Order this document by MBRF745/D SEMICONDUCTOR TECHNICAL DATA The SWITCHMODE Power Rectifier employs the Schottky Barrier principle in a large area metal–to–silicon power diode. State–of–the–art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use as rectifiers in very low–voltage, high–frequency switching power supplies, free wheeling diodes and polarity protection diodes. • • • • • • • • • Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop High Junction Temperature Capability High dv/dt Capability Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection Epoxy Meets UL94, VO at 1/8″ Electrically Isolated. No Isolation Hardware Required. UL Recognized File #E69369(1) 1 Motorola Preferred Device SCHOTTKY BARRIER RECTIFIER 7.5 AMPERES 45 VOLTS 2 Mechanical Characteristics • Case: Epoxy, Molded • Weight: 1.9 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Marking: B745 1 2 CASE 221E–01 ISOLATED TO–220 MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 45 Volts Average Rectified Forward Current (Rated VR), TC = 105°C IF(AV) 7.5 Amps Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 105°C IFRM 15 Amps Non–repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) Operating Junction and Storage Temperature Voltage Rate of Change (Rated VR) RMS Isolation Voltage (t = 1 second, R.H. ≤ 30%, TA = 25°C)(2) Per Figure 3 Per Figure 4(1) Per Figure 5 IRRM 1.0 Amp TJ, Tstg – 65 to +150 °C dv/dt 10000 V/µs Viso1 Viso2 Viso3 4500 3500 1500 Volts RθJC 4.2 °C/W TL 260 °C THERMAL CHARACTERISTICS Maximum Thermal Resistance, Junction to Case Lead Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds (1) UL Recognized mounting method is per Figure 4. (2) Proper strike and creepage distance must be provided. SWITCHMODE is a trademark of Motorola, Inc. Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 Device Rectifier Motorola, Inc. 1996 Data 1 MBRF745 ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (3) (iF = 15 Amp, TC = 25°C) (iF = 15 Amp, TC = 125°C) (iF = 7.5 Amp, TC = 125°C) vF Maximum Instantaneous Reverse Current (3) (Rated DC Voltage, TC = 25°C) (Rated DC Voltage, TC = 125°C) iR Max Unit Volts 0.84 0.72 0.57 mA 0.1 15 100 50 30 TJ = 150°C TJ = 125°C 20 10 7 5 75°C 3 25°C 2 1 0.7 0.5 0.2 0.4 0.6 0.8 1 iF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage 2 I R, REVERSE CURRENT (mA) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) (3) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0% 1.2 10 125°C 100°C 1 75°C 0.1 25°C 0.01 0.001 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 50 Figure 2. Typical Reverse Current Rectifier Device Data MBRF745 TEST CONDITIONS FOR ISOLATION TESTS* CLIP MOUNTED FULLY ISOLATED PACKAGE CLIP MOUNTED FULLY ISOLATED PACKAGE LEADS HEATSINK 0.107″ MIN MOUNTED FULLY ISOLATED PACKAGE LEADS LEADS HEATSINK HEATSINK 0.107″ MIN 0.110″ MIN Figure 3. Clip Mounting Position for Isolation Test Number 1 Figure 4. Clip Mounting Position for Isolation Test Number 2 Figure 5. Screw Mounting Position for Isolation Test Number 3 * Measurement made between leads and heatsink with all leads shorted together. MOUNTING INFORMATION** 4–40 SCREW CLIP PLAIN WASHER HEATSINK COMPRESSION WASHER HEATSINK NUT 6a. Screw–Mounted 6b. Clip–Mounted Figure 6. Typical Mounting Techniques Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions. **For more information about mounting power semiconductors see Application Note AN1040. Rectifier Device Data 3 MBRF745 PACKAGE DIMENSIONS SEATING PLANE –T– –B– F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. C DIM A B C D F G H J K L N Q R S U S Q U A 1 2 3 H –Y– K G N L J R M B M MILLIMETERS MIN MAX 15.78 15.97 10.01 10.21 4.60 4.80 0.67 0.86 3.08 3.27 2.54 BSC 3.13 3.27 0.46 0.64 12.70 14.27 1.14 1.52 5.08 BSC 3.21 3.40 2.72 2.81 2.44 2.64 6.58 6.78 STYLE 1: PIN 1. CATHODE 2. N/A 3. ANODE D 2 PL 0.25 (0.010) INCHES MIN MAX 0.621 0.629 0.394 0.402 0.181 0.189 0.026 0.034 0.121 0.129 0.100 BSC 0.123 0.129 0.018 0.025 0.500 0.562 0.045 0.060 0.200 BSC 0.126 0.134 0.107 0.111 0.096 0.104 0.259 0.267 Y CASE 221E–01 ISSUE O Motorola reserves the right to make changes without further notice to any products herein. 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