MITSUBISHI RM50HG-12S

MITSUBISHI FAST RECOVERY DIODE MODULES
RM50HG-12S
HIGH SPEED SWITCHING USE
NON-INSULATED TYPE
B
F
D
A
G - DIA.
K
L
H
C
J
Description:
Mitsubishi Super Fast Recovery
Diodes are designed for use in
applications requiring fast
switching.
Features:
2
1
3
u Non-Isolated Package
M
N
E
u Planar Chips
u trr = 200ns Max.
E
Applications:
u Snubber Circuits
1
3
Ordering Information:
Example: Select the complete part
number from the table below -i.e.
RM50HG-12S is a 600V,
50 Ampere Super Fast Recovery
Single Diode Module.
2
4
Outline Drawing and Circuit Diagram
Dimension
Inches
Millimeters
Dimension
Inches
Millimeters
A
1.102±0.02
26.0±0.5
H
0.12±0.012
3.0±0.3
B
0.81 Max.
20.5 Max.
J
0.10±0.012
2.5±0.3
C
0.79 Min.
20.0 Min.
K
0.10
2.5
D
0.24±0.008
6.0±0.2
L
0.08±0.012
2.0±0.3
E
0.214±0.012
5.45±0.3
M
0.04±0.008
1.0±0.2
0.20±0.012
5.0±0.3
N
0.02±0.008
0.6±0.2
F
G
Type
Current Rating
Amperes
Voltage
Volts (x 50)
RM
50
12
0.214±0.012 Dia. Dia. 3.2±0.2
Sep.1998
MITSUBISHI FAST RECOVERY DIODE MODULES
RM50HG-12S
HIGH SPEED SWITCHING USE
NON-INSULATED TYPE
Absolute Maximum Ratings, Tj = 25°C unless otherwise specified
Ratings
Symbol
RM50HG-12S
Units
Peak Reverse Blocking Voltage (Repetitive)
VRRM
600
Volts
Peak Reverse Blocking Voltage (Non-Repetitive)
VRSM
720
Volts
DC Reverse Blocking Voltage
VR(DC)
480
Volts
DC Current, TC = 80°C (Resistive Load)
IF(DC)
50
Amperes
Peak Half-Cycle Surge (Non-Repetitive) On-State Current (60Hz)
IFSM
1000
Amperes
Storage Temperature
Tstg
-40 to +125
°C
Operating Temperature
Tj
-40 to +150
°C
Maximum Mounting Torque M3 Mounting Screw
—
0.59 ~ 0.98
N·m
Module Weight (Typical)
—
10
Grams
Electrical and Thermal Characteristics, T j = 25°C unless otherwise specified
Characteristics
Symbol
Test Conditions
Max.
Units
IRRM
VRRM applied, Tj = 25°C
0.1
mA
VRRM applied, Tj = 125°C
1.0
mA
Tj = 25°C, IFM = 200A
4.0
Volts
IFM = 200A, Tj = 150°C
0.2
µs
Blocking State Maximums
Reverse Leakage Current, Peak
Conducting State Maximums
Forward Voltage Drop
VFM
Switching Minimums
Reverse Recovery Time
trr
di/dt = -1000A/µs, VR = 300V
Lead Integrity
—
Tension Load: 2.5 kg
30.0
s
—
Bending Load: 1 kg bent to 90°
2.0
times
Thermal Maximums
Junction to Case Thermal Resistance
Rth(j-c)
Junction to case
0.5
°C/Watt
Contact Thermal Resistance
Rth(c-f)
Case to Fin, Thermal Grease Applied
0.5
°C/Watt
*Maximum ratings unless otherwise specified
o
FORWARD CURRENT, IF, (AMPERES)
Tj = 25 C
102
101
1.0
2.0
3.0
4.0
5.0
FORWARD VOLTAGE DROP, VF, (VOLTS)
6.0
101
0.5
1000
0.4
800
SURGE FORWARD CURRENT (A)
TRANSIENT THERMAL IMPEDANCE, Zth (j-c), (°C/W)
100
103
RATED SURGE (NON-REPETITIVE)
FORWARD CURRENT
MAXIMUM TRANSIENT THERMAL IMPEDANCE
CHARACTERISTIC (JUNCTION TO CASE)
MAXIMUM FORWARD CHARACTERISTIC
0.3
0.2
0.1
0
10-3
10-2
10-1
TIME (S)
100
600
400
200
0
100
101
102
CYCLES (60Hz)
Sep.1998