MOTOROLA MC14532

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 620
The MC14532B is constructed with complementary MOS (CMOS)
enhancement mode devices. The primary function of a priority encoder is to
provide a binary address for the active input with the highest priority. Eight
data inputs (D0 thru D7) and an enable input (Ein) are provided. Five outputs
are available, three are address outputs (Q0 thru Q2), one group select (GS)
and one enable output (Eout).
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–power TTL Loads or One Low–Power
Schottky TTL Load over the Rated Temperature Range
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Parameter
Symbol
VDD
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, Iout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
Tstg
Storage Temperature
TL
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
500
mW
– 65 to + 150
_C
260
_C
Lead Temperature (8–Second Soldering)
PIN ASSIGNMENT
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
D4
1
16
VDD
D5
2
15
Eout
D6
3
14
GS
TRUTH TABLE
D7
4
13
D3
Ein
5
12
D2
Input
Ein
D7
D6
D5
D4
Output
D3
D2
D1
D0
GS
Q2
Q1
Q0
Eout
0
1
X
0
X
0
X
0
X
0
X
0
X
0
X
0
X
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
X
1
0
0
X
X
1
0
X
X
X
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
1
1
1
1
1
1
0
0
1
0
1
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
X
1
0
0
X
X
1
0
X
X
X
1
1
1
1
1
0
0
0
0
1
1
0
0
1
0
1
0
0
0
0
0
Q2
6
11
D1
Q1
7
10
D0
VSS
8
9
Q0
X = Don’t Care
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14532B
1
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (1.74 µA/kHz) f + IDD
IT = (3.65 µA/kHz) f + IDD
IT = (5.73 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
ā
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.
MC14532B
2
MOTOROLA CMOS LOGIC DATA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time — Ein to Eout
tPLH, tPHL = (1.7 ns/pF) CL + 120 ns
tPLH, tPHL = (0.66 ns/pF) CL + 77 ns
tPLH, tPHL = (0.5 ns/pF) CL + 55 ns
tPLH,
tPHL
Propagation Delay Time — Ein to GS
tPLH, tPHL = (1.7 ns/pF) CL + 90 ns
tPLH, tPHL = (0.66 ns/pF) CL 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 40 ns
tPLH,
tPHL
Propagation Delay Time — Ein to Qn
tPLH, tPHL = (1.7 ns/pF) CL + 195 ns
tPLH, tPHL = (0.66 ns/pF) CL + 107 ns
tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPHL,
tPLH
Propagation Delay Time — Dn to Qn
tPLH, tPHL = (1.7 ns/pF) CL + 265 ns
tPLH, tPHL = (0.66 ns/pF) CL + 137 ns
tPLH, tPHL = (0.5 ns/pF) CL + 85 ns
tPLH,
tPHL
Propagation Delay Time — Dn to GS
tPLH, tPHL = (1.7 ns/pF) CL + 195 ns
tPLH, tPHL = (0.66 ns/pF) CL + 107 ns
tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,
tPHL
VDD
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
205
110
80
410
220
160
5.0
10
15
—
—
—
175
90
65
350
180
130
5.0
10
15
—
—
—
280
140
100
560
280
200
5.0
10
15
—
—
—
300
170
110
600
340
220
5.0
10
15
—
—
—
280
140
100
560
280
200
Unit
ns
ns
ns
ns
ns
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Vout
Ein
D0
D1
Eout
Q0
Q1
D2
D3
SWITCH
MATRIX
D4
D5
VDD
Q2
ID
GS
500 µF
D6
EXTERNAL
POWER
SUPPLY
VGS = VDD
VDS = Vout
Sink Current
Ein
D0
D1
VGS = – VDD
VDS = Vout – VDD
Source Current
Output
Under
Test
D0 thru D7
Ein
D0 thru D6
D7
Ein
Eout
Q0
Q1
Q2
GS
X
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
Figure 1. Typical Sink and Source
Current Characteristics
MOTOROLA CMOS LOGIC DATA
D2
D3
D4
D5
PULSE
GENERATOR
(fo)
0.01 µF
ID
D7
Eout
CL
Q0
CL
Q1
CL
Q2
CL
D6
D7
GS
VSS
CL
Figure 2. Typical Power Dissipation Test Circuit
MC14532B
3
VDD
Eout
Ein
D0
D1
PROGRAMMABLE
PULSE
GENERATOR
CL
Q0
D2
D3
Q1
D4
D5
Q2
CL
CL
D6
CL
GS
D7
VSS
CL
NOTE: Input rise and fall times are 20 ns
PIN
NO.
D0
10
D1
11
D2
12
D3
13
D4
1
D5
2
D6
3
D7
4
Ein
5
50%
50%
50%
50%
50%
50%
Eout
15
50%
50%
50%
tPLH
tPHL
90%
50%
10%
tTHL
tPLH
tTLH
GS
Q0
14
9
tTLH
tPLH
tPLH
tPLH
tPHL
tPLH
tPHL
tPHL
tPLH
tPLH
tPHL
Q1
7
tPLH
Q2
6
tTLH
tTLH
tTLH
tPHL
90%
50%
10%
tTHL
tPHL
90%
50%
10%
tTHL
tPHL
90%
50%
10%
tTHL
tPHL
90%
50%
10%
tTHL
Figure 3. AC Test Circuit and Waveforms
MC14532B
4
MOTOROLA CMOS LOGIC DATA
LOGIC DIAGRAM
(Positive Logic)
LOGIC EQUATIONS
Eout = Ein D0 D1 D2 D3 D4 D5 D6 D7
Q0 = Ein (D1 D2 D4 D6 + D3 D4 D6 + D5 D6 + D7)
Q1 = Ein (D2 D4 D5 + D3 D4 D5 + D6 + D7)
10
D0
Q2 = Ein (D4 + D5 + D6 + D7)
GS = Ein (D0 + D1 + D2 + D3 + D4 + 05 + D6 + D7)
11
D1
9
Q0
12
D2
13
D3
1
D4
7
Q1
2
D5
3
D6
4
D7
6
Q2
5
Ein
14
GS
15
Eout
MOTOROLA CMOS LOGIC DATA
MC14532B
5
D15 D14 D13 D12 D11 D10
D7
VDD
D6
D5
D4
D3
D2
Ein
GS
Q2 Q1
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Eout
Ein
Eout = “1”
WITH Din = “0”
Eout
Q0
Q2 Q1
Q0
3/4 MC14071B
Q3
Q2
Q1
Q0
Figure 4. Two MC14532B’s Cascaded for 4–Bit Output
VDD
VSS
E
R
CLOCK
INPUT
C
DIGITAL TO ANALOG CONVERSION
The digital eight–bit word to be converted is applied to
the inputs of the MC14512 with the most significant bit at
X7 and the least significant bit at X0. A clock input of up to
2.5 MHz (at VDD = 10 V) is applied to the MC14520B.
A compromise between I bias for the MC1710 and ∆R
between N and P–channel outputs gives a value of R of
33 k ohms. In order to filter out the switching frequencies,
RC should be about 1.0 ms (if R = 33 k ohms,
C
0.03 µF). The analog 3.0 dB bandwidth would then be
dc to 1.0 kHz.
Q1
[
ANALOG TO DIGITAL CONVERSION
An analog signal is applied to the analog input of the
MC1710. A digital eight–bit word known to represent a digitized level less than the analog input is applied to the
MC14512 as in the D to A conversion. The word is incremented at rates sufficient to allow steady state to be reached
between incrementations (i.e. 3.0 ms). The output of the
MC1710 will change when the digital input represents the
first digitized level above the analog input. This word is the
digital representation of the analog word.
C
E
1/2 MC14520B
Q2
Q3
R
1/2 MC14520B
Q4
Q1
Q2
Q3
Q4
DIGITAL INPUT/OUTPUT
D0 D1 D2 D3 D4 D5 D6 D7
VDD
8–BIT WORD
TO BE CONVERTED
Ein
Q2 Q1 Q0
A
B
C
X7 X6 X5 X4 X3 X2 X1 X0
MC1710
MC14512
Z
R
ANALOG
OUTPUT
STOP
WORD
INCREMENTATION
C
ANALOG
INPUT
Figure 5. Digital to Analog and Analog to Digital Converter
MC14532B
6
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA CMOS LOGIC DATA
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14532B
7
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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INTERNET: http://Design–NET.com
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC14532B
8
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*MC14532B/D*
MOTOROLA CMOS LOGIC
DATA
MC14532B/D