MICREL MICRF003BM

MICRF003 / 033
QwikRadiotm 900 MHz UHF Receiver
Preliminary Information
General Description
The MICRF003 is a single chip OOK (ON-OFF Keyed) Receiver IC for
tm
remote wireless applications, employing Micrel’s latest QwikRadio
technology. This device is a true “antenna-in, data-out” monolithic device. All
RF and IF tuning is accomplished automatically within the IC, which
eliminates manual tuning, and reduces production costs. Receiver functions
are completely integrated. The result is a highly reliable yet extremely low
cost solution for high volume wireless applications. Because the MICRF003
is a true single-chip radio receiver, it is extremely easy to apply, minimizing
design and production costs, and improving time to market.
The MICRF003 provides two fundamental modes of operation, FIXED and
SWP.
In FIXED mode, the device functions like a conventional
Superheterodyne receiver, with an (internal) local oscillator fixed at a single
frequency based on an external reference crystal or clock. As with any
conventional superheterodyne receiver, the transmit frequency must be
accurately controlled, generally with a crystal or SAW (Surface Acoustic
Wave) resonator.
In SWP mode, the MICRF003 sweeps the (internal) local oscillator at rates
greater than the baseband data rate. This effectively “broadens” the RF
bandwidth of the receiver to a value equivalent to conventional superregenerative receivers. Thus the MICRF003 can operate with less
expensive LC transmitters without additional components or tuning, even
though the receiver topology is still superheterodyne. In this mode the
reference crystal can be replaced with a less expensive ± 0.5% ceramic
resonator.
Features
•
•
•
•
•
•
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Complete 900 MHz Band receiver on a monolithic IC
UHF Frequency range 800 to 1000 MHz
Typical range over 170 meters with monopole antenna
Data rates to 5kbps (SWP), 20kbps (FIXED)
Automatic tuning, no manual adjustment
No Filters or Inductors required
Low Operating Supply Current--4mA @ 868MHz
Shutdown Mode for Duty-Cycle Operation in excess of
100:1
•
Wakeup Function to Enable External Decoders and
Microprocessors
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Very low RF re-radiation at the antenna
CMOS logic interface to standard decoder and
microprocessor ICs
The MICRF003 provides two additional key features: (1) a Shutdown Mode,
which may be used for duty-cycle operation, and (2) a “Wakeup” function,
which provides a logical indication of an incoming RF signal. These features
make the MICRF003 ideal for low and ultra-low power applications, such as
RKE and RFID.
•
All post-detection (demodulator) data filtering is provided on the MICRF003,
so no external filters need to be designed. Any one of four filter bandwidths
may be selected externally by the user. Nominal filter bandwidths range in
binary steps, from 0.75kHz to 6kHz (SWP mode) or 2.8kHz to 22.4kHz
(FIXED mode). The user only needs to program the appropriate filter
selection based on data rate and code modulation format.
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Extremely low external part count
Applications
Automotive Remote Keyless Entry
Security Systems
Low Rate Data Modems
Remote Meter Data Collection
Typical Operating Circuit
915 MHz, 2400 bps OOK
ISM Band RECEIVER
Micrel Inc. • 1849 Fortune Drive San Jose, Ca 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • http://www.micrel.com
QwikRadio tm
MICRF003
Micrel
Ordering Information
Part Number
MICRF003BM
MICRF033BM
Temperature Range
-40°C to +105°C
-40°C to +105°C
Package
16-Pin SOIC
8-Pin SOIC
The standard 16-pin package provides the user with complete control of MICRF002 mode and filter selection. An 8-pin
standard part is also available for very low cost applications. The 8-pin version comes pre-programmed in SWP mode, with
Demodulator Filter bandwidth set to 5000Hz, and SHUT pin externally available. Other 8-pin configurations are available.
Contact the factory for details.
Pin Configuration (SOIC)
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Pin Description (Pin numbers for the 8-pin version are identified in parentheses)
Pin Number
Pin Name
1
SEL0
2/3
VSSRF
(1)
VSSRF
4
(2)
ANT
5
VDDRF
6
VDDBB
(3)
VDDRF
7
(4)
CTH
8
9
N/C
VSSBB
10
(5)
11
DO
SHUT
(6)
12
WAKEB
13
(7)
CAGC
14
SEL1
15
(8)
REFOSC
16
SWEN
SEL0
1
0
1
0
Pin Function
This pin, in conjunction with SEL1, programs the desired Demodulator Filter Bandwidth. This pin is internally
pulled-up to VDDRF. See Table 1.
This pin is the ground return for the RF section of the IC. The bypass capacitor connected from VDDRF to
VSSRF should have the shortest possible lead length. For best performance, connect VSSRF to VSSBB at the
power supply only (i.e., keep VSSBB currents from flowing through VSSRF return path).
This pin is the ground return for the IC. The bypass capacitor connected from VDDRF to VSSRF should have
the shortest possible lead length.
This is the receive RF input, internally ac-coupled. Connect this pin to the receive antenna. Input impedance is
high (FET gate) with approximately 2pF of shunt (parasitic) capacitance. For applications located in high
ambient noise environments, a fixed value band-pass network may be connected between the ANT pin and
VSSRF to provide additional receive selectivity and input overload protection. (See “Application Note TBD”.)
This pin is the positive supply input for the RF section of the IC. VDDBB and VDDRF should be connected
directly at the IC pins. Connect a low ESL, low ESR decoupling capacitor from this pin to VSSRF, as short as
possible.
This pin is the positive supply input for the baseband section of the IC. VDDBB and VDDRF should be
connected directly at the IC pins.
This pin is the positive supply input for the IC. Connect a low ESL, low ESR decoupling capacitor from this pin
to VSSRF, as short as possible.
This capacitor extracts the (DC) average value from the demodulated waveform, which becomes the reference
for the internal data slicing comparator. Treat this as a low-pass RC filter with source impedance of nominally
90kohms ( for REFOSC frequency Ft = 6.75MHz, see “Application Note TBD”). A standard ± 20% X7R
ceramic capacitor is generally sufficient.
Unused Pin
This is the ground return for the baseband section of the IC. The bypass and output capacitors connected to
VSSBB should have the shortest possible lead lengths. For best performance, connect VSSRF to VSSBB at
the power supply only (i.e., keep VSSBB currents from flowing through VSSRF return path).
The output data signal. CMOS level compatible.
A logic input for Shutdown Mode control. Pull this pin low to place the IC into operation. This pin in internally
pulled-up to VDDRF.
An output signal, active low when the IC detects an incoming RF signal, determined by monitoring for data
preamble. CMOS level compatible.
Integrating capacitor for on-chip AGC (Automatic Gain Control). The Decay/Attack time-constant (TC) ratio is
nominally set as 10:1. Use of 0.47uF or greater is strongly recommended for best range performance. Use
low-leakage type capacitors for duty-cycle operation (Dip Tantalum, Ceramic, Polyester). (See “Application Note
TBD.)
This pin, in conjunction with SEL0, programs the desired Demodulator Filter Bandwidth. This pin in internally
pulled-up to VDDRF. See Table 1.
This is the timing reference for on-chip tuning and alignment. Connect either a ceramic resonator or crystal
(mode dependent) between this pin and VSSBB, or drive the input with an AC coupled 0.5Vpp input clock. Use
ceramic resonators without integral capacitors. Note that if operating in FIXED mode, a crystal must be used;
however in SWP mode, one may use either a crystal or ceramic resonator. See “Application Note TBD” for
details on frequency selection and accuracy.
This logic pin controls the operating mode of the MICRF003. When SWEN = HIGH, the MICRF003 is in SWP
mode. When SWEN = LOW, the device operates as a conventional single-conversion superheterodyne
receiver. (See “Application Note TBD” for details.) This pin is internally pulled-up to VDDRF.
SEL1
1
1
0
0
Demodulator Bandwidth (Hz)
SWP Mode
6000
3000
1500
750
FIXED Mode
22400
11200
5600
2800
Table 1
Nominal Demodulator (Baseband) Filter Bandwidth
vs. SEL0, SEL1 and Mode
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ABSOLUTE MAXIMUM RATINGS
Operating Ratings
Supply Voltage (VDDRF, VDDBB)..................................+7V
Voltage on any I/O Pin.........................VSS-0.3 to VDD+0.3
Junction Temperature...............................................+150°C
Storage Temperature Range......................-65°C to + 150°C
Lead Temperature (soldering, 10 seconds)..............+ 260°C
Supply Voltage (VDDRF, VDDBB)....................4.75V to
5.5V
Ambient Operating Temperature (TA)..........-40°C to
+105°C
Package Thermal Resistance θja (8 Pin SOIC).....120°C/W
Package Thermal Resistance θja (16 Pin SOIC).....120°C/W
Electrical Characteristics
Unless otherwise stated, these specifications apply for Ta = -40°C to 105°C, 4.75<VDD<5.5V. All voltages are with respect
to Ground; Positive currents flow into device pins. CAGC = 4.7µF, CTH = .047µF, VDDRF = VDDBB = VDD. REFOSC
frequency = 6.75MHz.
Parameter
Test Conditions
MIN
TYP
MAX
UNITS
Power Supply
Operating Current
Operating Current
10:1 Duty Cycle
Standby Current
SHUT = VDD
4
mA
400
µA
µA
1
RF/IF Section
Receiver Sensitivity
Note 1, 3
-95
dBm
IF Center Frequency
Note 4
2.37
MHz
IF 3dB Bandwidth
Note 3, 4
1.18
MHz
Receive Data Rate
FIXED Mode, Manchester Encoded Data
Receive Data Rate
SWP Mode, Manchester Encoded Data
20
kbps
5
kbps
RF Input Range
800
1000
MHz
Receive Modulation Duty-Cycle
20
80
%
Maximum Receiver Input
Rs = 50Ω
-20
dBm
Spurious Reverse Isolation
ANT pin, Rs = 50Ω Note 2
30
µVrms
AGC Attack / Decay ratio
T(Attack) / T(Decay)
0.1
AGC Leakage Current
Ta = 85°C
Local Oscillator Stabilization Time
To 1% of Final Value
±200
nA
2.5
msec
Demod Section
CTH Source Impedance
Note 5
Ω
90k
CTH Source Impedance Variation
-15
+15
%
±200
nA
CTH Leakage Current
Ta = 85°C
Demod Filter Bandwidth
SEL0 = SEL1 = SWEN = VDD, Note 4, 6
5730
Hz
Demod Filter Bandwidth
SEL0 = SEL1 = VDD, SWEN = VSS,
Note 4, 6
21500
Hz
200k
Ω
8
µA
Digital/Control Section
REFOSC Input Impedance
Input Pullup Current
SEL0, SEL1, SWEN, SHUT=VSS
Input High Voltage
SEL0, SEL1, SWEN
Input Low Voltage
SEL0, SEL1, SWEN
Output Current
DO, WAKEUP pins, Push-Pull
Output High Voltage
DO, WAKEUP pins, Iout = -1µA
Output Low Voltage
DO. WAKEUP pins, Iout = +1µA
0.1VDD
V
Output Tr, Tf
DO, WAKEUP pins, Cload=15pF
5
µsec
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0.8VDD
0.2VDD
4
V
V
35
µA
0.9VDD
V
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MICRF003
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Micrel
Sensitivity is defined as the average signal level measured at the input necessary to achieve 10e-2 Bit Error Rate (BER). The input
signal is defined as a return-to-zero (RZ) waveform with 50% average duty cycle (e.g., Manchester Encoded Data) at a data rate of
600bps. The RF input is assumed to be matched into 50Ω.
Spurious reverse isolation represents the spurious components which appear on the RF input (ANT) pin measured into 50Ω with an
input RF matching network.
Sensitivity, a commonly specified Receiver parameter, provides an indication of the Receiver’s input referred noise, generally input
thermal noise. However, it is possible for a more sensitive receiver to exhibit range performance no better than that of a less
sensitive receiver, if the “ether” noise is appreciably higher than the thermal noise. “Ether” noise refers to other interfering “noise”
sources, such as FM radio stations, pagers, etc.
A better indicator of achievable receiver range performance is usually given by its Selectivity, often stated as Intermediate Frequency
(IF) or Radio Frequency (RF) bandwidth, depending on receiver topology. Selectivity is a measure of the rejection by the receiver of
“ether” noise. More selective receivers will almost invariably provide better range. Only when the receiver selectivity is so high that
most of the noise on the receiver input is actually thermal will the receiver demonstrate sensitivity-limited performance.
Parameter scales linearly with REFOSC frequency Ft. For any REFOSC frequency other than 6.75MHz, compute new parameter
value as the ratio [(REFOSC FREQ (in MHz)) / 6.75] * [Parameter Value @ 6.75MHz]. Example: For REFOSC Freq. Ft =
7.12MHz, [Parameter Value @ 7.12MHz] = (7.12 / 6.75) * [Parameter Value @ 6.75MHz].
Parameter scales inversely with REFOSC frequency Ft. For any REFOSC frequency other than 6.75MHz, compute new parameter
value as the ratio [6.75 / (REFOSC FREQ (in MHz))] * [Parameter Value @ 6.75MHz]. Example: For REFOSC Freq. Ft =
7.12MHz, [Parameter Value @ 7.12MHz] = (6.75 / 7.12) * [Parameter Value @ 6.75MHz].
Demod filter bandwidths are related in a binary manner, so any of the other (lower) nominal filter values may be derived simply by
dividing this parameter value by 2, 4, or 8 as desired.
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Typical Performance Characteristics
MICRF003 IDD vs Frequency
(Temperature=25°°C, VDD=5.0V, SWP Mode)
6.00
5.50
5.00
4.50
IDD(mA)
4.00
3.50
3.00
800
825
850
875
900
925
950
975
1000
Frequency (MHz)
MICRF003 IDD vs Temperature
(Frequency=868MHz, VDD=5.0V, SWP Mode)
7.00
6.50
6.00
5.50
5.00
IDD(mA)
4.50
4.00
3.50
3.00
2.50
-40
-20
0
20
40
60
80
100
120
Temperature (C)
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MICRF003 Block Diagram
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Functional Description
application for a super-regenerative receiver is also an
application for the MICRF003 in SWP mode.]
Please refer to “MICRF003 Block Diagram”. Identified in
the block diagram are the four principal functional blocks of
the IC, namely (1) UHF Downconverter, (2) OOK
Demodulator, (3) Reference and Control, and (4) Wakeup.
Also shown in the figure are two capacitors (CTH, CAGC)
and one timing component (CR), usually a ceramic
resonator. With the exception of a supply decoupling
capacitor, these are all the external components needed
with the MICRF003 to construct a complete UHF receiver.
Four control inputs are shown in the block diagram, SEL0,
SEL1, SWEN, and SHUT. Through these logic inputs the
user can control the operating mode and selectable features
of the IC. These inputs are CMOS compatible, and are
pulled-up on the IC.
For applications where the transmit frequency is accurately
set for other reasons (e.g., applications where a SAW
transmitter is used for its mechanical stability), the user
may choose to configure the MICRF003 as a standard
superheterodyne receiver (FIXED mode), mitigating the
aforementioned problem of a competing close-in signal.
This can be accomplished by tying SWEN to ground. Doing
so forces the on-chip LO frequency to a fixed value. In
FIXED mode, the ceramic resonator would be replaced with
a crystal. Generally, however, the MICRF003 can be
operated in SWP mode, using a ceramic resonator , with
either LC or CRYSTAL/SAW based transmitters, without
any significant range difference.
Input SWEN selects the operating mode of the IC (FIXED
mode or SWP mode). When low, the IC is in FIXED mode,
and functions as a conventional superheterodyne receiver.
When SWEN is high, the IC is in SWP mode. In this mode,
while the topology is still superheterodyne, the local
oscillator (LO) is deterministically swept over a range of
frequencies at rates greater than the data rate. When
coupled with a peak-detecting demodulator, this technique
effectively increases the RF bandwidth of the MICRF003, so
the device can operate in applications where significant
Transmitter/Receiver frequency misalignment may exist.
The inputs SEL0 and SEL1 control the Demodulator filter
bandwidth in four binary steps (750Hz-6000Hz in SWP,
2800Hz-22400Hz in FIXED mode), and the user must select
the bandwidth appropriate to his needs.
[Note: The swept LO technique does not affect the IF
bandwidth, so noise performance is not impacted relative to
FIXED mode. In other words, the IF bandwidth is the same
(1.18MHz) whether the device is in FIXED or SWP mode.]
Slicing Level and the CTH Capacitor
Due to limitations imposed by the LO sweeping process, the
upper limit on data rate in SWP mode is approximately
5kbps. Data rates beyond 20kbps are possible in FIXED
mode however.
Examples of SWP mode operation include applications
which utilize low-cost LC-based transmitters, whose
transmit frequency may vary up to ± 0.5% over initial
tolerance, aging, and temperature. In this (patent-pending)
mode, the LO frequency is varied in a prescribed fashion
which results in downconversion of all signals in a band
approximately 1.5% around the transmit frequency. So the
Transmitter may drift up to ± 0.5% without the need to
retune the Receiver, and without impacting system
performance. Such performance is not achieved with
currently available crystal-based superheterodyne receivers,
which can operate only with SAW or crystal based
transmitters.
[Note: In SWP mode only, a range penalty will occur in
installations where there exists a competing signal of
sufficient strength in this small frequency band of 1.5%
around the transmit frequency. This results from the fact
that sweeping the LO indiscriminantly “sweeps” all signals
within the sweep range down into the IF band. This same
penalty also exists with super-regenerative type receivers,
as their RF bandwidth is also generally 1.5%. So any
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Rolloff response of the IF Filter is 5th order, while the
demodulator data filter exhibits a 2nd order response.
Multiplication factor between the REFOSC frequency Ft and
the internal Local Oscillator (LO) is 129X for FIXED mode,
and 128.5X for SWP mode (i.e., for Ft = 6.75MHz in FIXED
mode, LO frequency = 6.75MHz * 129 = 870.75MHz).
Extraction of the DC value of the demodulated signal for
purposes of logic-level data slicing is accomplished by
external capacitor CTH and the on-chip switched-cap
“resistor” RSC, indicated in the block diagram.
The
effective resistance of RSC is 90kohms. The value of
capacitor CTH is easily calculated, once the slicing level
time-constant is chosen. Slicing Level time constant values
vary somewhat with decoder type, data pattern, and data
rate, but typical values range 5-50msec. Optimization of
the CTH value is required to maximize range, as discussed
in “Application Note TBD”.
During quiet periods (i.e., no signal transmissions) the Data
Output (DO pin) transitions randomly based on noise. This
may present problems for some decoders. The most
common solution is to introduce a small offset (“Squelch”)
on the CTH pin so that noise does not trigger the internal
comparator. Usually 20-30mV is sufficient, and may be
introduced by connecting a several-Megohm resistor from
the CTH pin to either VSS or VDD, depending on the
desired offset polarity. Since the MICRF003 is an AGC’d
receiver, noise at the internal comparator input is always
the same, set by the AGC.
So the squelch offset
requirement does not change as the local “ether” noise
changes from installation to installation.
Note that
introducing squelch will reduce range modestly, so only
introduce an amount sufficient to “quiet” the output.
AGC Function and the CAGC Capacitor
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The signal path has automatic gain control (AGC) to
increase input dynamic range. An external capacitor,
CAGC, must be connected to the CAGC pin of the device.
The ratio of decay-to-attack time-constant is fixed at 10:1
(i.e., the attack time constant is 1/10th the decay time
constant), and this ratio cannot be changed by the user.
However, the attack time constant is selectable by the user
through the value of capacitor CAGC.
[By adding resistance from the CAGC pin to VDDBB or
VSSBB in parallel with the CAGC capacitor, the ratio of
decay-to-attack time-constant may be varied, although the
value of such adjustments must be studied on a perapplication basis. Generally the design value of 10:1 is
adequate for the vast majority of applications.]
See
“Application Note TBD”.
To maximize system range, it is important to keep the AGC
control voltage ripple low, preferably under 10mVpp once
the control voltage has attained its quiescent value. For this
reason capacitor values ≥ 0.47uF are recommended.
The AGC control voltage is carefully managed on-chip to
allow duty-cycle operation of the MICRF003 in excess of
100:1. When the device is placed into SHUT mode (i.e.,
SHUT pin pulled high), the AGC capacitor is “floated”, to
retain the voltage. When operation is resumed, only the
voltage droop on the capacitor associated with leakage
must be replenished.
Thus a relatively low-leakage
capacitor is recommended for duty cycle operation. The
actual tolerable leakage will be application dependent.
Clearly, leakage performance is less critical when the
device off-time is low (milliseconds), and more critical when
the off-time is high (seconds).
To further enhance Duty-cycle operation of the IC, the AGC
push and pull currents are increased for a fixed time
immediately after the device is taken out of Shutdown mode
(i.e., turned-on). This compensates for AGC capacitor
voltage “droop” while the IC is in Shutdown, reduces the
time to reacquire the correct AGC voltage, and thus extends
maximum achievable duty ratios. Push/Pull currents are
increased by 45X their nominal values. The fixed time
period is based on the REFOSC frequency Ft, 9.7msec for
Ft = 6.75MHz, and varies inversely as Ft varies, by the
scale factor Ft / 6.75, where Ft is in MHz.
Reference Oscillator (REFOSC) and External Timing
Element
All timing and tuning operations on the MICRF003 are
derived from the REFOSC function. This function is a
single-pin Colpitts-type oscillator. The user may handle this
pin in one of three possible ways:
Micrel
system (e.g., a reference clock from a crystal or ceramic
resonator-based microprocessor). An externally applied
signal should be AC-coupled, and resistively-divided down
(or otherwise limited) to approximately 0.5Vpp. The specific
reference frequency required is related to the system
transmit frequency, and to the operating mode of the device
as set by the SWEN control pin. See “Application Note
TBD” for a discussion of frequency selection and accuracy
requirements.
Wakeup Function
The Wakeup function is made available for the purposes of
further reducing power consumption of the overall wireless
system. WAKEB is an output logic signal, which goes
active when the IC detects a constant RF Carrier “header” in
the demodulated output signal. Sense of the signal is
active-low. This output may be used to “wakeup” other
external circuits, like a data decoder or microprocessor,
only at times when there is a reasonable expectation of an
incoming RF signal. The Wakeup function is unavailable
when the IC is in SHUT mode.
The Wakeup function is composed of a resettable counter,
based on an internal 27.5kHz clock (based on a 7.04Mhz
reference frequency). To utilize this function, a burst of RF
Carrier in excess of 5msec must be placed at the start of
each data code word, or a single 5msec RF carrier tone at
the start of the data pattern (clearly the former is preferred
to improve communication reliability). When this constant
carrier tone is detected, without interruption, for 128 clock
cycles of 27.5kHz, WAKEB will transition low, and stay low
until data begins. This particular approach is utilized over
others (1) since constant tones in excess of 5msec are very
rare, leading to few false-positive indications, and (2) this
technique does not require the introduction of a signal path
offset, which impacts achievable range.
[Note: For designers who wish to use the Wakeup function
while “squelching” the output, a positive squelching offset
voltage must be used. This simply requires the squelch
resistor be taken to a voltage more positive than the
quiescent voltage on pin CTH, so that the data output is low
in absence of a transmission.]
Shutdown Function
The Shutdown function is controlled by the logic state of
SHUT. When SHUT is high, the device goes into low-power
standby mode, consuming less than 1µA. This pin is pulled
high internally, and so must be pulled low to engage the
device.
MICRF003 Frequency and Capacitor Selection
Selection of the REFOSC frequency Ft, Slicing Level (CTH)
capacitor, and AGC capacitor are briefly summarized in this
section. Please see Application Note TBD for complete
details.
(1) connect a ceramic resonator, or
(2) connect a crystal, or
(3) drive this pin with an external timing signal.
The third approach is attractive for further lowering system
cost if an accurate reference signal exists elsewhere in the
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Source impedance of the CTH pin is given by equation (4),
where Ft is in MHz:
1. Selecting REFOSC Frequency Ft (FIXED Mode)
As with any superheterodyne receiver, the difference
between the (internal) Local Oscillator (LO) frequency Flo
and the incoming Transmit frequency Ftx must ideally equal
the IF Center frequency. Equation (1) may be used to
compute the appropriate Flo for a given Ftx:
Flo = Ftx ± 2.496 * (Ftx / 915)
Rs = 90kΩ * (6.75 / Ft).
Assuming that a Slicing Level Timeconstant TC has been
established, capacitor CTH may be computed using
equation (5):
CTH = TC / Rs.
After choosing one of the two acceptable values of Flo, use
equation (2) to compute the REFOSC frequency Ft:
Ft = Flo / 129.
(2)
Here Ft is in MHz. Connect a crystal of frequency Ft to the
REFOSC pin of the MICRF003. 4 decimal-place accuracy
on the frequency is generally adequate. The following table
identifies Ft for some common Transmit frequencies when
the MICRF003 is operated in FIXED mode.
Selection of REFOSC frequency Ft in SWP mode is much
simpler than in FIXED mode, due to the LO sweeping
process. Further, accuracy requirements of the frequency
reference component are significantly relaxed.
In SWP mode, Ft is given by equation (3):
(3)
Connect a ceramic resonator of frequency Ft to the
REFOSC pin of the MICRF003. 2-decimal place accuracy
is generally adequate. (A crystal may also be used if
desired, but may be necessary to reduce the Rx frequency
ambiguity if the Tx frequency ambiguity is excessive. See
Application Note TBD for further details.)
3. Selecting Capacitor CTH
First step in the process is selection of a Data Slicing Level
timeconstant. This selection is strongly dependent on
system issues, like system decode response time and data
code structure (e.g., existance of data preamble, etc.). This
issue is too broad to discuss here, and the interested reader
should consult the Application Note TBD.
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4. Selecting CAGC Capacitor in Continuous Mode
Selection of CAGC in continuous mode is dictated by
minimizing the ripple on the AGC control voltage, by using a
sufficiently large capacitor. It is Micrel’s experience that
CAGC should be in the vicinity of 0.47µF to 4.7µF. Large
capacitor values should be carefully considered, as this
determines the time required for the AGC control voltage to
settle from a completely discharged condition. AGC settling
time from a completely discharged (0-volt) state is given
approximately by equation (6):
∆T = (1.333 * CAGC) – 0.44
(6)
5. Selecting CAGC Capacitor in Duty-Cycle Mode
6.7470
7.1124
Selecting REFOSC Frequency Ft (SWP Mode)
Ft = Ftx / 128.5.
(5)
where CAGC is in microfarads, and ∆T is in seconds.
REFOSC Freq. Ft (MHz)
868
915
2.
(4)
(1)
where Ftx and Flo are in MHz. Note that two values of Flo
exist for any given Ftx, distinguished as “high-side mixing”
and “low-side mixing”, and there is generally no preference
of one over the other.
Transmit Freq. Ftx (MHz)
Micrel
10
Generally, droop of the AGC control voltage during
shutdown should be replenished as quickly as possible after
the IC is “turned-on”. Recall from the section “AGC
Function and the CAGC Capacitor” that for about 10msec
after the IC is turned-on, the AGC push-pull currents are
increased to 45X their normal values. So consideration
should be given to selecting a value for CAGC and a
shutdown time period such that the droop can be
replenished within this 10msec period.
Polarity of the droop is unknown, meaning the AGC voltage
could droop up or down. Worst-case from a recovery
standpoint is downward droop, since the AGC pullup current
is 1/10th magnitude of the pulldown current. The downward
droop is replenished according the the well-known equation
(7):
I / CAGC = ∆V / ∆T
(7)
where I = AGC Pullup current for initial 10msec (67.5µA),
CAGC is the AGC capacitor value, ∆T = Droop recovery
time (<10msec), and ∆V is the droop voltage.
For example, if user desires ∆T = 10msec, and chooses a
4.7µF CAGC, then the allowable droop is about 144mV.
Using the same equation with 200nA worst case pin
leakage and assuming 1uA of capacitor leakage in the
same direction, the maximum allowable ∆T (Shutdown
time) is about 0.56 seconds, for droop recovery in 10msec.
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I/O Pin Interface Circuitry
3. CAGC Pin
Interface circuitry for the various I/O pins of the MICRF003
is shown in Figures 1 through 6. Specific information
regarding each of these circuits is discussed in the following
sub-paragraphs. Not shown are ESD protection diodes
which are applied to all input and output pins.
Figure 3 illustrates the CAGC pin interface circuit. The
AGC control voltage is developed as an integrated current
into a capacitor CAGC. The attack (pulldown) current is
nominally 15µA, while the decay (pullup) current is a 1/10th
scaling of this, nominally 1.5µA, so the attack/decay
timeconstant ratio is fixed at 10:1. Signal gain of the RF/IF
strip inside the IC diminishes as the voltage on CAGC
decreases. Further discussion on setting the attack time
constant is found in “Application Note TBD. Modification of
the attack/decay ratio is possible by adding resistance from
CAGC pin either to VDDBB or VSSBB, as desired. Both the
Push and Pull current sources are disabled during SHUT,
which holds the voltage across CAGC, and improves
recovery time in duty-cycled applications.
To further
improve duty cycle recovery, both Push and Pull currents
are increased by 45X for approximately 10msec after
release of SHUT. This allows rapid recovery of any voltage
droop on CAGC while in SHUT.
Figure 1 ANT Pin
4. DO and WAKEB Output Pins
The output stage for the signals DO and WAKEB is shown
in Figure 4. The output is a 35µA push-35µA pull, switched
current stage. Such an output stage is capable of driving
CMOS-type loads.
An external buffer-driver is
recommended for driving high capacitance loads.
1. ANT Pin
The ANT pin is internally AC-coupled via a 3pF capacitor, to
an RF N-channel MOSFET, as shown in Figure 1.
Impedance on this pin to VSS is quite high at low
frequencies, and decreases as frequency increases. In the
UHF frequency range, the device input can be modeled as
6.3kΩ in parallel with 2pF (pin capacitance) shunt to
VSSRF.
2. CTH Pin
Figure 2 illustrates the CTH pin interface circuit. CTH pin is
driven from a P-channel MOSFET source-follower biased
with approximately 10µA of bias current. Transmission
gates TG1 and TG2 isolate the 6.9pF capacitor. Internal
control signals PHI1/PHI2 are related in a manner such that
the impedance across the transmission gates looks like a
“resistance” of 90kohms. The DC potential on the CTH pin
is approximately 1.6V.
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11
5. REFOSC Pin
The REFOSC input circuit is shown in Figure 5. Input
impedance is quite high (200kΩ). This is a Colpitts
oscillator, with internal 30pF capacitors. This input is
intended to work with standard ceramic resonators,
connected from this pin to VSSBB, although a crystal may
be used instead, where greater frequency accuracy is
required.
The resonators should not contain integral
capacitors, since these capacitors are contained inside the
IC. Externally applied signals should be AC-coupled,
amplitude limited to approximately 0.5Vpp. The nominal
DC bias voltage on this pin is 1.4V.
6. Control Inputs (SEL0, SEL1, SWEN, SHUT)
Control input circuitry is shown in Figures 6a and 6b. The
standard input is a logic inverter constructed with minimum
geometry MOSFETs (Q2, Q3). P-channel MOSFET Q1 is a
large channel length device which functions essentially as a
“weak” pullup to VDDBB. Typical pullup current is 5µA,
leading to an impedance to the VDDBB supply of typically
1MΩ.
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MICRF003
Figure 2 CTH Pin
Figure 3 CAGC Pin
Figure 5 REFOSC Pin
Figure 4 DO and WAKEB Pins
Figure 6b SHUT
Figure 6a SEL0, SEL1, SWEN
October 1999
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12
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Micrel
Typical Application
Figure 7 below illustrates a typical application for the MICRF003 UHF Receiver IC. Operation in this example is at 915MHz,
and may be customized by selection of the appropriate reference frequency (CR1), and adjustment of the antenna length.
The value of C4 would also change, if the optional input filter is used. Changes from the 1kbps data rate may require a
change in the value of R1. The Bill of Materials is shown in the accompanying chart.
Figure 7
915MHz, 1kbps OOK Receiver/Decoder
SWP Mode, Continuous Operation
6-Bit Address Decode/2 OP Codes
Bill of Materials
Item
U1
U2
CR1
D1
R1
R2
C1
C3
C2
C4
Part Number
MICRF003
HT-12D
CSA7.12MG
SSF-LX100LID
Manufacturer
Micrel
Holtek
Murata
Lumex
Bourns
Bourns
Panasonic
Panasonic
Panasonic
Panasonic
Vendor
Bourns
Holtek
Lumex
Murata
Panasonic
October1999
Description
UHF Receiver
Logic decoder
7.12MHz Cer. Res.
RED LED
68k, 1/4W ,5%
1k,1/4W, 5%
4.7µF, Dip Tant. Cap
0.47µF, Dip Tant. Cap
2.2µF, Dip Tant. Cap
3.0 pF, COG Cer. Cap
Telephone
(909) 781-5500
(408) 894-9046
(800) 278-5666
(800) 241-6574
(201) 348-7000
13
Fax
(909) 781-5273
(408) 894-0838
(847) 359-8904
(770) 436-3030
(201) 348-8164
MICRF003
MICRF003
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Micrel
MICRF003
MICRF003
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Micrel
MICRF003
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MICRF003
Micrel
MICREL INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL
+ 1 (408) 944-0800
FAX
+ 1 (408) 944-0970
WEB
http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or other rights
of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel Inc. This is preliminary
information and a final specification has not been completed. Before making any final design determination, consult with Micrel for final specifications.
©1999 Micrel Incorporated
October1999
16
MICRF003