAL IMPEDANCE (Ω)
-10
SUPPLY VOLTAGE (V)
MAX2410-13
-40
IMAGINARY
120
40
-5
TXEN = VCC
0
30
FREQUENCY (MHz)
200
OUTPUT IP3 (dBm)
140
-6
100
70
TXEN = VCC
6
VGC = 2.15V
4
TXEN = VCC
2
0
-2
VGC = 1.0V
-4
-40
-15
10
35
TEMPERATURE (°C)
60
85
2.7
3.2
3.7
4.2
4.7
5.2
5.7
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
5
IMAGINARY IMPEDANCE (Ω)
3.5
-1
MAX2410-17
NOISE FIGURE (dB)
4.0
RXEN = VCC
MAX2410-12
160
REAL IMPEDANCE (Ω)
OUTPUT 1dB COMPRESSION POINT (dBm)
RXEN = VCC
MAX2410-11
0
MAX2410-10
5.0
4.5
PA DRIVER INPUT IMPEDANCE
vs. FREQUENCY
LNA OUTPUT 1dB COMPRESSION POINT
vs. SUPPLY VOLTAGE
LNA NOISE FIGURE vs. FREQUENCY
MAX2410
_____________________________Typical Operating Characteristics (continued)
_____________________________Typical Operating Characteristics (continued)
(MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN =
1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω
environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
25
5
4
20
15
10
5
-120
-140
REAL
-160
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
IF OUTPUT IMPEDANCE
vs. FREQUENCY
-300
600
-400
500
-500
400
-600
300
-700
200
100
200
300
400
500
600
2.0
2.5
FREQUENCY (GHz)
RECEIVE MIXER CONVERSION GAIN
vs. TEMPERATURE
RECEIVE MIXER INPUT IP3
vs. TEMPERATURE
VCC = 5.5V
8
VCC = 2.7V
7
-200
3.0
7
RXEN = VCC
6
VCC = 4.0V
VCC = 5.5V
5
4
3
VCC = 2.7V
VCC = 3.0V
2
1
5
0
-40
-15
10
35
60
85
-40
-20
0
20
40
60
80
100
TEMPERATURE (°C)
RECEIVE MIXER CONVERSION GAIN
vs. RF FREQUENCY
RECEIVE MIXER CONVERSION GAIN AND
NOISE FIGURE vs. LO POWER
TRANSMIT MIXER OUTPUT IMPEDANCE
vs. FREQUENCY
EV KIT MATCHING
NETWORK AT RXMXIN
AND IFOUT
2
RXEN = VCC
fIF = 400MHz
1.5
2.0
RF FREQUENCY (GHz)
2.5
3.0
MAX2410-26
12
NOISE FIGURE
11
10
9
8
GAIN
7
MAX2410-27
300
TXEN = VCC
250
REAL IMPEDANCE (Ω)
8
1.0
RXEN = VCC
GAIN AND NOISE FIGURE (dB)
10
13
MAX2410-25
NARROWBAND
MATCH AT RXMXIN,
EV KIT MATCH AT IFOUT
0.5
1.5
TEMPERATURE (°C)
12
0
1.0
FREQUENCY (MHz)
14
4
0.5
6
-1000
700
16
6
0.0
3.0
-900
0
0
2.5
GAIN-CONTROL VOLTAGE (V)
9
-800
REAL
100
2.0
INPUT IP3 (dBm)
-200
IMAGINARY
700
CONVERSION GAIN (dB)
800
1.5
RXEN = VCC
-100
IMAGINARY IMPEDANCE (Ω)
900
1.0
10
0
RXEN = VCC
0.5
MAX2410-23
MAX2410-21
1000
-180
MAX2410-24
0
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
-100
40
0
0
0
6
-80
50
10
0
-4
-60
60
20
1
-2
-40
IMAGINARY
70
30
3
2
-20
-25
200
IMAGINARY
-75
100
-100
-125
50
REAL
0
-50
5
-100
-8
-6
LO POWER (dBm)
-4
-2
0
-50
150
6
-18 -16 -14 -12 -10
0
-150
-175
0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
_______________________________________________________________________________________
2.5
-200
3.0
IMAGINARY IMPEDANCE (Ω)
6
REAL IMPEDANCE (Ω)
NOISE FIGURE (dB)
NOISE FIGURE (dB)
7
90
80
8
0
RXEN = VCC
IMAGINARY IMPEDANCE (Ω)
MAX2410-19
TXEN = VCC
TXEN = VCC
MAX2410-21
100
MAX2410-20
30
10
9
RECEIVE MIXER INPUT IMPEDANCE
vs. FREQUENCY
PA DRIVER NOISE FIGURE
vs. GAIN-CONTROL VOLTAGE
PA DRIVER NOISE FIGURE
vs. FREQUENCY
CONVERSION GAIN (dB)
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
Low-Cost RF Up/Downconverter
with LNA and PA Driver
(MAX2410 EV kit, VCC = 3.0V, VGC = 2.15V, RXEN = TXEN = low, fLO = 1.5GHz, PLO = -10dBm, fLNAIN = fPADRIN = fRXMXIN =
1.9GHz, PLNAIN = -32dBm, PPADRIN = PRXMXIN = -22dBm, fIFIN = 400MHz, PIFIN = -32dBm. All measurements performed in 50Ω
environment. TA = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
TXEN = VCC
TXEN = VCC
IMAGINARY
300
-600
200
-900
100
REAL
200
300
400
500
600
VCC = 2.7V
VCC = 3.0V
-1500
700
-40
-15
10
35
60
VCC = 3.0V
VCC = 2.7V
1.0
1.5.
2.0
2.5
3.0
3.5
LO PORT RETURN LOSS vs. FREQUENCY
MAX2410-32
0
5
RXEN = TXEN = VCC
10
TXEN = VCC
RETURN LOSS (dB)
-1.0
TXEN = VCC
0.5
10
9
8
EV KIT MATCHING NETWORK
4
RF FREQUENCY (GHz)
GAIN
GAIN AND NOISE FIGURE (dB)
-0.5
6
85
11
MAX2410-31
VCC = 4.0V
8
0
6
TRANSMIT MIXER GAIN AND NOISE FIGURE
vs. LO POWER
VCC = 5.5V
3GHz MATCH
2
TRANSMIT MIXER OUTPUT IP3
vs. TEMPERATURE
TXEN = VCC
OUTPUT IP3 (dBm)
9
TEMPERATURE (°C)
0.5
-1.5
10
FREQUENCY (GHz)
1.0
0
VCC = 4.0V
7
0
100
VCC = 5.5V
11
8
-1200
0
12
900MHz MATCH
10
CONVERSION GAIN (dB)
-300
CONVERSION GAIN (dB)
13
IMAGINARY IMPEDANCE (Ω)
REAL IMPEDANCE (Ω)
400
12
MAX2410-30
14
0
MAX2410-29
MAX2410-28
500
TRANSMIT MIXER CONVERSION GAIN
vs. RF FREQUENCY
TRANSMIT MIXER CONVERSION GAIN
vs. TEMPERATURE
MAX2410-33
IF INPUT IMPEDANCE
vs. FREQUENCY
NOISE FIGURE
15
20
25
30
7
35
-2.0
40
6
-40
-15
10
35
TEMPERATURE (°C)
60
85
-18 -16 -14 -12 -10 -8
-6
LO POWER (dBm)
-4
-2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
_______________________________________________________________________________________
7
MAX2410
_____________________________Typical Operating Characteristics (continued)
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
______________________________________________________________Pin Description
8
PIN
NAME
FUNCTION
1, 3, 4, 12,
14, 18, 20,
23, 28
GND
2
LNAIN
RF Input to the LNA. AC couple to this pin. At 1.9GHz, LNAIN can be easily matched to 50Ω with one
external shunt 1pF capacitor.
5, 10
VCC
Supply Voltage (2.7V to 5.5V). Bypass VCC to GND at each pin with a 47pF capacitor as close to each
pin as possible.
6
RXEN
Logic-Level Enable for Receiver Circuitry. A logic high turns on the receiver. When TXEN and RXEN are
both at a logic high, the part is placed in standby mode, with a supply current of 160µA (typical). If
TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a supply current of
0.1µA (typical).
7
LO
50Ω Local-Oscillator (LO) Input Port. AC couple to this pin.
8
LO
50Ω Inverting Local-Oscillator Input Port. For single-ended operation connect LO directly to GND. If a
differential LO signal is available, AC couple the inverted LO signal to this pin.
9
TXEN
11
GC
13
PADROUT
15, 17
GND
16
PADRIN
19
TXMXOUT
Ground. Connect to PC board ground plane with minimal inductance.
Logic-Level Enable for Transmitter Circuitry. A logic high turns on the transmitter. When TXEN and
RXEN are both at a logic high, the part is placed in standby mode, with 160µA (typical) supply current.
If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with 0.1µA (typical) supply
current.
Gain-Control Input for Power-Amplifier Driver. By applying an analog control voltage between 0V and
2.15V, the gain of the PA driver can be adjusted over a 35dB range. Connect to V CC for maximum gain.
Power-Amplifier Driver Output. AC couple to this pin. Use external shunt inductor to V CC to match this pin
to 50Ω. This also provides DC bias. See the Typical Operating Characteristics for a plot of PADROUT
Impedance vs. Frequency.
Power-Amplifier Driver Input Ground. Connect to PC board ground plane with minimal inductance.
RF Input to Variable-Gain Power-Amplifier Driver. AC couple to this pin. Internally matched to 50Ω. This
input typically provides a 2:1 VSWR at 1.9GHz. See the Typical Operating Characteristics for a plot of
PADRIN Impedance vs. Frequency.
RF Output of Transmit Mixer (Upconverter). AC couple to this pin. Use an external shunt inductor to
VCC as part of a matching network to 50Ω. This also provides DC bias. See the Typical Operating
Characteristics for a plot of TXMXOUT Impedance vs. Frequency.
IF Output of Receive Mixer (Downconverter). AC couple to this pin. This output is an open collector and
should be pulled up to VCC with an inductor. This inductor can be part of the matching network to the
desired IF impedance. Alternatively, a resistor can be placed in parallel to this inductor to set a terminating impedance. See the Typical Operating Circuit for more information.
21
IFOUT
22
IFIN
IF Input of Transmit Mixer (Upconverter). AC couple to this pin. IFIN presents a high input impedance
and typically requires a matching network. See the Typical Operating Characteristics for a plot of IFIN
Impedance vs. Frequency.
24
RXMXIN
RF Input to Receive Mixer (Downconverter). AC couple to this pin. This input typically requires a matching
network for connecting to an external filter. See the Typical Operating Characteristics for a plot of RXMXIN
Impedance vs. Frequency.
25
GND
Receive Mixer Input Ground. Connect to PC board ground plane with minimal inductance.
26
GND
LNA Output Ground. Connect to PC board ground plane with minimal inductance.
27
LNAOUT
LNA Output. AC couple to this pin. This output typically provides a VSWR of better than 2:1 at frequencies from 1.7GHz to 3GHz with no external matching components. At other frequencies, a matching
network may be required to match this pin to an external filter. Consult the Typical Operating
Characteristics for a plot of LNA Output Impedance vs. Frequency.
_______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
1
220pF
2
LNA
INPUT
GND
GND
LNAIN
LNAOUT
28
220pF
27
LNA
OUTPUT
1pF
3
4
GND
GND
GND
GND
VCC
RXMXIN
26
25
VCC
5
MAX2410
47pF
GND
220pF
7
LO
INPUT
IFIN
LO
24
3.9nH
220pF
82nH
1000pF
23
22
TX
MIXER
IFINPUT
VCC
8
1000pF
LO
68nH
ROPT
VCC
10
IFOUT
VCC
47pF
GND
VCC
GND
1000pF
GND
21
1000pF
68nH
20
50Ω RX
MIXER
IFOUTPUT
VCC
18
1000pF
17
18nH
PA
DRIVER
OUTPUT
RX
MIXER
RFINPUT
5.6nH
220pF
13
12
14
PADROUT
TXMXOUT
GND
PADRIN
GND
GND
TXEN
RXEN
9
6
_______________Detailed Description
The MAX2410 consists of five major components: a
transmit mixer, a variable-gain power-amplifier (PA)
driver, a low-noise amplifier (LNA), a receive mixer, and
power-management section.
The following sections describe each block in the
MAX2410 Functional Diagram.
19
16
15
3.9nH
220pF
220pF
TX
MIXER
RFOUTPUT
PA
DRIVER
INPUT
GC
11
Low-Noise Amplifier (LNA)
The LNA is a wideband, single-ended cascode amplifier that can be used over a wide range of frequencies
(refer to the LNA Gain vs. Frequency graph in the
Typical Operating Characteristics). Its port impedances
are optimized for operation around 1.9GHz, requiring
only a 1pF shunt capacitor at the LNA input for a VSWR
of better than 2:1 and a noise figure of 2.4dB. As with
every LNA, the input match can be traded off for better
noise figure.
_______________________________________________________________________________________
9
MAX2410
Typical Operating Circuit
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
PA Driver
The PA driver typically has 15dB of gain, which is
adjustable over a 35dB range via the GC pin. At full
gain, the PA driver has a noise figure of 3.5dB at
1.9GHz.
For input and output matching information, refer to the
Typical Operating Characteristics for plots of PA Driver
Input and Output Impedance vs. Frequency.
Receive Mixer
The receive mixer is a wideband, double-balanced
design with excellent noise figure and linearity. The
inputs to the mixer are the RF signal at the RXMXIN pin
and the LO inputs at LO and LO. The downconverted
output signal appears at the IFOUT port. The conversion gain of the receive mixer is typically 8.3dB with a
noise figure of 9.8dB.
RF Input
The RXMXIN input is typically connected to the LNA
output through an off-chip filter. This input is externally
matched to 50Ω. See the Typical Operating Circuit
for an example matching network and the RXMXIN
Impedance vs. Frequency graph in the Typical Operating
Characteristics.
Local-Oscillator Inputs
The LO and LO pins are internally terminated with 50Ω
on-chip resistors. AC couple the LO signal to these
pins. If a single-ended LO source is used, connect LO
directly to ground.
IF Output Port
The MAX2410’s receive mixer output appears at the
IFOUT pin, an open-collector output that requires an
external pull-up inductor to VCC. This inductor can be
part of a matching network to the desired IF impedance. Alternatively, a resistor can be placed in parallel
with the pull-up inductor to set a terminating impedance.
The MAX2411A, a similar part to the MAX2410, has the
same functionality as the MAX2410 but offers a differential, bidirectional (transmit and receive) IF port. This
allows sharing of TX and RX IF filters, which for some
applications provides a lower cost, smaller solution.
RF Output
The transmit mixer output appears on the TXMXOUT
pin. It is an open-collector output that requires an external pull-up inductor to VCC for DC biasing, which can
be part of an impedance-matching network. Consult
the Typical Operating Characteristics for a plot of
TXMXOUT Impedance vs Frequency.
IF Input
The IFIN pin is a self-biasing input that must be ACcoupled to the IF source. Refer to the Typical Operating
Characteristics for plots of Input and Output Impedance
vs. Frequency.
Local-Oscillator Inputs
The LO and LO pins are terminated with 50Ω on-chip
resistors. AC couple the LO signal to these pins. If a
single-ended LO source is used, connect LO directly to
GND.
Advanced System
Power Management
RXEN and TXEN are the two separate power-control
inputs for the receiver and the transmitter. If both inputs
are at logic 0, the part enters shutdown mode and the
supply current drops below 1µA. When one input is
brought to a logic 1, the corresponding function is
enabled. If RXEN and TXEN are both set to logic 1, the
part enters standby mode as described in the Standby
Mode section. Table 1 summarizes these operating
modes.
Power-down is guaranteed with a control voltage at or
below 0.6V. The power-down function is designed to
reduce the total power consumption to less than 1µA in
less than 2.5µs. Complete power-up will happen in the
same amount of time.
Table 1. Advanced System PowerManagement Functions
RXEN
TXEN
FUNCTION
0
0
Shutdown
0
1
Transmit
1
0
Receive
1
1
Standby Mode
Transmit Mixer
The transmit mixer takes an IF signal at the IFIN pin and
upconverts it to an RF frequency at the TXMXOUT pin.
The conversion gain is typically 10dB and the output
1dB compression point is typically -11.4dBm at
1.9GHz.
10
______________________________________________________________________________________
Low-Cost RF Up/Downconverter
with LNA and PA Driver
Applications Information
Extended Frequency Range
The MAX2410 has been characterized at 1.9GHz for use
in PCS-band applications; however, it operates over a
much wider frequency range. The LNA gain and noise
figure, as well as mixer conversion gain, are plotted over
a wide frequency range in the Typical Operating
Characteristics. When operating the device at RF frequencies other than those specified in the AC Electrical
Characteristics table, it may be necessary to design or
alter the matching networks on the RF ports. If the IF
frequency is different than that specified in the AC
Electrical Characteristics table, the IFIN and IFOUT
matching networks must be altered. The Typical
Operating Characteristics provide Port Impedance Data
vs. Frequency on all RF and IF pins for use in designing
matching networks. The LO port (LO and LO) is internally
terminated with 50Ω resistors and provides a VSWR of
approximately 1.2:1 to 2GHz and 2:1 up to 3GHz.
Layout Issues
A properly designed PC board is an essential part of
any RF/microwave circuit. Be sure to use controlled
impedance lines on all high-frequency inputs and outputs. Use low-inductance connections to ground on all
GND pins, and place decoupling capacitors close to all
VCC connections.
For the power supplies, a star topology works well. In a
star topology, each VCC node in the circuit has its own
path to the central VCC, and its own decoupling capacitor which provides a low impedance at the RF frequency of interest. The central V CC node has a large
decoupling capacitor as well, to provide good isolation
between the different sections of the MAX2410. The
MAX2410 EV kit layout can be used as a guide to integrating the MAX2410 into your design.
_________________________________________Typical Application Block Diagram
RF
BPF
MATCH
RX MIXER
LNA
LNAIN
IFOUT
ANTENNA
RF
BPF
T/R
RXEN
TXEN
RECEIVE
IFOUT
MATCH
IF
BPF
POWER
MANAGEMENT
LO
LOCAL
OSCILLATOR
LO
MAX2410
PA DRIVER
MATCH
RF
BPF
IFIN
PADROUT
TX MIXER
GC
RF
BPF
CBLOCK
TRANSMIT
IFIN
MATCH
IF
BPF
MATCH
______________________________________________________________________________________
11
MAX2410
Standby Mode
When the TXEN and RXEN pins are both set to logic 1,
all functions are disabled and the supply current drops
to 160µA (typical). This mode is called standby, and it
corresponds to a standby mode on the compatible IF
transceiver chips MAX2510 and MAX2511.
________________________________________________________Package Information
QSOP.EPS
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
12
______________________________________________________________________________________