MOTOROLA MC14008B

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 620
The MC14008B 4–bit full adder is constructed with MOS P–channel and
N–channel enhancement mode devices in a single monolithic structure. This
device consists of four full adders with fast internal look–ahead carry output.
It is useful in binary addition and other arithmetic applications. The fast
parallel carry output bit allows high–speed operation when used with other
adders in a system.
P SUFFIX
PLASTIC
CASE 648
•
•
•
•
•
Look–Ahead Carry Output
Diode Protection on All Inputs
All Outputs Buffered
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4008B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Parameter
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, lout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature (8–Second Soldering)
260
_C
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
BLOCK DIAGRAM
HIGH–SPEED
PARALLEL CARRY
B4 15
A4
1
14 Cout
ADDER
4
13 S4
C4
B3
2
A3
3
B2
4
A2
5
B1
6
A1
7
Cin
9
ADDER
3
12 S3
C3
ADDER
2
11 S2
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
TRUTH TABLE
(One Stage)
Cin
B
A
Cout
S
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
1
0
1
1
0
1
1
1
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
PIN ASSIGNMENT
A4
1
16
VDD
B3
2
15
B4
A3
3
14
Cout
B2
4
13
S4
A2
5
12
S3
B1
6
11
S2
A1
7
10
S1
VSS
8
9
Cin
C2
ADDER
1
10 S1
VDD = PIN 16
VSS = PIN 8
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14008B
37
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
Output Voltage
Vin = VDD or 0
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
Vin = 0 or VDD
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
Vdc
mAdc
IT = (1.7 µA/kHz) f + IDD
IT = (3.4 µA/kHz) f + IDD
IT = (5.0 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
MC14008B
38
MOTOROLA CMOS LOGIC DATA
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Sum in to Sum Out
tPLH, tPHL = (1.7 ns/pF) CL + 315 ns
tPLH, tPHL = (0.66 ns/pF) CL + 127 ns
tPLH, tPHL = (0.5 ns/pF) CL + 90 ns
Sum In to Carry Out
tPLH, tPHL = (1.7 ns/pF) CL + 220 ns
tPLH, tPHL = (0.66 ns/pF) CL + 112 ns
tPLH, tPHL = (0.5 ns/pF) CL + 85 ns
Carry In to Sum Out
tPLH, tPHL = (1.7 ns/pF) CL + 290 ns
tPLH, tPHL = (0.66 ns/pF) CL + 122 ns
tPLH, tPHL = (0.5 ns/pF) CL + 90 ns
Carry In to Carry Out
tPLH, tPHL = (1.7 ns/pF) CL + 85 ns
tPLH, tPHL = (0.66 ns/pF) CL + 42 ns
tPLH, tPHL = (0.5 ns/pF) CL + 30 ns
VDD
Vdc
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
tPLH, tPHL
ns
5.0
10
15
—
—
—
400
160
115
800
320
230
5.0
10
15
—
—
—
305
145
110
610
290
220
5.0
10
15
—
—
—
375
155
115
750
310
230
5.0
10
15
—
—
—
170
75
55
340
150
110
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD = – VGS
VDD = VGS
Vout
16
16
B4
A4
B3
A3
B2
A2
S4
B1
A1
Cin
S1
8
S3
S2
IOH
Cout
VSS
EXTERNAL
POWER
SUPPLY
Figure 1. Typical Source Current
Characteristics Test Circuit
MOTOROLA CMOS LOGIC DATA
Vout
B4
A4
B3
A3
B2
A2
S4
B1
A1
Cin
S1
8
S3
S2
IOL
Cout
VSS
EXTERNAL
POWER
SUPPLY
Figure 2. Typical Sink Current
Characteristics Test Circuit
MC14008B
39
VDD
16
20 ns
Vin
20 ns
90%
10%
VDD
VSS
PULSE
GENERATOR
B4
A4
B3
A3
B2
A2
S4
B1
A1
Cin
S1
Cout
8
VSS
S3
S2
CL
CL
CL
CL
CL
IDD
500 µF
Figure 3. Dynamic Power Dissipation Test Circuit and Waveform
VDD
16
B4
A4
B3
A3
B2
A2
B1
A1
PULSE
GENERATOR
Cin
8
S4
S3
S2
CL
S1
CL
CL
Cout
CL
CL
VSS
IDD
20 ns
Cin
20 ns
VDD
90%
50%
10%
VSS
tPHL
90%
50%
10%
S1 – S4
tPLH
VOH
VOL
tTHL
tTLH
VOH
Cout
50%
VOL
tPLH
tPHL
Figure 4. Switching Time Test Circuit and Waveforms
MC14008B
40
MOTOROLA CMOS LOGIC DATA
Cout
B4
S4
A4
B3
S3
A3
B2
S2
A2
B1
S1
A1
Cin
Figure 5. Logic Diagram
MOTOROLA CMOS LOGIC DATA
MC14008B
41
TYPICAL APPLICATION
WORD A + B INPUTS
A1
B4
CHIP
1
Cin
S1
Cout
S4
A1
Cin
S1
B4
CHIP
2
Cout
S4
A1
Cin
S1
B4
CHIP
3
Cout
S4
A1
Cin
B4
CHIP
4
S1
Cout
S4
SUM OUTPUTS
Calculation of 16–bit adder speed:
tP total = tP (Sum to Carry) + tP (Carry to Sum) + 2 tP (Carry to Carry)
The guaranteed 16–bit adder speed at 10 V, 25°C, CL = 50 pF is:
tp total = 290 + 310 + 300 = 900 ns
Figure 6. Using the MC14008B in a 16–Bit Adder Configuration
MC14008B
42
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA CMOS LOGIC DATA
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14008B
43
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MC14008B
44
◊
*MC14008B/D*
MOTOROLA CMOS LOGIC
DATA
MC14008B/D